MEGTRON-4

What is MEGTRON-4?

MEGTRON-4, a Panasonic MEGTRON series laminate, delivers superior thermal and electrical performance for high-end PCBs, making it ideal for high-speed and large-volume data transmission in applications like servers and routers.

Material Overview

  • Manufacturer: Panasonic Industry
  • Product Series: MEGTRON4
  • Laminate: R-5725
  • Prepreg: R-5620
  • Typical Dk @ 1 GHz: 3.83
  • Typical Df @ 1 GHz: 0.005

Characteristics

  • Excellent Mechanical Strength
  • Enhanced Thermal Resistance & Stability
  • Superior Thermal & Electrical Performance
  • Suitable for Multilayer PCBs & High Conductor Density
  • Low Dielectric Constant & Dissipation Factor (High-Speed Capable)

Applications

  • Antenna
  • Supercomputer
  • Measuring Instrument
  • ICT Infrastructure Equipment

MEGTRON-4 General Properties

Properties Units Test Method Condition Typical Value
Thermal Properties
Glass Transition Temperature (Tg) °C DSC As Received 176
TMA 170
DMA 210
Thermal Decomposition Temperature (Td) °C TGA 360
Time to Delamination (T288) Without Cu min IPC-TM-650 2.4.24.1 — >120
With Cu 30
CTE α1 X-Axis ppm/°C IPC-TM-650 2.4.24 <Tg 12–14
Y-Axis 13–15
Z-Axis 35
CTE α2 Z-Axis >Tg 265
Electrical Properties
Volume Resistivity MΩ·cm IPC-TM-650 2.5.17.1 C-96/35/90 1 × 109
Surface Resistivity MΩ 1 × 108
Dielectric Constant (Dk) — IPC-TM-650 2.5.5.9 C-24/23/50, 1 GHz 3.83
Dissipation Factor (Df) — IPC-TM-650 2.5.5.9 C-24/23/50, 1 GHz 0.005
Physical Properties
Water Absorption % IPC-TM-650 2.6.2.1 D-24/23 0.14
Peel Strength 1 oz Cu kN/m IPC-TM-650 2.4.8 As Received 1.2
Flammability Rating UL C-48/23/50 94V-0

Remarks

  1. The values shown above are provided for general PCB engineering reference and should not be treated as guaranteed specifications for finished PCBs.
  2. The listed reference data correspond to a 32 mil (0.8 mm) sample with a #3313 × 8-ply construction.
  3. MEGTRON4, R-5725, and R-5620 are Panasonic Industry material designations. Current material specifications and available constructions should be confirmed using the manufacturer’s latest technical documentation.
  4. Highleap Electronics provides PCB fabrication and PCB assembly services. For PCB manufacturing inquiries, please contact us.

Material Storage

  • R-5725 laminate and R-5620 prepreg is the same as our conventional FR-4 material.
  • Laminate should be stored flat in a cool dry environment. Avoid bending or scratching the laminate surface.
  • When possible store the laminate in the original container.
  • Prepreg should be stored flat in a cool dry controlled environment, 73℉ (23℃) or less and 50% RH or less.

Laminate Surface Preparation

  • Regular Shiny Copper can be cleaned using industry standard chemical clean or mechanical clean.
  • Reverse Treat Copper should be cleaned using industry standard chemical clean.

Inner Layer Bond Treatment

  • Black or Brown Oxide can be used.
  • Alternative Oxide Treatment using a Peroxide/Sulfuric etch technology can be also used.

Drying

  • Dry finished inner layers completely to remove any absorbed moisture or surface moisture.
  • A racked bake at 300℉ (150℃) for 1-2 hours is preferred. For conveyorized alternative oxide processing, some equipment may have sufficient drying capability. However, a racked bake is suggested.
Turnkey-PCB-Assembly-Factory

From High-Speed Stack-Up to Finished PCBA

For multilayer PCB projects involving MEGTRON4, Highleap Electronics focuses on translating the approved electrical design into a practical fabrication and assembly build. The manufacturing review connects stack-up construction, impedance requirements, via architecture, copper features, and assembly interfaces so that the bare board and final PCBA follow the same production baseline.

Signal Structure Review

Controlled-impedance traces, differential pairs, reference planes, dielectric spacing, and layer transitions are reviewed together with the approved PCB stack-up. This helps establish the fabrication parameters needed for high-speed multilayer board production.

Multilayer Build Coordination

Layer registration, drilling, plated-hole structures, lamination sequence, copper distribution, and finished board thickness are coordinated according to the actual PCB design and manufacturing documentation.

Fabrication-to-Assembly Handoff

Surface finish, panel format, component areas, soldering requirements, inspection points, and test needs are reviewed before PCBA production so that PCB fabrication and assembly requirements remain aligned.

Highleap Electronics provides multilayer PCB fabrication, controlled-impedance manufacturing, SMT/THT assembly, inspection, and testing from prototype builds through volume production. For projects involving MEGTRON4 R-5725 / R-5620, material requirements are incorporated into the approved PCB documentation before production.

Send us your Gerber files, stack-up, and BOM for PCB manufacturing review and quotation.