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Your PCB Manufacturing Expert – Highleap Electronic

Rogers TC350 PCB Manufacturer for RF Power Amplifier Boards

Rogers TC350 PCB Manufacturer for RF Power Amplifier Boards

Rogers TC350 PCB manufacturing is usually requested for one reason: the board must handle RF power and thermal load better than a standard FR4 stackup can. The buyer is not looking for a generic laminate overview. The buyer wants to know whether the supplier can keep...

Rogers RO4460G2 Bondply PCB for High-Dk Multilayer RF Stackups

Rogers RO4460G2 Bondply PCB for High-Dk Multilayer RF Stackups

At Highleap Electronics, the engineering review for RO4460G2 is centered on the bonding layer itself. We look at how the bondply participates in the impedance model, whether the chosen cores are electrically compatible, how the lamination cycle affects thickness...

High Speed PCB Material Selection for Signal Integrity

High Speed PCB Material Selection for Signal Integrity

Figure 1. High speed PCB material selection. On this page Material Properties That Matter Understanding Dk, Df, Tg, and CTE When FR4 Is No Longer Suitable Material Choices for AI and Networking Hardware Stack-Up Planning Considerations Manufacturer Review Before...