High-Temperature Arlon 85N PCB Assembly & Fabrication Services
Highleap Electronics provides Arlon 85N PCB assembly and manufacturing using Arlon Electronic Materials, engineered for extreme high-temperature applications and aerospace-grade reliability.
PCB Manufacturing for Projects Using Arlon 85N
Arlon 85N is a high-temperature pure polyimide laminate and prepreg system produced by Arlon Electronic Materials. It has a glass transition temperature (Tg) of 250°C and is intended for PCB constructions where elevated processing or operating temperatures need to be considered.
Highleap Electronics manufactures and assembles PCBs and does not manufacture Arlon 85N laminate or prepreg. For PCB projects involving 85N, our engineering work focuses on the finished board construction, including layer count, copper thickness, via structure, multilayer lamination, controlled impedance, surface finish, and assembly requirements.
Our PCB manufacturing capabilities cover rigid multilayer boards, HDI structures, high-layer-count PCBs, controlled-impedance designs, and other complex board constructions. PCB fabrication can also be coordinated with component sourcing, SMT/THT assembly, inspection, and testing from prototype through production.
PCB Engineering Considerations
- High-layer-count and multilayer PCB stack-up requirements
- Through-hole, blind-via, and buried-via structures
- Lamination and drilling requirements for polyimide PCB constructions
- Controlled impedance and copper construction
- PCB fabrication and assembly process coordination
Arlon 85N material properties, available constructions, and qualification information should be confirmed using the manufacturer’s current technical documentation before the final PCB build is released.
Technical Specifications of Arlon 85N Laminate
The following tables present the comprehensive technical specifications for Arlon 85N high-performance polyimide laminate and prepreg materials. All values are typical properties and are provided for engineering reference purposes.
Thermal Properties
| Property | Typical Value | Units | Test Method |
|---|---|---|---|
| Glass Transition Temperature (Tg) by TMA | ≥250 | °C | IPC-TM-650 2.4.24 |
| Glass Transition Temperature (Tg) by DSC | – | °C | IPC-TM-650 2.4.25 |
| Decomposition Temperature – Initial | 387 | °C | IPC-TM-650 2.4.24.6 |
| Decomposition Temperature – 5% weight loss | 407 | °C | IPC-TM-650 2.4.24.6 |
| Time to Delaminate – T260 | >60 | min | IPC-TM-650 2.4.24.1 |
| Time to Delaminate – T288 | >60 | min | IPC-TM-650 2.4.24.1 |
| Time to Delaminate – T300 | >60 | min | IPC-TM-650 2.4.24.1 |
| CTE (X,Y) | 16 | ppm/°C | IPC-TM-650 2.4.41 |
| CTE (Z) – Pre-Tg | 55 | ppm/°C | IPC-TM-650 2.4.24 |
| CTE (Z) – Post-Tg | 149 | ppm/°C | IPC-TM-650 2.4.24 |
| Z-axis Expansion (50-260°C) | 1.2 | % | IPC-TM-650 2.4.24 |
Electrical Properties
| Property | Typical Value | Units | Test Method |
|---|---|---|---|
| Dielectric Constant @ 1 MHz | 4.2 | — | IPC-TM-650 2.5.5.3 |
| Dielectric Constant @ 1 GHz | 4.0 | — | — |
| Dissipation Factor @ 1 MHz | 0.01 | — | IPC-TM-650 2.5.5.3 |
| Dissipation Factor @ 1 GHz | N/A | — | — |
| Volume Resistivity – C96/35/90 | 1.5 × 10⁸ | MΩ-cm | IPC-TM-650 2.5.17.1 |
| Volume Resistivity – E24/125 | 3.0 × 10¹⁰ | MΩ-cm | IPC-TM-650 2.5.17.1 |
| Surface Resistivity – C96/35/90 | 1.6 × 10⁸ | MΩ | IPC-TM-650 2.5.17.1 |
| Surface Resistivity – E24/125 | 1.6 × 10⁸ | MΩ | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 1450 (57.1) | Volts/mil (kV/mm) | IPC-TM-650 2.5.6.2 |
| Dielectric Breakdown | >40 | kV | IPC-TM-650 2.5.6 |
| Arc Resistance | 143 | sec | IPC-TM-650 2.5.1 |
Mechanical Properties
| Property | Typical Value | Units | Test Method |
|---|---|---|---|
| Peel Strength to Copper (1 oz/35 micron) – After Thermal Stress | 6.4 (1.1) | lb/in (N/mm) | IPC-TM-650 2.4.8 |
| Peel Strength to Copper (1 oz/35 micron) – At Elevated Temperatures | 6.4 (1.1) | lb/in (N/mm) | IPC-TM-650 2.4.8.2 |
| Peel Strength to Copper (1 oz/35 micron) – After Process Solutions | 6.4 (1.1) | lb/in (N/mm) | IPC-TM-650 2.4.8 |
| Young’s Modulus – CD/MD | 3.6/4.1 (24.8/28.2) | Mpsi (GPa) | ASTM E111 |
| Tensile Strength – CD/MD | 48/64 (330/440) | kpsi (MPa) | ASTM D3039 |
| Poisson’s Ratio | 0.18 | — | ASTM E13204 |
Physical Properties
| Property | Typical Value | Units | Test Method |
|---|---|---|---|
| Water Absorption (0.062″) | 0.27 | % | IPC-TM-650 2.6.2.1 |
