AD300D
What is AD300D?
AD300D is a laminate material designed to deliver a precisely controlled dielectric constant (Dk), minimal signal loss, and an exceptional passive intermodulation (PIM) response. Built on a PTFE resin foundation, it seamlessly integrates with conventional PTFE manufacturing processes while offering a budget-friendly solution that enhances both electrical and mechanical performance.
Features
- Low loss tangent of .0021 at 10 GHz
- Well controlled Dk of 2.94+/-0.05
- Good thermal conductivity of 0.37 W/m-K at 100°C
- Low PIM of -159dBC at 30mils
- Larger Panel Sizes Available
Benefits
- Wide range of application use
- Improved power handling
- Low loss, higher antenna efficiency
- Maintains mechanical form during handling
Applications
- Antenna Systems
- Antennas
- Carrier-Grade Wi-Fi / Licensed Assisted Access
- Communications Systems
- Telematics and Infotainment
AD300D Series General Properties
| Properties | Typical Value¹ | Units | Test Conditions | Test Method | |||
|---|---|---|---|---|---|---|---|
| AD300D | AD350A | ||||||
| Electrical Properties | |||||||
| Dielectric Constant (process) | 2.97 | 3.54 | - | 23˚C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 | |
| Dielectric Constant (design) | 2.94 | 3.50 | - | C-24/23/50 | 10 GHz | Microstrip Differential Phase Length | |
| Dissapation Factor | 0.0021 | 0.0033 | - | 23˚C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 | |
| Thermal Coefficient of Dielectric Constant | -73 | -57 | ppm/˚C | 0 to 100˚C | 10 GHz | IPC TM-650 2.5.5.5 | |
| Volume Resistivity |
|
|
MΩ-cm | C96/35/90 | - | IPC TM-650 2.5.17.1 | |
| Surface Resistivity |
|
|
MΩ | C96/35/90 | - | IPC TM-650 2.5.17.1 | |
| Electrical Strength (dielectric strength) | 750 | 671 | V/mil | - | - | IPC TM-650 2.5.6.2 | |
| Dielectric Breakdown | 46 | 33 | kV | D-48/50 | X/Y direction | IPC TM-650 2.5.6 | |
| PIM² | -159/-163 | -159/-163 | dBc | Reflected 43 dBm swept tones at 1900 MHz, S1/S1 | Rogers Internal 50 ohm | ||
| Thermal Properties | |||||||
| Decomposition Temperature (Td) | ＞500 | ＞500 | ˚C | 2hrs @ 105˚C | 5% Weight Loss | IPC TM-650 2.3.40 | |
| Coefficient of Thermal Expansion - x | 24 | 18 | ppm/˚C | -55 to 288˚C | IPC TM-650 2.4.41 | ||
| Coefficient of Thermal Expansion - y | 23 | 18 | |||||
| Coefficient of Thermal Expansion - z | 98 | 63 | |||||
| Thermal Conductivity | 0.37 | 0.44 | W/(m.K) | - | z direction | ASTM D5470 | |
| Time to Delamination | ＞60 | ＞60 | minutes | as-received | 288˚C | IPC TM-650 2.4.24.1 | |
| Mechanical Properties | |||||||
| Copper Peel Strength |
2.6 (14.8) |
2.4 (13.6) |
N/mm (lbs/in) | 10s @288˚C | 35 μm foil | IPC TM-650 2.4.8 | |
| Flexural Strength (MD/CMD) |
152.4/127.6 (22.1/18.5) |
97.9/62.1 (14.2/9.0) |
MPa (ksi) | 25°C ± 3°C | - | ASTM D790 | |
| Tensile Strength (MD, CMD) |
122.0/120.7 (17.7/17.5) |
97.9/46.2 (14.2/6.7) |
MPa (ksi) | 23˚C @ 50% RH | - | IASTM D3039/D3039-14 | |
| Flex Modulus |
10,400/9,580 (1510/1390) |
12,652/10,128 (1,835/1,469) |
MPa (ksi) | 25°C ± 3°C | - | IPC-TM-650 2.4.4 | |
| Dimensional Stability (MD, CMD) | -0.08/0.02 | 0.15/0.17 | mils/inch | after etch + bake | - | IPC-TM-650 2.4.39a | |
| Physical Properties | |||||||
| Flammability | V-0 | V-0 | - | - | - | UL 94 | |
| Moisture Absorption | 0.04 | 0.1 | % | E1/105 +D48/50 | - | IPC TM-650 2.6.2.1 | |
| Density | 2.23 | 2.43 | g/cm³ | C24/23/50 | - | ASTM D792 | |
| Specifc Heat Capacity | 0.80 | 0.757 | J/g/K | 2 hours at 105˚C | - | ASTM E2716 | |
Remarks
- Typical values are a representation of an average value for the population of the property.
- PIM Performance is heavily influenced by the copper choice. PIM values provided are typical values based on testing of the S1 foil using Rogers’ internal test method on 0.030” thick and 0.060” thick laminates.
- To receive more detailed information, please feel free to contact us directly or leave your email address and we will promptly send you the relevant documents.
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