Taconic TLY PCB Price and PCBA Quotation

Highleap Electronics provides Taconic TLY PCB price quotations for 77 GHz radar, mmWave antennas, satellite RF, aerospace modules and low-loss microwave products. Quotes can include the exact TLY laminate, precision PCB fabrication, first-article inspection, component sourcing, RF assembly, X-ray, customer-defined testing, packing and delivery.

There is no single valid TLY unit price. TLY-3, TLY-5, TLY-5A, TLY-5Z and legacy constructions differ in dielectric data, thickness availability, copper, panel handling, PTH reliability, material yield and application. Highleap prices the released grade and process rather than grouping the family under one generic rate.

TLY-3, TLY-5 and TLY-5Z Price-Relevant Differences

Current AGC data positions TLY-3 and TLY-5 as very-low-Dk, low-loss woven-glass PTFE materials for radar, satellite, cellular and aerospace applications. TLY-5Z uses a glass-filled woven structure designed for lower Z-axis expansion and improved plated-through-hole stability. Selecting among them changes both electrical design and manufacturing cost.

Official references: AGC TLY-3, AGC TLY-5 and AGC TLY-5Z.

Taconic TLY PCB Price by Grade and Construction

The TLY family includes different low-Dk PTFE constructions. Current AGC pages identify TLY-3, TLY-5 and TLY-5Z, with different Dk, Df, density, Z-axis behaviour and application positioning. A “TLY PCB price” therefore requires the exact grade and construction.

What the Highleap TLY Quotation Can Include

Highleap Rigid RF PCB Manufacturing Capabilities

The published factory limits below provide the baseline for a TLY price review. Thin PTFE handling, RF critical dimensions, low-profile copper, panel support and testing can narrow the practical process window for a specific TLY construction. See the complete Highleap rigid PCB capability table for the published factory specification.

Capability-combination notice: values in the table are individual factory capability limits. Layer count, 2/2 mil geometry, 10 oz copper, maximum panel size, 20:1 aspect ratio and the thinnest board construction are not assumed to be simultaneously achievable. Highleap confirms the usable combination after reviewing the exact material, stackup, copper, drill, RF tolerance, surface finish and assembly package.

Highleap states grade, thickness, copper, source, certificate requirements and allowed alternatives in the quotation. No TLY family member is substituted only because its name or nominal Dk is close.

Material Thickness, Copper, and Panel Utilisation

TLY price is strongly affected by laminate thickness and copper option. Thin mmWave cores, low-profile/rolled copper and nonstandard sheet configurations may have different availability, minimum purchase and handling yield.

Separating Material Price from Manufacturing Risk

A lower laminate price does not guarantee a lower finished PCB cost if the construction reduces panel yield, requires tighter handling, adds PTH risk or changes RF test requirements. Highleap itemises those drivers and can compare TLY options with Rogers PCB cost or other approved material routes when the design owner permits alternatives.

• exact dielectric thickness and tolerance;
• copper foil type, weight and surface profile;
• finished board dimensions and quantity per production panel;
• tooling rails, coupons, fiducials and assembly panel requirements;
• board orientation where woven structure or antenna geometry matters;
• usable yield after routing, test coupons and edge-launch features.

Highleap reviews material use together with the high-frequency PCB cost model and RF copper foil selection. Cost-down suggestions focus on standard available constructions and better panel use, not an unapproved change in electrical performance.

Fabrication and Quality Costs for TLY Circuits

TLY fabrication cost reflects more than the PTFE sheet. Thin-material handling, precision imaging, etch compensation, plated-through-hole preparation, laser features, hybrid lamination, routing support and RF evidence can be significant.

Highleap’s RF tolerance process and RF PCB testing options are used to define the required production evidence.

TLY Prototype, NPI, and Volume Cost Planning

Prototype TLY pricing includes material minimum, engineering, tooling and setup across a small quantity. NPI adds first-article review, assembly learning and test development. Volume cost can improve with forecast purchasing, repeat tooling, panel optimisation and stable release schedules.

PCBA cost is developed from the BOM and package mix using PCB assembly cost factors and Highleap’s turnkey PCB assembly service.

Lead Time: Material and Test Often Set the Critical Path

TLY lead time depends on exact grade, thickness, copper, required quantity, fabrication complexity, assembly components and RF test. Highleap confirms those items before committing a date.

Highleap confirms quotation timing after material availability, fine-feature feasibility, assembly component status and test preparation are known. Expedited fabrication, first-article assembly and production shipment are priced and scheduled as separate deliverables where that lowers programme risk.

• priority material and fabrication review through quick-turn PCB manufacturing;
• bare-board-first or first-article shipment for early RF validation;
• separate assembly milestone when components or fixtures have longer lead time;
• split quantity delivery when production validation can begin before the full order;
• forecast and reserved-material planning for repeat demand.

A quotation identifies the date assumptions and any customer action needed to hold the schedule, such as stackup approval, component-alternate approval, test-fixture release or acceptance of a split shipment.

Request a TLY PCB Price and PCBA Schedule

Send exact TLY grade, material/thickness/copper requirement, Gerber/ODB++, fabrication drawing, stackup, RF geometry or impedance, drill/route data, surface finish, quantities, target date, delivery location, BOM, centroid, assembly drawings, firmware and test specification through Highleap quick quote or contact Highleap.

For TLY-5 mmWave manufacturing, review TLY-5 PCB manufacturing. For comparing other RF laminates, use RF PCB material comparison.

Can Highleap quote TLY PCB price from only board dimensions?

A rough budget may be possible. A firm price requires exact grade, dielectric thickness, copper, fabrication data, quantity, finish and quality/test scope.

Which TLY grade is cheapest?

There is no universal answer. Grade, thickness, copper, stock, panel yield, process and qualification determine total cost.

Can Highleap provide a fast TLY prototype?

Expedited production may be available after material and engineering release. The quote states committed milestones for fabrication and assembly.

Can Highleap include RF assembly and testing?

Yes. The BOM, package risks, fixture, calibration, frequency and acceptance limits must be provided or quoted as test development.

What data is required for a firm TLY PCB price?

Provide exact grade, thickness, copper, Gerber/ODB++, drawing, stackup, critical RF dimensions, quantities, target delivery, BOM, assembly drawings and test requirements.

Can Highleap propose cost reduction without changing RF performance?

Highleap can review panel utilisation, standard material constructions, tolerance allocation, inspection level, split delivery and assembly packaging. Any material, thickness, copper or electrical change requires customer approval before quotation release.