TLX-8
What is TLX-8?
Material Overview
- Current Manufacturer: AGC
- Product: TLX-8
- Material Type: Fiberglass-Reinforced PTFE
- Typical Dk: 2.55 ± 0.04
- Typical Df: 0.0018
- Primary Use: RF & Microwave PCBs
Features
- Low Dielectric Loss
- Controlled Dielectric Constant
- Low Moisture Absorption
- Fiberglass-Reinforced Structure
- Multiple Thickness Options
- Different Copper Cladding Options
Benefits
- Low and Stable Dk
- Excellent Mechanical & Thermal Properties
- Dimensionally Stable
- Low Moisture Absorption
- Low DF
- UL 94 V-0 Rating
- For Low Layer Count Microwave Designs
Applications
- RF & Microwave Antennas
- Radar Systems
- Mobile Communication Equipment
- Microwave Test Equipment
- RF Filters
- Mixers & Frequency Converters
- Power Dividers, Splitters & Combiners
- RF & Microwave Passive Components
TLX-8 General Properties
| Properties | Test Methods | Unit | Value | Unit | Value |
|---|---|---|---|---|---|
|
DK @ 10 GHz |
IPC-650 2.5.5.3 |
|
2.55 |
|
2.55 |
|
Df @ 1.9 GHz |
IPC-650 2.5.5.5.1 |
|
0.0012 |
|
0.0012 |
|
Df @ 10 GHz |
IPC-650 2.5.5.5.1 |
|
0.0017 |
|
0.0017 |
|
Dielectric Breakdown |
IPC-650 2.5.6 |
kV |
>45 |
kV |
>45 |
|
Moisture Absorption |
IPC-650 2.6.2.1 |
% |
0.02 |
% |
0.02 |
|
Flexural Strength (MD) |
ASTM D 709 |
psi |
28,900 |
N/mm² |
|
|
Flexural Strength (CD) |
ASTM D 709 |
psi |
20,600 |
N/mm² |
|
|
Tensile Strength (MD) |
ASTM D 902 |
psi |
35,600 |
N/mm² |
|
|
Tensile Strength (CD) |
ASTM D 902 |
psi |
27,500 |
N/mm² |
|
|
Elongation at Break (MD) |
ASTM D 902 |
% |
3.94 |
% |
3.94 |
|
Elongation at Break (CD) |
ASTM D 902 |
% |
3.92 |
% |
3.92 |
|
Young's Modulus (MD) |
ASTM D 902 |
kpsi |
980 |
N/mm² |
|
|
Young's Modulus (CD) |
ASTM D 902 |
kpsi |
1,200 |
N/mm² |
|
|
Young's Modulus (MD) |
ASTM D 3039 |
kpsi |
1,630 |
N/mm² |
|
|
Poisson's Ratio |
ASTM D 3039 |
|
0.135 |
N/mm |
|
|
Peel Stength (1 oz.ed) |
IPC-650 2.4.8 Sec.5.2.2 (Thermal Stress.) |
Ibs./linear inch |
15 |
N/mm |
|
|
Peel Stength (1 oz.RTF) |
IPC-650 2.4.8 Sec.5.2.2 (Thermal Stress.) |
Ibs./linear inch |
17 |
N/mm |
|
|
Peel Stength (½ oz.ed) |
IPC-650 2.4.8.3 (Elevated Temp.) |
Ibs./linear inch |
14 |
N/mm |
|
|
Peel Stength (½ oz.ed) |
IPC-650 2.4.8 Sec.5.2.2 (Thermal Stress.) |
Ibs./linear inch |
11 |
N/mm |
|
|
Peel Stength (1 oz.rolled) |
IPC-650 2.4.8 Sec.5.2.2 (Thermal Stress.) |
Ibs./linear inch |
13 |
N/mm |
2.1 |
|
Dimensional Stability (MD) |
IPC-650 2.4.39 Sec.5.5 (After Bake.) |
mils/in. |
0.06 |
mm/M |
|
|
Dimensional Stability (CD) |
IPC-650 2.4.39 Sec.5.4 (After Bake.) |
mils/in. |
0.08 |
mm/M |
|
|
Dimensional Stability (MD) |
IPC-650 2.4.39 Sec.5.5 (Thermal Stress.) |
mils/in. |
0.09 |
mm/M |
|
|
Dimensional Stability (CD) |
IPC-650 2.4.39 Sec.5.5 (Thermal Stress.) |
mils/in. |
0.1 |
mm/M |
|
|
Surface Resistivity |
IPC-650 2.5.17.1 Sec.5.2.1 (Elevated Temp.) |
Mohm |
6.605 x 10⁸ |
Mohm |
6.605 x 10⁸ |
|
Surface Resistivity |
IPC-650 2.5.17.1 Sec.5.2.1 (Humidity Cond.) |
Mohm |
3.550 x 10⁶ |
Mohm |
3.550 x 10⁶ |
|
Volume Resistivity |
IPC-650 2.5.17.1 Sec.5.2.1 (Elevated Temp.) |
Mohm/cm |
1.110 x 10¹⁰ |
Mohm/cm |
1.110 x 10¹⁰ |
|
Volume Resistivity |
IPC-650 2.5.17.1 Sec.5.2.1 (Humidity Cond.) |
Mohm/cm |
1.046 x 10¹⁰ |
Mohm/cm |
1.046 x 10¹⁰ |
|
Thermal Conductivity |
ASTM F433/ASTM 1530-06 |
W/M*K |
0.19 |
W/M*K |
0.19 |
|
CTE (X axis) (25-260℃) |
IPC-650 2.4.41/ASTM D 3386 |
