S1600L High-CTI PCB Laminate for Moisture & Voltage Safety
S1600L laminate with CTI ≥600V and Tg 150°C ensures moisture-proof, high-voltage PCB reliability. Highleap Electronics offers full PCB fabrication & assembly.
Built for High Voltage & Moisture Resistance: S1600L Laminate
At Highleap Electronics, we manufacture and assemble PCBs using a wide range of high-performance laminates—including thermal-grade FR-4 like S1600L—to meet the needs of demanding electronic applications. While we support boards made with S1600L for its high CTI (≥600V) and thermal durability, our core strength lies in building complex, high-reliability PCB systems that go far beyond standard requirements.
From high-frequency and high-speed digital boards to multilayer HDI, high-Tg, heavy copper, rigid-flex, and mixed-material stackups, we deliver engineering support and scalable production under one roof. Our facilities are equipped to handle critical impedance control, buried/blind via drilling, sequential lamination, and surface finishes like ENIG, OSP, ImAg, and more.
If your project requires more than just standard processing—and you’re looking for stackup consulting, fast prototyping, and volume-grade quality—Highleap is your trusted PCB manufacturing partner.
In short, if you’re searching for a moisture-proof, high-voltage-safe, and manufacturing-friendly laminate, S1600L checks all the boxes—and then some.
S1600L Electrical, Thermal, and Mechanical Performance
| Item | Test Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 150 |
| IPC-TM-650 2.4.24.4 | DMA | ℃ | 150 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 355 |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 45 |
| After Tg | ppm/℃ | 240 | ||
| 50–260℃ | % | 3.2 | ||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 27 |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | – | >60s No delamination |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ·cm | 2.1×10⁸ |
| E-24/125 | MΩ·cm | 1.7×10⁶ | ||
| Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 3.2×10⁷ |
| E-24/125 | MΩ | 2.9×10⁶ | ||
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50 + D-4/23 | s | 151 |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50 + D-4/23 | kV | >45 |
| Dielectric Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | – | 5.0 |
| IEC 61189-2-721 | 10GHz | – | — | |
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | – | 0.014 |
| IEC 61189-2-721 | 10GHz | – | — | |
| Peel Strength (1oz HTE Cu foil) |
IPC-TM-650 2.4.8 | A | N/mm | — |
| After thermal stress 288℃, 10s | N/mm | 1.5 | ||
| 125℃ | N/mm | 1.2 | ||
| Flexural Strength (LW) | IPC-TM-650 2.4.4 | A | MPa | 540 |
| Flexural Strength (CW) | IPC-TM-650 2.4.4 | A | MPa | 470 |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105 + D-24/23 | % | 0.15 |
| CTI | IEC60112 | A | Rating | PLC 0 |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 |
| E-24/125 | Rating | V-0 |
NOTE
- Unless otherwise specified, all typical values are based on tests using 1.6 mm specimens. The Tg value is based on specimens with thickness ≥ 0.50 mm.
- The technical values provided are for reference only and are not guaranteed specifications. For validated data sheets or application-specific requirements, please contact Shengyi Technology Co., Ltd.
- If you are working on stackup design, IPC class builds, or require custom preconditioning methods (e.g., C-48/23/50), our engineering team can support you with material validation, process simulation, and fabrication compatibility checks—ensuring S1600L performs reliably in your specific environment.
Why S1600L Is Becoming the Go-To Choice for Appliance and Power Supply PCBs
Designers and engineers are increasingly turning to S1600L for one clear reason: it works where others fail.
This laminate offers a rare combination of high electrical insulation, thermal resistance, and CAF suppression—all of which are essential in applications like washing machines, LED power supplies, industrial control panels, and other high-stress environments.
What sets S1600L apart?
-
CTI ≥ 600V: Greatly reduces leakage risk in damp or dusty conditions
-
Tg 150°C / Td 355°C: Handles repeated reflow and wave soldering with ease
-
Low CTE (Z-axis 45 ppm/°C before Tg): Prevents delamination and via cracking in multilayer stacks
-
Strong CAF resistance: Extends product lifespan under constant bias
-
UL94 V-0 flammability rating: Safety-certified for global markets
In fast-paced factories, S1600L delivers consistent drillability, reliable plating, and clean solder masking—helping reduce scrap rates and improve production yield.
If you’re designing for high humidity, high voltage, or long lifecycle performance, S1600L is the material that makes it all possible without the headaches.
Manufacturing Advantages of S1600L for Reliable, Scalable PCB Production
Beyond excellent electrical and thermal properties, S1600L is engineered for smooth PCB manufacturing—from prototyping to high-volume assembly. Its consistent performance across processes helps reduce common yield losses and supports efficient factory workflows.
- Excellent drillability: Clean hole formation and minimal smear, even in multilayer stacks
- Reliable plating quality: Uniform copper thickness and excellent via-wall adhesion
- Surface finish compatibility: Fully compatible with ENIG, HASL, OSP, and lead-free soldering
- Stable solder mask adhesion: Prevents peeling or bubbling during reflow
- Predictable dimensional stability: Reduces scrap rates and rework in high-volume production
If you’re aiming for consistent PCB quality with fewer failures and better first-pass yield, S1600L gives your process the material-level reliability it needs—without requiring major changes to your current setup.
Related Post
Explore more related materials information.
Get a Quick Quote
Partner with Highleap Electronic for your project!
Get Detailed Files
Leave your email address and get a datasheet.
