TLY-5 High-Frequency PCB Manufacturing & Assembly

Highleap Electronics provides TLY-5 PCB manufacturing and assembly for RF, microwave, radar and mmWave designs using controlled high-frequency PCB fabrication processes.

PTFE PCB

What Is TLY-5?

TLY-5 is a woven-glass-reinforced PTFE laminate currently offered by AGC for high-frequency and microwave circuit applications. The material combines a low dielectric constant with a very low dissipation factor, making it relevant to PCB designs where transmission loss, impedance behavior, and RF performance are important considerations.

Highleap Electronics manufactures and assembles PCBs for projects that specify TLY-5. Our role is PCB fabrication and PCBA production rather than laminate manufacturing, with engineering attention focused on the stack-up, RF geometry, drilling, plating, surface finish, and assembly requirements of the finished board.

Material Overview

  • Current Manufacturer: AGC
  • Product: TLY-5
  • Material Family: Woven-Glass-Reinforced PTFE
  • Typical Dk @ 10 GHz: 2.20 ± 0.02
  • Typical Df @ 10 GHz: 0.0009
  • Designed for High-Frequency PCB Applications

PCB-Relevant Characteristics

  • Very Low Dielectric Loss
  • Low Dielectric Constant
  • Low Moisture Absorption
  • Woven-Glass Dimensional Reinforcement
  • Suitable for Microwave and mmWave Circuits
  • Available in Multiple Laminate Thicknesses

    TLY-5 Technical Properties for PCB Engineering Reference

    The following values summarize selected TLY-5 properties relevant to high-frequency PCB design and fabrication. They are material reference values rather than specifications for finished Highleap PCBs.

    Property Typical Value Unit Test Method
    Dielectric Constant (Dk) @ 10 GHz 2.20 ± 0.02 — IPC-650 2.5.5.5
    Dissipation Factor (Df) @ 10 GHz 0.0009 — IPC-650 2.5.5.5
    Thermal Conductivity 0.22 W/m·K ASTM F433
    CTE X / Y / Z (25–260°C) 26 / 15 / 217 ppm/°C ASTM D3386 (TMA)
    Moisture Absorption 0.02 % IPC-650 2.6.2.1
    Volume Resistivity 1 × 1010 MΩ·cm IPC-650 2.5.17.1
    Surface Resistivity 1 × 108 MΩ IPC-650 2.5.17.1
    Density 2.19 g/cm³ ASTM D792
    Flammability V-0 Rating UL 94

    Remarks

    1. The values above are typical material reference data and should not be interpreted as guaranteed specifications for finished PCBs.
    2. Electrical and mechanical results can depend on laminate thickness, copper construction, processing conditions, and test method.
    3. TLY-5 is currently offered by AGC. Refer to the material manufacturer’s latest technical documentation for current specifications, available thicknesses, copper options, and qualification information.

    TLY-5 PCB Applications in RF, Microwave, Radar & Communication Systems

    TLY-5 PCBs are primarily considered for RF, microwave, and millimeter-wave electronics where dielectric loss and transmission-line behavior are important parts of the circuit design. The material is currently offered by AGC and is used in high-frequency applications ranging from automotive radar and communication hardware to aerospace and microwave front-end circuits.

    For these applications, the laminate is only one element of the RF signal path. The finished PCB also depends on transmission-line geometry, dielectric thickness, copper profile, plated features, ground structures, connectors, transitions, and surface finish. These factors should be evaluated together when converting an RF design into a manufacturable PCB.

    • Automotive Radar PCBs:
      TLY-5 can be considered for radar circuits operating around 77 GHz and other millimeter-wave frequencies. PCB fabrication for these designs requires close attention to RF trace geometry, conductor features, registration, and transitions between transmission lines and components.
    • Satellite & Cellular Communication:
      High-frequency communication equipment may use TLY-5 in antenna feeds, RF distribution networks, transmitter and receiver sections, and related microwave circuitry where low dielectric loss is part of the electrical requirement.
    • RF Power Amplifier PCBs:
      Power-amplifier circuits combine RF transmission requirements with component, grounding, copper, and thermal-layout considerations. The final PCB construction should therefore be developed around both the laminate specification and the complete amplifier design.
    • LNB, LNA & Microwave Front-End Circuits:
      Low-noise and frequency-conversion assemblies often contain short, impedance-sensitive RF paths. Controlled transmission lines, via placement, grounding structures, component transitions, and assembly interfaces become important manufacturing considerations.
    • Ka-, E- & W-Band PCB Designs:
      At higher microwave and millimeter-wave frequencies, relatively small changes in PCB geometry can become increasingly significant. Fabrication drawings should clearly define the required stack-up, copper construction, critical dimensions, and RF features.
    • Aerospace RF Electronics:
      TLY-5 may also be specified for aerospace communication, antenna, and RF electronic assemblies. Actual PCB requirements depend on the equipment design, operating environment, mechanical construction, and applicable qualification requirements.

    Highleap Electronics provides TLY-5 PCB manufacturing and PCB assembly services for RF, microwave, millimeter-wave, radar, antenna, and communication projects. We manufacture from the released PCB documentation, including the approved material grade, stack-up, controlled-impedance requirements, drill data, mechanical drawing, and assembly files.

    For high-frequency PCB projects, final electrical performance should be evaluated at the complete circuit and system level rather than inferred from laminate properties alone.

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    Preparing a TLY-5 PCB Project for Production

    For a TLY-5 PCB quotation, provide the material designation together with the fabrication data that defines the finished board. This allows the manufacturing review to focus on the actual RF construction rather than relying on the laminate name alone.

    • Gerber or ODB++ fabrication files
    • PCB stack-up and required TLY-5 thickness
    • Copper weight and finished copper requirements
    • Controlled-impedance targets and tolerances
    • Via, plated-hole, backdrill, or multilayer requirements
    • Surface finish and mechanical drawing
    • BOM, pick-and-place files, and assembly drawings for PCBA orders

    Highleap Electronics provides high-frequency PCB manufacturing and PCB assembly services for TLY-5, PTFE, RF/microwave, controlled-impedance, and multilayer PCB projects. Material availability and the final board construction are confirmed against the approved project documentation before production.

    Submit your TLY-5 PCB files for manufacturing review and quotation