ppm/℃ |
21 |
ppm/℃ |
21 |
|
CTE (Y axis) (25-260℃) |
IPC-650 2.4.41/ASTM D 3386 |
ppm/℃ |
23 |
ppm/℃ |
23 |
|
CTE (Z axis) (25-260℃) |
IPC-650 2.4.41/ASTM D 3386 |
ppm/℃ |
215 |
ppm/℃ |
215 |
|
Density (Specific Gravity) |
ASTM D 792 |
g/cm³ |
2.25 |
g/cm³ |
2.25 |
|
Td (2% Weight Loss) |
IPC-650 2.4.24.6 (TGA) |
℃ |
535 |
℃ |
|
|
Td (5% Weight Loss) |
IPC-650 2.4.24.6 (TGA) |
℃ |
553 |
℃ |
|
|
Flammability Rating |
UL-94 |
|
V-0 |
|
V-0 |
Remarks
- The values listed above are typical material reference data and may vary with laminate thickness, copper construction, processing conditions, and test methods.
- TLX-8 is part of AGC’s RF/microwave laminate portfolio. For current specifications, available thicknesses, copper cladding options, and qualification information, refer to the latest technical documentation from AGC.
- The material data on this page are provided for general engineering reference and should not be used as guaranteed specifications for a finished PCB or electronic assembly.
When Does TLX-8 Make Sense for an RF or Microwave PCB?
TLX-8 may be worth evaluating when an RF or microwave PCB requires a PTFE-based laminate with low dielectric loss, controlled dielectric properties, and fiberglass reinforcement. The decision should be based on the complete circuit requirement rather than the material name alone.
For PCB designers, TLX-8 is most relevant when transmission-line behavior, insertion loss, impedance stability, and RF geometry have a meaningful influence on the finished circuit. Typical projects may include antenna networks, radar electronics, RF filters, microwave passive circuits, communication equipment, and test or measurement hardware.
- RF and microwave signal paths: Suitable for designs where dielectric loss is an important part of the transmission-line calculation.
- Antenna and radar circuits: May be considered for high-frequency structures where trace geometry, dielectric thickness, copper profile, and grounding need to be tightly defined.
- Filters and passive RF networks: Useful for circuits that depend on controlled transmission-line dimensions and repeatable dielectric behavior.
- Low- to moderate-layer-count RF boards: TLX-8 can be evaluated for microwave PCB constructions that do not require the same material architecture as complex high-layer-count digital backplanes.
- Controlled-impedance designs: The laminate can be incorporated into PCB stack-ups where impedance targets are defined together with copper thickness and dielectric spacing.
- Hybrid PCB constructions: In some projects, a PTFE RF layer may be combined with other approved PCB materials when electrical, mechanical, and cost requirements support a hybrid stack-up.
TLX-8 is not automatically the right laminate for every high-frequency PCB. Operating frequency, insertion-loss target, board thickness, layer count, RF topology, thermal requirements, fabrication complexity, assembly conditions, and material availability should all be considered before the final PCB stack-up is released.
For TLX-8 PCB manufacturing and PCB assembly projects, Highleap Electronics works from the approved material callout, stack-up, Gerber data, impedance requirements, mechanical drawings, and assembly files to develop the corresponding PCB production build.
Submit your TLX-8 PCB project for manufacturing review and quotation