ST115 Thermal Conductive PCB Laminate for LED, Power & Auto
Explore ST115 thermal PCB laminates for LED, power, and automotive circuits. Highleap Electronics offers PCB manufacturing with customer-specified materials.
ST115 for Thermal-Management PCB Manufacturing
ST115 is a PCB laminate product from Shengyi Technology that may be referenced in board designs where thermal management is an important part of the overall PCB requirement. In a finished circuit board, heat transfer is influenced not only by the laminate, but also by copper weight, layer structure, board thickness, via design, component layout, and operating conditions.
For LED lighting, power electronics, automotive electronics, industrial controls, and other heat-generating PCB assemblies, these design factors should be evaluated together when defining the final board construction. Material properties should be considered as part of the complete electrical, mechanical, thermal, and manufacturing requirements of the project.
Highleap Electronics manufactures and assembles PCBs and does not manufacture ST115 laminate. Our engineering work focuses on PCB stack-up review, copper construction, thermal-via arrangements, heavy-copper requirements, routing, surface finish, and assembly planning from prototype through production.
The technical data below can be used for preliminary PCB engineering reference. Current ST115 material properties, available constructions, and qualification information should be confirmed against the latest documentation issued by Shengyi Technology.
ST115 Material Properties & Technical Specifications
The following properties are extracted from Shengyi official datasheet. For stackup planning or IPC class builds, please consult our engineering team.
| Test Item | Treatment Condition | Unit | Typical Value |
|---|---|---|---|
| Tg | DMA | °C | 150 |
| Td | 10°C/min, N₂, 5% Weight Loss | °C | 350 |
| T-288 | TMA | min | >60 |
| T-300 | TMA | min | >20 |
| CTE Z-Axis (<Tg) | TMA | ppm/°C | 39 |
| CTE Z-Axis (>Tg) | TMA | ppm/°C | 217 |
| CTE Z-Axis (50–260°C) | TMA | % | 3.0 |
| Peel Strength | 1 oz Cu Foil / A | N/mm | 1.20 |
| Thermal Stress | Unetched, 300°C / 20 s | — | No Delamination |
| Dielectric Strength | D-48/50 + D-0.5/23 | kV/mm | >35 |
| Arc Resistance | D-48/50 + D-0.5/23 | s | >170 |
| Hi-Pot Test (VDC) | — | V | 3000 |
| Hi-Pot Test (VAC) | — | V | 1500 |
| Surface Resistance | After Moisture Resistance | MΩ | 9.61 × 108 |
| Surface Resistance | E-24/125 | MΩ | 2.43 × 106 |
| Volume Resistivity | After Moisture Resistance | MΩ·cm | 6.59 × 108 |
| Volume Resistivity | E-24/125 | MΩ·cm | 4.39 × 107 |
| Dielectric Constant (Dk) | C-24/23/50, 1 MHz | — | 5.2 |
| Dielectric Constant (Dk) | C-24/23/50, 1 GHz | — | 4.8 |
| Dissipation Factor (Df) | C-24/23/50, 1 MHz | — | 0.010 |
| Dissipation Factor (Df) | C-24/23/50, 1 GHz | — | 0.012 |
| Comparative Tracking Index (CTI) | IEC 60112 | V | 600 |
| Flammability | UL 94 | Rating | V-0 |
| Thermal Conductivity | ASTM E1461-01 | W/m·K | 1.5 |
NOTE
- ST115 is a laminate product of Shengyi Technology. The technical values shown above are provided for general PCB engineering reference only; current material specifications and documentation should be confirmed with the material manufacturer.
- Highleap Electronics is a PCB manufacturing and PCB assembly factory. We manufacture finished PCBs and PCBAs based on approved drawings, stack-ups, material requirements, and production documentation, and do not manufacture ST115 laminate.
Best Applications for ST115 in LED, Automotive, and Power Electronics
Typical Applications for ST115-Based PCBs:
- High-brightness LED modules with aluminum or FR-4 core
- DC-DC converter PCBs and MOSFET driver circuits
- Automotive radar, camera, ADAS modules with tight thermal budgets
- Power electronics and battery interface boards in EVs
- Industrial control systems with high-current or high-voltage demands
But ST115 is just one of many advanced laminates we support. Highleap Electronics processes PCBs using materials from top suppliers like Shengyi, ITEQ, Panasonic, Doosan, and Ventec. We help customers match the right laminate to:
- Thermal conductivity targets (1.0–5.0 W/m·K)
- Dielectric constant & impedance control
- Mechanical strength and via reliability
- Regulatory or UL compliance (V-0, CTI, etc.)
PCB Manufacturing & Assembly for ST115 Projects
Highleap Electronics provides PCB fabrication and PCB assembly services for projects involving ST115 and other thermal-management PCB materials. Our engineering team reviews the complete board design, stack-up, copper construction, fabrication requirements, and assembly documentation before production.
Our PCB manufacturing services include:
- DFM and PCB stack-up review
- Multilayer, HDI, and heavy-copper PCB fabrication
- Controlled-impedance, drilling, plating, and surface finishing
- SMT/THT assembly, programming, inspection, and testing
- Prototype, small-batch, and volume PCB production
Highleap Electronics manufactures finished PCBs and PCBAs rather than laminate materials. Material requirements and final PCB construction are confirmed according to the approved project documentation before production.
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