S1000-2M
What is S1000-2M?
S1000-2M is Shengyi Technology’s high-Tg FR-4 PCB material, featuring a glass transition temperature typically above 170°C.
Characteristics
- Anti-CAF Capability
- Lead-free Compatible
- Excellent Thermal Reliability
- Excellent Through-Hole Reliability
- Excellent Mechanical Process Ability
Applications
- Computer
- Communication
- Automotive Electronics
- Suitable for High Multilayer PCB
S1000-2M General Properties
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 180 | |
|
IPC-TM-650 2.4.24.4 |
DMA |
℃ |
185 | ||
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 355 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 41 | |
| After Tg | ppm/℃ | 208 | |||
| 50-260℃ | % | 2.4 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 30 | |
| T300 |
IPC-TM-650 2.4.24.1 |
TMA | min | 15 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | s | >100 | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 8.66 E+08 | |
| E-24/125 | MΩ.cm | 7.18 E+06 | |||
| Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ |
2.17 E+07 |
|
| E-24/125 | MΩ |
8.64 E+06 |
|||
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 133 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | >45 | |
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 4.6 | |
|
IPC-TM-650 2.5.5.9 |
1MHz | -- | 4.9 | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.018 | |
|
IPC-TM-650 2.5.5.9 |
1MHz | -- | 0.015 | ||
| Peel Strength (1oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
| After thermal Stress 288℃,10s | N/mm | 1.3 [7.43] | |||
| 125℃ | N/mm |
|
|||
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 567 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 442 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.08 | |
| CTI | IEC60112 | A | Rating | PLC 3 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
Remarks
- Specification sheet: lPC-4101/126, is for your reference only.
- All typical values are based on 1.6mm specimens, while Tg is for specimens ≥ 0.50mm.
- All typical values listed above are for your reference only. For detailed information, please contact Shengyi Technology Co., Ltd. All rights to this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanations: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning.
The figures following the letter symbols indicate the duration of preconditioning in hours (first digit), the preconditioning temperature in °C (second digit), and the relative humidity (third digit).
S1000-2MB Prepreg Parameters
| Glass Fabric Type | Resin Content (%) | Cured Thickness (mm) | Standard Size (Roll Type) | |
|---|---|---|---|---|
| 106/1037 | 72 | 0.050 | 1.260m×150m | |
|
77 |
0.060 |
|||
| 1080/1078 | 64 | 0.072 | 1.260m×300m | |
| 69 | 0.086 | |||
| 2313 | 56 | 0.096 | ||
| 2116 | 51 | 0.108 | 1.260m×250m | |
| 55 | 0.120 | |||
| 57 | 0.127 | |||
| 1506 | 45 | 0.150 | 1.260m×150m | |
| 7628 | 44 | 0.187 | ||
| 46 | 0.196 | |||
| 50 | 0.216 | |||
| 52 | 0.227 | |||
Hot Pressing Cycle
- The heat-up rate depends on the inner copper or the structure of multilayer PCB.
- Curing time: >60min (185~195℃).
Storage Conditions
- 3 months when stored at < 23℃ and < 50% RH.
- 6 months when stored at < 5℃. Normalize in room temperature for at least 4h before using.
- Beware of moisture, always keep wrapped in damp-proof material. Keeping in normal condition, prepreg might absorb moisture and its bonding strength would be weakened.
- Avoid UV-rays and strong light.
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