ST115 Thermal Conductive PCB Laminate for LED, Power & Auto

Explore ST115 thermal PCB laminates for LED, power, and automotive circuits. Highleap Electronics offers PCB manufacturing with customer-specified materials.

 

 

 

 

High thermal conductivity PCB

ST115 for Thermal-Management PCB Manufacturing

ST115 is a PCB laminate product from Shengyi Technology that may be referenced in board designs where thermal management is an important part of the overall PCB requirement. In a finished circuit board, heat transfer is influenced not only by the laminate, but also by copper weight, layer structure, board thickness, via design, component layout, and operating conditions.

For LED lighting, power electronics, automotive electronics, industrial controls, and other heat-generating PCB assemblies, these design factors should be evaluated together when defining the final board construction. Material properties should be considered as part of the complete electrical, mechanical, thermal, and manufacturing requirements of the project.

Highleap Electronics manufactures and assembles PCBs and does not manufacture ST115 laminate. Our engineering work focuses on PCB stack-up review, copper construction, thermal-via arrangements, heavy-copper requirements, routing, surface finish, and assembly planning from prototype through production.

The technical data below can be used for preliminary PCB engineering reference. Current ST115 material properties, available constructions, and qualification information should be confirmed against the latest documentation issued by Shengyi Technology.

ST115 Material Properties & Technical Specifications

The following properties are extracted from Shengyi official datasheet. For stackup planning or IPC class builds, please consult our engineering team.

Test Item Treatment Condition Unit Typical Value
Tg DMA °C 150
Td 10°C/min, N₂, 5% Weight Loss °C 350
T-288 TMA min >60
T-300 TMA min >20
CTE Z-Axis (<Tg) TMA ppm/°C 39
CTE Z-Axis (>Tg) TMA ppm/°C 217
CTE Z-Axis (50–260°C) TMA % 3.0
Peel Strength 1 oz Cu Foil / A N/mm 1.20
Thermal Stress Unetched, 300°C / 20 s No Delamination
Dielectric Strength D-48/50 + D-0.5/23 kV/mm >35
Arc Resistance D-48/50 + D-0.5/23 s >170
Hi-Pot Test (VDC) V 3000
Hi-Pot Test (VAC) V 1500
Surface Resistance After Moisture Resistance 9.61 × 108
Surface Resistance E-24/125 2.43 × 106
Volume Resistivity After Moisture Resistance MΩ·cm 6.59 × 108
Volume Resistivity E-24/125 MΩ·cm 4.39 × 107
Dielectric Constant (Dk) C-24/23/50, 1 MHz 5.2
Dielectric Constant (Dk) C-24/23/50, 1 GHz 4.8
Dissipation Factor (Df) C-24/23/50, 1 MHz 0.010
Dissipation Factor (Df) C-24/23/50, 1 GHz 0.012
Comparative Tracking Index (CTI) IEC 60112 V 600
Flammability UL 94 Rating V-0
Thermal Conductivity ASTM E1461-01 W/m·K 1.5

NOTE

  • ST115 is a laminate product of Shengyi Technology. The technical values shown above are provided for general PCB engineering reference only; current material specifications and documentation should be confirmed with the material manufacturer.
  • Highleap Electronics is a PCB manufacturing and PCB assembly factory. We manufacture finished PCBs and PCBAs based on approved drawings, stack-ups, material requirements, and production documentation, and do not manufacture ST115 laminate.

Best Applications for ST115 in LED, Automotive, and Power Electronics

Typical Applications for ST115-Based PCBs:

  • High-brightness LED modules with aluminum or FR-4 core
  • DC-DC converter PCBs and MOSFET driver circuits
  • Automotive radar, camera, ADAS modules with tight thermal budgets
  • Power electronics and battery interface boards in EVs
  • Industrial control systems with high-current or high-voltage demands

But ST115 is just one of many advanced laminates we support. Highleap Electronics processes PCBs using materials from top suppliers like Shengyi, ITEQ, Panasonic, Doosan, and Ventec. We help customers match the right laminate to:

  • Thermal conductivity targets (1.0–5.0 W/m·K)
  • Dielectric constant & impedance control
  • Mechanical strength and via reliability
  • Regulatory or UL compliance (V-0, CTI, etc.)
Turnkey-PCB-Assembly-Factory

PCB Manufacturing & Assembly for ST115 Projects

Highleap Electronics provides PCB fabrication and PCB assembly services for projects involving ST115 and other thermal-management PCB materials. Our engineering team reviews the complete board design, stack-up, copper construction, fabrication requirements, and assembly documentation before production.

Our PCB manufacturing services include:

  • DFM and PCB stack-up review
  • Multilayer, HDI, and heavy-copper PCB fabrication
  • Controlled-impedance, drilling, plating, and surface finishing
  • SMT/THT assembly, programming, inspection, and testing
  • Prototype, small-batch, and volume PCB production

Highleap Electronics manufactures finished PCBs and PCBAs rather than laminate materials. Material requirements and final PCB construction are confirmed according to the approved project documentation before production.

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