ST115 Thermal Conductive PCB Laminate for LED, Power & Auto
Explore ST115 thermal PCB laminates for LED, power, and automotive circuits. Highleap Electronics offers PCB manufacturing with customer-specified materials.
Engineered for Efficient Heat Dissipation and Electrical Reliability
ST115 is designed to deliver stable thermal performance in PCB applications where heat management is essential. With a thermal conductivity of 1.5 W/m·K and low Z-axis expansion (CTE z @ Tg: 39 ppm/°C), it helps reduce thermal stress in components and interconnects, ensuring longer product life in high-power and high-reliability environments.
This laminate is widely used in LED lighting units, power converters, automotive control systems, and industrial drivers, offering excellent dielectric strength (>35 kV/mm) and peel strength even after thermal aging.
Highleap Electronics provides full-stack manufacturing support for ST115-based boards — including stackup optimization, heavy copper plating, thermal simulation, and precision routing — helping you build better thermal PCBs from prototype to production.
To understand whether ST115 matches your technical and reliability requirements, explore its full material specifications below.
ST115 Material Properties & Technical Specifications
The following properties are extracted from Shengyi’s official datasheet. For stackup planning or IPC class builds, please consult our engineering team.
| Test Item | Treatment Condition | Unit | Property Data (Typical Value) |
|---|---|---|---|
| Tg | DMA | ℃ | 150 |
| Td | 10℃/min, N₂, 5% Wt Loss | ℃ | 350 |
| T288 | TMA | min | >60 |
| T300 | TMA | min | >20 |
| CTE Z-axis (<Tg) | TMA | ppm/°C | 39 |
| CTE Z-axis (>Tg) | TMA | ppm/°C | 217 |
| CTE Z-axis (50–260℃) | TMA | % | 3.0 |
| Peel Strength | 1oz Cu. Foil / A | N/mm | 1.20 |
| Thermal Stress | Unetched 300℃, 20s | – | No De-lamination |
| Dielectric Strength | D-48/50 + D-0.5/23 | kV/mm | >35 |
| Arc Resistance | D-48/50 + D-0.5/23 | s | >170 |
| Hi-pot Test (VDC) | – | V | 3000 |
| Hi-pot Test (VAC) | – | V | 1500 |
| Surface Resistance | After Moisture Resistance | MΩ | 9.61E+08 |
| Surface Resistance | E-24/125 | MΩ | 2.43E+06 |
| Volume Resistance | After Moisture Resistance | MΩ·cm | 6.59E+08 |
| Volume Resistance | E-24/125 | MΩ·cm | 4.39E+07 |
| Dielectric Constant | C-24/23/50, 1MHz | – | 5.2 |
| Dielectric Constant | C-24/23/50, 1GHz | – | 4.8 |
| Dissipation Factor | C-24/23/50, 1MHz | – | 0.010 |
| Dissipation Factor | C-24/23/50, 1GHz | – | 0.012 |
| CTI | IEC60112 Method | V | 600 |
| Flammability | UL-94 | Class | V-0 |
| Thermal Conductivity | ASTM E1461-01 | W/m·K | 1.5 |
NOTE
- Material data provided above is sourced from the ST115 datasheet and is for reference only. Performance may vary depending on board structure, copper weight, and manufacturing process.
- Highleap Electronics is not limited to any single material brand or type. We offer full-process PCB manufacturing using customer-specified laminates, and can suggest qualified alternatives where needed. Our facilities are certified for IPC Class 2/3 and support both domestic and global material supply chains.
Best Applications for ST115 in LED, Automotive, and Power Electronics
Typical Applications for ST115-Based PCBs:
- High-brightness LED modules with aluminum or FR-4 core
- DC-DC converter PCBs and MOSFET driver circuits
- Automotive radar, camera, ADAS modules with tight thermal budgets
- Power electronics and battery interface boards in EVs
- Industrial control systems with high-current or high-voltage demands
But ST115 is just one of many advanced laminates we support. Highleap Electronics processes PCBs using materials from top suppliers like Shengyi, ITEQ, Panasonic, Doosan, and Ventec. We help customers match the right laminate to:
- Thermal conductivity targets (1.0–5.0 W/m·K)
- Dielectric constant & impedance control
- Mechanical strength and via reliability
- Regulatory or UL compliance (V-0, CTI, etc.)
PCB Manufacturing with ST115 and Other Thermal Materials
Whether you’re evaluating ST115 for a high-power lighting board or comparing multiple materials for a thermal stackup, Highleap Electronics is here to help.
We offer:
- Free DFM and stackup review for all PCB builds
- Material-based quoting (you specify the laminate; we match processing)
- HDI, heavy copper, and hybrid material support (e.g. ST115 + FR4)
- SMT stencil, programming, and turnkey assembly
We serve customers from prototyping to mass production, always prioritizing reliability, traceability, and manufacturability.
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