MEGTRON-4
What is MEGTRON-4?
MEGTRON-4, a Panasonic MEGTRON series laminate, delivers superior thermal and electrical performance for high-end PCBs, making it ideal for high-speed and large-volume data transmission in applications like servers and routers.
Characteristics
- Excellent Mechanical Strength
- Enhanced Thermal Resistance & Stability
- Superior Thermal & Electrical Performance
- Suitable for Multilayer PCBs & High Conductor Density
- Low Dielectric Constant & Dissipation Factor (High-Speed Capable)
Applications
- Antenna
- Supercomputer
- Measuring Instrument
- ICT Infrastructure Equipment
MEGTRON-4 General Properties
| Properties | Units | Test Method | Condition | Typical Value | |
|---|---|---|---|---|---|
| Thermal Properties | |||||
| Glass Transition Temp (Tg) | ℃ | DSC | As received | 176 | |
| TMA | 170 | ||||
| DMA | 210 | ||||
| Thermal Decomposition Temp (Td) | ℃ | TGA | 360 | ||
| Time to Delam (T288) | Without Cu | min | IPC TM-650 2.4.24.1 | ＞120 | |
| With Cu | 30 | ||||
| CTE: α1 | X-axis | ppm/℃ | IPC TM-650 2.4.24 | ＜Tg | 12-14 |
| Y-axis | 13-15 | ||||
| Z-axis | 35 | ||||
| CTE: α2 | Z-axis | ＞Tg | 265 | ||
| Electrical Properties | |||||
| Volume Resistivity | MΩ-cm | IPC TM-650 2.5.17.1 | C-96/35/90 | 1×10⁹ | |
| Surface Resistivity | MΩ | 1×10⁸ | |||
| Dielectric Constant (Dk) | @ 1MHz | - | IPC TM-650 2.5.5.9 | C-24/23/50 | 3.89 |
| @ 1GHz | 3.83 | ||||
| Dissipation Factor (Df) | @ 1MHz | 0.005 | |||
| @ 1GHz | 0.005 | ||||
| Physical Properties | |||||
| Water Absorption | % | IPC TM-650 2.6.2.1 | D-24/23 | 0.14 | |
| Peel Strength | 1 oz | kN/m | IPC TM-650 2.4.8 | As Received | 1.2 |
| Flammability | - | UL | C-48/23/50 | 94V-0 | |
Remarks
- The data in the above table are not guaranteed values.
- Sample thickness: 32 mil ( 0.8 ㎜ ) #3313 × 8ply
- To receive more detailed information, please feel free to contact us directly or leave your email address and we will promptly send you the relevant documents.
Material Storage
- R-5725 laminate and R-5620 prepreg is the same as our conventional FR-4 material.
- Laminate should be stored flat in a cool dry environment. Avoid bending or scratching the laminate surface.
- When possible store the laminate in the original container.
- Prepreg should be stored flat in a cool dry controlled environment, 73℉ (23℃) or less and 50% RH or less.
Laminate Surface Preparation
- Regular Shiny Copper can be cleaned using industry standard chemical clean or mechanical clean.
- Reverse Treat Copper should be cleaned using industry standard chemical clean.
Inner Layer Bond Treatment
- Black or Brown Oxide can be used.
- Alternative Oxide Treatment using a Peroxide/Sulfuric etch technology can be also used.
Drying
- Dry finished inner layers completely to remove any absorbed moisture or surface moisture.
- A racked bake at 300℉ (150℃) for 1-2 hours is preferred. For conveyorized alternative oxide processing, some equipment may have sufficient drying capability. However, a racked bake is suggested.
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