Engineering resources
Understand the manufacturing technologies used to build dense interconnects. Explore microvias, sequential construction and fine-line processes before selecting a board technology.
About the AuthorSabrinaPCB Engineering Specialist at Highleap ElectronicsSabrina has over 18 years of experience in the PCB industry, with a strong background in CAM engineering and PCB file review. She supports PCB projects from prototype to volume production,...
About the AuthorCharles LPCB CAM & Manufacturing Engineer at Highleap ElectronicsCharles has over 10 years of experience in PCB CAM engineering and electronics manufacturing, specializing in PCB file verification, DFM analysis, and production preparation for...
About the AuthorCharles LPCB CAM & Manufacturing Engineer at Highleap ElectronicsCharles has over 10 years of experience in PCB CAM engineering and electronics manufacturing, specializing in PCB file verification, DFM analysis, and production preparation for...
Highleap Electronics provides mSAP PCB manufacturing review and quotation for fine-line circuit designs where the required conductor geometry, pitch and copper construction call for a modified semi-additive process. If your current supplier cannot support the...
Highleap Electronics provides high aspect ratio PCB manufacturing enquiries and fabrication quotations for designs that combine thick boards with relatively small drilled holes or demanding plated-through-hole requirements. If a previous supplier has declined your...
Highleap Electronics provides VIPPO PCB fabrication for designs that require via-in-pad structures with a defined fill and plated-over surface. VIPPO is often specified under fine-pitch BGA or LGA packages, exposed thermal pads and dense layouts where ordinary open or...
Figure 1. 10 layer HDI PCB engineering for microvias and BGA escape. Table of Contents When a 10 Layer Board Actually Needs HDI How to Read and Select 1+8+1, 2+6+2 and 3+4+3 Microvia Geometry, Capture Pads and Via-in-Pad Stacked, Staggered and Skip Microvias...
Table of Contents HDI Blind Via PCB Cost Drivers 1+N+1 vs. 2+N+2 vs. Any-Layer: Cost Progression Laser vs. Mechanical Drilling Economics Via Filling and Stacking Cost Impact Design Decisions That Control Cost Volume Economics and NRE Amortization Cost-Optimized HDI...
A production-ready HDI stackup is not a “layer count decision.” It is a controlled construction plan that defines how build-up layers, microvias, dielectric thickness, copper build, and reference planes work together to achieve routing density without sacrificing...
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