Kapton® Series – DuPont™ Polyimide Film Solutions for Flexible PCBs
Highleap Electronics manufactures flexible circuits using Kapton® HN, FN, and HPP-ST films. Ideal for FPCs in aerospace, automotive, and consumer electronics.
What Is DuPont™ Kapton® and Why Is It Used in Flexible Circuits?
Kapton® polyimide films are world-renowned for their ability to withstand extreme heat, maintain dimensional stability, and deliver superior dielectric performance. Developed by DuPont™, Kapton® has become the go-to material for flexible PCB applications in aerospace, automotive, consumer electronics, and industrial control systems.
Highleap Electronics incorporates Kapton® HN, FN, and HPP-ST series into custom flexible and rigid-flex PCB manufacturing. Whether your project involves dynamic flex circuits, high-reliability signal paths, or insulation in harsh environments, Kapton® offers unmatched performance over a wide thermal and mechanical range.
Common use cases include:
- High-frequency FPCs for RF antennas and sensors
- Flexible insulation for power electronics and aerospace systems
- Medical wearables and rugged portable devices
Kapton® Series films are trusted by engineers and OEMs worldwide for mission-critical designs requiring long-term reliability. From multilayer stack-ups to ultra-thin flex circuits, their consistent performance ensures design freedom without compromising durability.
Kapton® FCCL Technical Specifications
Table 1. Physical Properties of Kapton® Type 100 HN Film, 25µm (1 mil)
| Physical Property | Typical Value at | Test Method | |
|---|---|---|---|
| 23°C (73°F) | 200°C (392°F) | ||
| Ultimate Tensile Strength, MPa (psi) | 231 (33,500) | 138 (20,000) | ASTM D-882-91, Method A |
| Yield Point at 3%, MPa (psi) | 69 (10,000) | 41 (6,000) | ASTM D-882 |
| Stress to Produce 5% Elongation, MPa (psi) | 90 (13,000) | 62 (9,000) | ASTM D-882 |
| Ultimate Elongation, % | 72 | 83 | ASTM D-882 |
| Tensile Modulus, GPa (psi) | 2.76 (400,000) | 2.0 (290,000) | ASTM D-882 |
| Impact Strength, N•cm (ft•lb) | 78 (0.58) | — | DuPont Pneumatic Impact Test |
| Folding Endurance (MIT), cycles | 285,000 | — | ASTM D-2176 |
| Tear Strength—Propagating (Elmendorf), N (lbf) | 0.07 (0.02) | — | ASTM D-1922 |
| Tear Strength—Initial (Graves), N (lbf) | 7.2 (1.6) | — | ASTM D-1004 |
| