Your PCB Manufacturing Expert – Highleap Electronic
Figure 1. RO4003C vs RO4350B selection depends on dielectric data, loss target, stackup, and assembly requirements.When a board carries RF, microwave, or fast digital signals, engineers often narrow the material choice to RO4003C vs RO4350B and then compare the Rogers...
Figure 1. RF shielding for PCB with board-level shielding and grounding review. RF shielding is the use of a conductive barrier, a shield can, a sputtered coating, or a wall of grounded vias, to contain a circuit's electromagnetic energy or block external fields. It...
Figure 1. Isola I-Tera MT40 PCB manufacturingIsola I-Tera MT40 PCB manufacturing is used for low-loss multilayer boards that combine high-speed digital routing, RF sections, dense vias, and lead-free assembly requirements. Isola identifies I-Tera MT40 RF/MW as a very...
Figure 1. Rogers AD350A PCB manufacturingRogers AD350A PCB manufacturing is used for commercial RF boards that need Dk 3.5 class performance, practical fabrication, and stable assembly yield. AD350A is commonly considered for sub-6 GHz RF hardware, Wi-Fi RF boards,...
Figure 1. Rogers TMM10 PCB fabricationRogers TMM10 PCB fabrication is used when a microwave board needs a Dk 9.2 thermoset ceramic laminate for compact RF geometry. TMM10 has process Dk 9.20 +/- 0.230 and dissipation factor 0.0022 at 10 GHz. It helps reduce circuit...
Figure 1. Rogers CLTE-XT PCB manufacturingRogers CLTE-XT PCB manufacturing is used when an RF board needs low thermal expansion, tight dimensional behavior, and reliable hybrid stackup construction. Unlike a single-value laminate callout, CLTE-XT must be specified by...
Figure 1. Rogers TMM6 PCB fabricationRogers TMM6 PCB fabrication is used when a design needs Dk 6.0 microwave performance with the mechanical behavior of a ceramic-filled thermoset material. TMM6 has process Dk 6.00 +/- 0.080 and dissipation factor 0.0023 at 10 GHz....
Figure 1. Rogers RO3010 PCB manufacturingRogers RO3010 PCB manufacturing is chosen when a microwave circuit needs strong miniaturization from a Dk 10.2 ceramic-filled PTFE laminate. RO3010 has process Dk 10.2 +/- 0.30 and dissipation factor 0.0022 at 10 GHz. It can...
Figure 1. Rogers RO4725JXR PCB fabricationRogers RO4725JXR PCB fabrication is selected for antenna boards where low PIM, panel uniformity, and repeatable RF behavior matter. RO4725JXR is a Dk 2.55 antenna-grade laminate used in base-station, distributed antenna, and...
Figure 1. Rogers RO3006 PCB manufacturingRogers RO3006 PCB manufacturing is used when an RF design needs a Dk 6.15 laminate for compact geometry without moving to the more aggressive Dk 10.2 class. RO3006 is a ceramic-filled PTFE material with process Dk 6.15 +/- 0.15...