| Density | 1.6 | g/cm³ | ASTM D792 Method A |
| Thermal Conductivity | 0.2 | W/mK | ASTM E1461 |
| Flammability | HB | class | UL 94 |
Additional Properties & Compliance
| Property | Specification | Details | Notes |
|---|---|---|---|
| IPC Compliance Standards | IPC-4101/40, IPC-4101/41 | Qualified Product Listing | Arlon EMD is first U.S. laminator recognized under IPC QPL |
| Environmental Compliance | RoHS/WEEE Compliant | Halogen-free chemistry | Bromine-free formulation |
| Resin System | Pure Polyimide | No secondary resin | No epoxy added, blended or reacted |
| Glass Transition Temperature | ≥250°C | Best-in-class thermal properties | Superior to typical high-performance epoxies |
| Processing Compatibility | Lead-free soldering | Compatible with HASL, IR Reflow | Toughened chemistry resists resin fracturing |
Important Technical Notes:
- The values shown above are provided for general PCB engineering reference. For current 85N material properties, available constructions, processing guidance, and qualification information, please refer to the latest technical documentation issued by Arlon Electronic Materials.
- 85N is a laminate and prepreg product of Arlon Electronic Materials. Highleap Electronics manufactures and assembles PCBs and does not manufacture 85N laminate or prepreg.
- For PCB production, material identification and applicable traceability documents are managed according to the approved project requirements and available supply-chain documentation.
Why Engineers Choose Arlon 85N for Extreme High-Temperature PCB Projects
At Highleap Electronics, we recommend Arlon 85N laminates for applications requiring the ultimate in thermal performance and long-term reliability. This pure polyimide material stands out for its exceptional thermal stability, mechanical strength, and processing reliability in the most demanding environments. Arlon 85N ensures exceptional signal integrity and thermal endurance, making it the ideal choice for applications requiring extreme high-temperature resistance and long service life.
Key Benefits of Arlon 85N
Ultimate Thermal Performance: Arlon 85N offers unmatched thermal stability with a glass transition temperature ≥250°C and decomposition temperature of 407°C, ensuring excellent performance even in demanding thermal environments, making it well-suited for extreme high-temperature electronics and aerospace applications.
Pure Polyimide Chemistry: As a pure polyimide with no secondary resin, epoxy blends, or reactions, Arlon 85N delivers consistent performance and superior chemical resistance. It features bromine-free chemistry for environmental compliance and maintains stable properties across wide temperature ranges.
Excellent PTH Reliability: Low Z-axis expansion of only 1.2% (50-260°C) minimizes the risk of plated through-hole failures during thermal cycling and high-temperature processing. This exceptional dimensional stability ensures reliable interconnect performance throughout the service life.
Industry Recognition and Compliance: Arlon 85N meets IPC-4101/40 and IPC-4101/41 specifications, is RoHS compliant, and features bromine-free chemistry for environmental safety and regulatory compliance. Available in both laminate and prepreg forms, Arlon 85N offers flexibility for complex multilayer designs.
From Prototype to Production with Highleap Electronics
Highleap Electronics provides PCB fabrication and PCB assembly services for multilayer, HDI, high-temperature, and complex PCB projects, including designs that use Arlon 85N as part of the approved material stack-up.
Our engineering and production teams coordinate the complete PCB build from DFM review and stack-up verification through fabrication, surface finishing, assembly, inspection, and testing. This helps keep the board design, manufacturing requirements, and PCBA process aligned from prototype development to volume production.
- Multilayer, HDI, and complex PCB fabrication
- Controlled-impedance and advanced via structures
- ENIG, ENEPIG, OSP, and other specified surface finishes
- SMT/THT assembly, component sourcing, and testing
- Prototype, small-batch, and volume production support
If your PCB project involves Arlon 85N or another high-temperature laminate, send us your Gerber files, stack-up, BOM, and assembly requirements for manufacturing review and quotation.
Contact Highleap Electronics to discuss your PCB fabrication and assembly project.