RO4003C Laminates for 5G, Radar, and Wireless PCB Design
Discover Rogers RO4003C PCB laminates ideal for RF and high-speed designs. Highleap offers fast, cost-effective fabrication and PCBA services.
RO4003C High Frequency PCB Material for Reliable RF and Microwave Applications
Highleap Electronics offers high-performance PCB fabrication and assembly services using Rogers RO4003C laminates, engineered for demanding RF, microwave, and high-speed digital circuits.
RO4003C delivers low dielectric loss, stable Dk over frequency and temperature, and a Tg above 280°C, making it ideal for high-reliability applications. Unlike PTFE-based materials, it is compatible with standard FR4 processes, enabling faster and more cost-effective production.
Its low Z-axis CTE ensures excellent plated through-hole reliability, and the LoPro® copper foil option further reduces insertion loss for broadband designs.
Explore the full technical data of RO4003C in the table below — including dielectric performance, thermal behavior, and mechanical strength — to ensure your design meets all high-frequency requirements.
RO4000 Laminates RO4003C and RO4350B – Data Sheet
| Item | Method | Condition | Unit | RO4003C | RO4350B |
|---|---|---|---|---|---|
| Dielectric Constant (Process) | IPC-TM-650 2.5.5.5 | 10 GHz / 23°C | – | 3.38 ± 0.05 | 3.48 ± 0.05 |
| Dielectric Constant (Design) | Differential Phase Length Method | 8–40 GHz | – | 3.55 | 3.66 |
| Dissipation Factor (10GHz) | IPC-TM-650 2.5.5.5 | 10 GHz / 23°C | – | 0.0027 | 0.0037 |
| Dissipation Factor (2.5GHz) | IPC-TM-650 2.5.5.5 | 2.5 GHz / 23°C | – | 0.0021 | 0.0031 |
| Thermal Coefficient of Er | IPC-TM-650 2.5.5.5 | –50°C to +150°C | ppm/°C | +40 | +50 |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | COND A | MΩ·cm | 1.7 × 10¹⁰ | 1.2 × 10¹⁰ |
| Surface Resistivity | IPC-TM-650 2.5.17.1 | COND A | MΩ | 4.2 × 10⁹ | 5.7 × 10⁹ |
| Electrical Strength | IPC-TM-650 2.5.6.2 | 0.51mm (0.020″) | kV/mm | 31.2 (780 V/mil) | 31.2 (780 V/mil) |
| Tensile Modulus (X) | ASTM D638 | RT | MPa (ksi) | 19,650 (2,850) | 16,767 (2,432) |
| Tensile Modulus (Y) | ASTM D638 | RT | MPa (ksi) | 19,450 (2,821) | 14,153 (2,053) |
| Tensile Strength (X) | ASTM D638 | RT | MPa (ksi) | 139 (20.2) | 203 (29.5) |
| Tensile Strength (Y) | ASTM D638 | RT | MPa (ksi) | 100 (14.5) | 130 (18.9) |
| Flexural Strength | IPC-TM-650 2.4.4 | – | MPa (kpsi) | 276 (40) | 255 (37) |
| Dimensional Stability | IPC-TM-650 2.4.39A | After Etch +E2/150°C | mm/m | <0.3 | <0.5 |
| CTE (X/Y/Z) | IPC-TM-650 2.4.41 | –55 to +288°C | ppm/°C | 11 / 14 / 46 | 10 / 12 / 32 |
| Tg (Glass Transition Temp) | IPC-TM-650 2.4.24.3 | TMA | °C | >280 | >280 |
| Td (Decomposition Temp) | ASTM D3850 | TGA | °C | 425 | 390 |
| Thermal Conductivity | ASTM C518 | 80°C | W/m·K | 0.71 | 0.69 |
| Moisture Absorption | ASTM D570 | 48hr immersion at 50°C | % | 0.06 | 0.06 |
| Density | ASTM D792 | 23°C | g/cm³ | 1.79 | 1.86 |
| Peel Strength | IPC-TM-650 2.4.8 | After solder float, 1oz EDC | N/mm (pli) | 1.05 (6.0) | 0.88 (5.0) |
| Flammability | UL 94 | – | – | N/A | V-0 |
| Lead-Free Process Compatible | – | – | – | Yes | Yes |
Notes and Further Information
(1) RO4350B 4 mil laminates have a process dielectric constant (Dk) of 3.33 ± 0.05 and comply with IPC-4103A/240. All other RO4350B thicknesses meet IPC-4103 /11 and /240 specifications.
(2) Design Dk values are averaged from multiple test batches based on the most common laminate thicknesses.
(3) RO4350B LoPro® laminates may not share the same UL rating as standard RO4350B materials and may require a separate UL qualification.
All technical data on this page is sourced from Rogers Corporation.
For the official PDF datasheet, or if you plan to use RO4003C or RO4350B materials for PCB manufacturing and assembly, please feel free to contact Highleap Electronics. Our engineering team will be glad to assist you with material selection, stackup guidance, and production support.
Why Choose Highleap for RO4003C PCB Manufacturing
Choosing the right material is only the first step. At Highleap Electronics, we bring your RO4003C designs to life with precision, speed, and engineering support that makes a difference.
✔ Our Advantages:
- 15+ Years in RF and High-Frequency PCB Manufacturing
- Tight Impedance Control for RF/microwave and differential pair circuits
- Multilayer PCB capability including hybrid stackups with RO4003C + FR4
- 0.075mm laser drilling, high aspect-ratio plating, and fine trace/space
- In-house SMT assembly, BGA placement, and reflow for high-frequency boards
- Engineering support on stackup design, impedance simulation, and material selection
- Fast lead times with one-on-one technical support for prototypes to volume production
Whether you’re developing 5G infrastructure, radar sensors, or satellite RF modules, our team ensures your RO4003C-based PCB meets both design intent and production quality.
RO4003C PCB Manufacturing and Assembly
At Highleap Electronics, we offer complete PCB fabrication and assembly solutions tailored to your project requirements—whether you’re working with Rogers RO4003C, other high-frequency laminates, or standard FR4 materials.
Our team is experienced in handling a wide range of PCB substrates and stack-up combinations, ensuring reliable performance in RF, microwave, high-speed digital, and power applications.
🛠 Our Services Include:
- Quick-turn PCB prototyping using RO4003C and other advanced laminates
- Multilayer stackups with hybrid materials (e.g., RO4003C + FR4, PTFE, or high-Tg FR4)
- Controlled impedance fabrication with ±5% tolerance
- Heavy copper and thermal management options for power boards
- RoHS-compliant lead-free processing for global compliance
- Turnkey PCBA services, including component sourcing, BGA/X-ray inspection, and functional testing
With strong expertise in high-frequency materials and precision manufacturing, we help engineers minimize development risk, accelerate time-to-market, and maintain signal integrity across all performance levels—from telecom to automotive, industrial to aerospace.
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