Your PCB Manufacturing Expert – Highleap Electronic

Highleap Electronic’s Guide to Blind and Buried Vias in PCBs

Highleap Electronic’s Guide to Blind and Buried Vias in PCBs

In the ever-evolving landscape of electronics, printed circuit boards (PCBs) serve as the backbone of virtually all electronic devices. As technology advances, the demand for more compact, high-performance, and reliable PCBs has surged. Central to meeting these...

PCB Side Plating Solutions for High-Performance Electronics

PCB Side Plating Solutions for High-Performance Electronics

[pac_divi_table_of_contents included_headings="off|on|off|off|off|off" exclude_headings_by_class="on" active_link_highlight="on" level_markers_2="icons" level_markers_3="icons" title_container_padding="10px|15px|10px|15px|true|false" title_container_bg_color="#EEEEEE"...

Metallized Half-Hole PCB Manufacturing Solutions

Metallized Half-Hole PCB Manufacturing Solutions

[pac_divi_table_of_contents included_headings="off|on|off|off|off|off" exclude_headings_by_class="on" active_link_highlight="on" level_markers_2="icons" level_markers_3="icons" title_container_padding="10px|15px|10px|15px|true|false" title_container_bg_color="#EEEEEE"...

Understanding PCB Non-Plated Through Holes (NPTH)

Understanding PCB Non-Plated Through Holes (NPTH)

[pac_divi_table_of_contents included_headings="off|on|off|off|off|off" exclude_headings_by_class="on" active_link_highlight="on" level_markers_2="icons" level_markers_3="icons" title_container_padding="10px|15px|10px|15px|true|false" title_container_bg_color="#EEEEEE"...

Common Problems with PCB Through Vias and Their Solutions

Common Problems with PCB Through Vias and Their Solutions

[pac_divi_table_of_contents included_headings="off|on|off|off|off|off" exclude_headings_by_class="on" active_link_highlight="on" level_markers_2="icons" level_markers_3="icons" title_container_padding="10px|15px|10px|15px|true|false" title_container_bg_color="#EEEEEE"...

Cost-Saving Back Drilling Technology for Multi-Layer PCBs

Cost-Saving Back Drilling Technology for Multi-Layer PCBs

[pac_divi_table_of_contents included_headings="off|on|off|off|off|off" exclude_headings_by_class="on" active_link_highlight="on" level_markers_2="icons" level_markers_3="icons" title_container_padding="10px|15px|10px|15px|true|false" title_container_bg_color="#EEEEEE"...

Guide to Micro Vias: Technology and Best Practices

Guide to Micro Vias: Technology and Best Practices

[pac_divi_table_of_contents included_headings="off|on|off|off|off|off" exclude_headings_by_class="on" active_link_highlight="on" level_markers_2="icons" level_markers_3="icons" title_container_padding="10px|15px|10px|15px|true|false" title_container_bg_color="#EEEEEE"...

Comprehensive Analysis of PCB Via-in-Pad Technology

Comprehensive Analysis of PCB Via-in-Pad Technology

[pac_divi_table_of_contents included_headings="off|on|off|off|off|off" exclude_headings_by_class="on" active_link_highlight="on" level_markers_3="icons" title_container_padding="10px|15px|10px|15px|true|false" title_container_bg_color="#EEEEEE"...

PCB Hole Selection to Optimize PCB Performance and Cost

PCB Hole Selection to Optimize PCB Performance and Cost

[pac_divi_table_of_contents included_headings="off|on|off|off|off|off" exclude_headings_by_class="on" active_link_highlight="on" level_markers_3="icons" title_container_padding="10px|15px|10px|15px|true|false" title_container_bg_color="#EEEEEE"...

Buried Via Challenges and Solutions in Modern PCB Design

Buried Via Challenges and Solutions in Modern PCB Design

[pac_divi_table_of_contents title="On this article" default_state="closed" included_headings="off|on|off|off|off|off" exclude_headings_by_class="on" active_link_highlight="on" level_markers_3="icons" title_container_padding="10px|15px|10px|15px|true|false"...