FR-4 High Tg KB-6167 for Multilayer PCB Production
High Tg FR-4 laminate KB-6167 for reliable, multilayer PCB manufacturing and assembly. In-stock at Highleap with full fabrication and PCBA services.
KB-6167 High-Tg FR-4 Laminate – One of Our Standard Materials for Multilayer PCB Builds
As part of Highleap Electronics’ standard laminate offering, KB-6167 is a high-Tg (175°C) FR-4 material optimized for multilayer PCB fabrication and assembly. It delivers excellent thermal stability, low Z-axis expansion, and strong CAF resistance—critical properties for achieving high reliability in demanding applications.
With proven performance under lead-free soldering conditions and reflow cycles, KB-6167 ensures stable dielectric properties and mechanical strength throughout thermal processing. It is widely used across automotive control systems, telecom infrastructure, industrial modules, and power electronics where durability and electrical integrity are essential.
At Highleap, KB-6167 is one of several carefully selected laminates we keep in stock to support fast, consistent, and high-quality PCB production. Whether for rigid boards or complex multilayer assemblies, it helps ensure a smooth path from design to finished product.
KB-6167 Technical Data Sheets
| Test Item | Unit | Test Method | Test Condition | Specification | Typical Value |
|---|---|---|---|---|---|
| Peel Strength (1 oz.) | N/mm | 2.4.8 | 125℃ | AABUS | 1.30 |
| Peel Strength (288℃/10s) | N/mm | 2.4.8 | Float 288℃ / 10s | AABUS | 1.25 |
| Flammability | Rating | UL94 | E-24/23 | UL94 V-0 | V-0 |
| Glass Transition Temperature (Tg) | ℃ | 2.4.25 | E-2/105 (DSC) | ≥170 | 175 |
| Surface Resistivity | MΩ | 2.5.17.1 | C-96/35/90 | ≥1.0×10⁴ | 1.0×10⁷ |
| Volume Resistivity | MΩ·cm | 2.5.17.1 | C-96/35/90 | ≥1.0×10⁶ | 1.0×10⁹ |
| Dielectric Breakdown | kV | 2.5.6 | D-48/50 + D0.5/23 | ≥40 | 48 |
| Dielectric Strength | kV/mm | 2.5.6.2 | D-48/50 + D0.5/23 | ≥29 | 40 |
| Dielectric Constant (@1 MHz) | — | 2.5.5.2 | Etched | ≤5.4 | 4.5 |
| Loss Tangent (@1 MHz) | — | 2.5.5.2 | Etched | ≤0.035 | 0.018 |
| Moisture Absorption | % | 2.6.2.1 | D-24/23 | ≤0.80 / ≤0.35 | 0.25 / 0.15 |
| Flexural Strength (Warp) | N/mm² | 2.4.4 | — | ≥415 | 589 |
| Flexural Strength (Fill) | N/mm² | 2.4.4 | — | ≥345 | 456 |
| Arc Resistance | Sec | 2.5.1 | D-48/50 + D0.5/23 | ≥60 | 125 |
| CTE / Z-Axis Expansion | ppm/°C (%) | 2.4.24 | E-2/105 TMA | ≤60 / 300 (≤3.0%) | 46 / 267 (2.8%) |
| Comparative Tracking Index (CTI) | V | IEC 60112 | Etched / 0.1% NH₄Cl | ≥175 | 175 |
| Decomposition Temperature (Td) | ℃ | 2.4.24.6 | TGA | ≥340 | 357 |
| CAF Resistance | hrs | — | 85% RH, 85℃, 50V DC | ≥1000 | 1000 |
| T-260 | min | 2.4.24.1 | TMA | ≥30 | 50 |
| T-288 | min | 2.4.24.1 | TMA | ≥15 | 30 |
Remarks:
Typical values are for reference only and may vary slightly due to different testing methods or equipment. This technical information is provided by Kingboard Laminates Holdings Ltd.
For any technical questions regarding this material or if you need support in PCB manufacturing or assembly, please feel free to contact the professional team at Highleap Electronics.
We provide:
– Material selection consultation
– Prototyping and mass production
– One-stop SMT, THT, testing and PCBA services
– Custom technical documentation and compliance support
Why Engineers Choose KB-6167 – Proven Reliability with Cost Efficiency
In PCB manufacturing, performance matters—but so does cost. While many global laminate brands offer solid materials, KB-6167 stands out by delivering the critical thermal and electrical reliability needed for multilayer designs—at a significantly more competitive price point.
At Highleap Electronics, we’ve integrated KB-6167 across a wide range of production builds not just for its Tg 175°C rating or low Z-axis CTE—but because it strikes the right balance between field-proven performance and total cost of ownership. It’s a smart choice for OEMs and EMS providers seeking dependable quality without overspending on overengineered materials.
What sets KB-6167 apart in real-world applications:
- Stable dielectric properties through lead-free soldering cycles up to 288°C
- CAF resistance ≥1000 hrs for automotive and industrial-grade durability
- Dielectric breakdown ≥40 kV/mm for IPC Class 3 builds
- Reliable dimensional stability in 85% RH environments
- Verified performance on multilayer stackups with complex via structures
- Lower material cost compared to premium international brands—without sacrificing reliability
In short, KB-6167 gives you the technical confidence you need, with the pricing flexibility your project budget demands. It’s not just a datasheet—it’s a high-Tg solution that delivers both in the lab and on the line.
Full-Service PCB Manufacturing with Certified KB-6167 Laminate
From certified material to finished board—delivered by Highleap Electronics
At Highleap Electronics, we don’t just use KB-6167—we build around it. As a full-service PCB manufacturer, we integrate certified fabrication, assembly, and engineer-led DFM to ensure every design translates into a reliable, manufacturable product.
Our in-house capabilities include:
-
Multilayer PCB fabrication with custom stackup engineering
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SMT and THT assembly using RoHS-compliant, lead-free processes
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End-to-end testing: AOI, X-ray, ICT, FCT, and more
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Direct sourcing and traceability of genuine KB-6167 laminate and prepreg
With KB-6167 stocked and ready, we help reduce lead times, improve consistency, and accelerate your path from prototype to production. We also maintain inventory of multiple standard laminate types—ensuring you always have access to the right material for your specific build. Whether you’re ready to move forward with KB-6167 or exploring other options, our team is here to support your next project with speed and confidence.
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