Your PCB Manufacturing Expert – Highleap Electronic
Figure 1. 10 layer high-speed PCB for DDR5 and PCIe routing. Table of Contents Start with the Channel, Not the Protocol Label What the Data Rate Does-and Does Not-Tell You Build an Insertion-Loss and Discontinuity Budget Select Material, Copper and Geometry Together...
Figure 1. 10 layer PCB impedance control coupon and TDR verification. Table of Contents Controlled Impedance Is a Stackup and Process Definition Inputs Required Before Trace Geometry Can Be Released Single-Ended, Odd-Mode and Differential Impedance Microstrip,...
Figure 1. RO4003C vs RO4350B selection depends on dielectric data, loss target, stackup, and assembly requirements.When a board carries RF, microwave, or fast digital signals, engineers often narrow the material choice to RO4003C vs RO4350B and then compare the Rogers...
Figure 1. RF shielding for PCB with board-level shielding and grounding review. RF shielding is the use of a conductive barrier, a shield can, a sputtered coating, or a wall of grounded vias, to contain a circuit's electromagnetic energy or block external fields. It...
Figure 1. Isola I-Tera MT40 PCB manufacturingIsola I-Tera MT40 PCB manufacturing is used for low-loss multilayer boards that combine high-speed digital routing, RF sections, dense vias, and lead-free assembly requirements. Isola identifies I-Tera MT40 RF/MW as a very...
Figure 1. Rogers AD350A PCB manufacturingRogers AD350A PCB manufacturing is used for commercial RF boards that need Dk 3.5 class performance, practical fabrication, and stable assembly yield. AD350A is commonly considered for sub-6 GHz RF hardware, Wi-Fi RF boards,...
Figure 1. Rogers CLTE-XT PCB manufacturingRogers CLTE-XT PCB manufacturing is used when an RF board needs low thermal expansion, tight dimensional behavior, and reliable hybrid stackup construction. Unlike a single-value laminate callout, CLTE-XT must be specified by...
Figure 1. Rogers TMM10 PCB fabricationRogers TMM10 PCB fabrication is used when a microwave board needs a Dk 9.2 thermoset ceramic laminate for compact RF geometry. TMM10 has process Dk 9.20 +/- 0.230 and dissipation factor 0.0022 at 10 GHz. It helps reduce circuit...
Figure 1. Rogers TMM6 PCB fabricationRogers TMM6 PCB fabrication is used when a design needs Dk 6.0 microwave performance with the mechanical behavior of a ceramic-filled thermoset material. TMM6 has process Dk 6.00 +/- 0.080 and dissipation factor 0.0023 at 10 GHz....
Figure 1. Rogers RO3010 PCB manufacturingRogers RO3010 PCB manufacturing is chosen when a microwave circuit needs strong miniaturization from a Dk 10.2 ceramic-filled PTFE laminate. RO3010 has process Dk 10.2 +/- 0.30 and dissipation factor 0.0022 at 10 GHz. It can...