TU-933+ High-Speed PCB Material for 100G/400G Backplanes & Networking
High-speed PCB fabrication with TU-933+ laminates. Superior Dk stability and low insertion loss for demanding data center and telecom applications.
Expert PCB Manufacturing for High-Speed Applications – Including TU-933+ Materials
At Highleap Electronics, we are a full-service PCB manufacturer and assembly house, capable of handling all mainstream and advanced laminate materials—from standard FR4 to TU-933+, RO4003C, MEGTRON6, and beyond.
Our factory is equipped for rigid, HDI, RF, and multilayer PCB production, and we work with designers across industries to bring their high-speed, low-loss PCB designs to life with unmatched precision.
TU-933+ (ThunderClad 3+), developed by Taiwan Union Technology Corporation, is one of the many materials we support. It’s an excellent choice for:
- High-speed backplanes
- 5G and telecom infrastructure
- Server, storage & AI computing PCBs
- Low-loss multilayer signal transmission
No matter what material your design requires—TU-933+, TU-883, TU-872 SLK, Rogers, Taconic, or FR4—we’ll build your boards fast, right, and to spec.
Technical Specifications of TU-933+ Laminate
| Property | Value | Condition / Method |
|---|---|---|
| Tg (DMA) | 220°C | E-2/105 |
| Tg (TMA) | 170°C | E-2/105 |
| Td (TGA) | 390°C | E-2/105 |
| CTE (x/y) | 12 / 13 ppm/°C | Ambient to Tg |
| CTE z-axis (α1) | 35 ppm/°C | Pre-Tg |
| CTE z-axis (α2) | 240 ppm/°C | Post-Tg |
| CTE z-axis (%) | 2.5% | 50 to 260°C |
| Thermal Stress (288°C) | > 120 sec | Solder Float |
| T260 / T288 / T300 | > 60 min (each) | E-2/105 |
| Flammability | 94V-0 | E-24/125 |
| Permittivity (Dk) | 3.08 @ 10 GHz | SPC method (RC70%) |
| Simulated Dk | 2.54 | Impedance Simulation |
| Loss Tangent (Df) | 0.0020 @ 10 GHz | SPC method |
| Volume Resistivity | > 10¹⁰ MΩ·cm | C-96/35/90 |
| Surface Resistivity | > 10⁸ MΩ | C-96/35/90 |
| Electric Strength | > 40 kV/mm | A |
| Dielectric Breakdown | > 50 kV | A |
| Young’s Modulus | 23 GPa (Warp), 21 GPa (Fill) | A |
| Flexural Strength | > 60,000 psi (L) / >50,000 psi (W) | A |
| Peel Strength (1 oz Cu) | 4–7 lb/in | A |
| Moisture Absorption | 0.06% | E-1/105 + D-24/23 |
NOTE
1. All technical values shown above for TU-933+ (ThunderClad 3+) laminates are typical properties published by Taiwan Union Technology Corporation (TUC) and are provided strictly for engineering reference. Actual performance may vary depending on your specific PCB layout, layer configuration, via design, and manufacturing process.
2. At Highleap Electronics, we use only authentic TU-933+ laminates sourced directly from TUC-approved channels, ensuring quality and traceability in every production run.
3. Need help with TU-933+ PCB stackup planning, material selection, or want to request the official TU-933 datasheet (PDF)?
Our engineers are here to assist you with:
- Low-loss PCB material comparison
- TU-933+ impedance modeling & stackup optimization
- Advice on mixing TU-933+ with FR4 or other substrates
- Fast, professional quotes for full turnkey fabrication and assembly
Contact Highleap Electronics today to get expert support for your TU-933+ high-speed PCB project.
Why Engineers Choose TU-933+ for High-Speed, Low-Loss PCB Projects
While we support all types of PCB substrates, we often recommend TU-933+ laminates for customers working with high-speed signals, especially those designing for 10G, 25G, or 56G bandwidths.
TU-933+ key features include:
- Dk 3.08 ±2%, Df 0.0020 @ 10 GHz – ideal for maintaining signal integrity
- Low z-axis expansion – ensures reliable vias in multilayer stackups
- High CAF resistance – supports long-term reliability in harsh environments
- Compatible with conventional lamination processes – helping reduce costs
These properties make TU-933+ a cost-effective alternative to ultra-premium materials like MEGTRON6 or RO4835 for many telecom, datacom, server, and industrial RF applications.
At Highleap, we offer free stackup consulting and help customers decide whether TU-933+ or another material is the best fit for their performance, cost, and manufacturing needs.
Complete PCB Fabrication & Assembly Services — Not Limited to TU-933+
Highleap Electronics is more than a TU-933+ PCB manufacturer—we’re your full-service partner for everything from 2-layer FR4 prototypes to advanced 60-layer HDI and multilayer PCBs.
When it comes to TU-933+ and other high-speed materials, our services include:
- Precise impedance control (±5%) for differential pairs & RF lines
- HDI board processing with microvias, via-in-pad, and via plugging
- Complex multilayer stackups with hybrid materials (e.g., TU-933+ + FR4)
- Surface finishes including ENIG, ENEPIG, hard gold, OSP
- Full turnkey SMT assembly, including BGA, QFN, 01005, RF shield placement
- Rigorous QA testing: AOI, X-ray, functional tests, and flying probe
We only use genuine TU-933+ laminates from TUC, and every build is backed by IPC Class 2/3 standards for reliability and consistency.
Whether your project uses TU-933+, RO4350B, Isola, or FR4—Highleap Electronics has the experience and infrastructure to deliver.
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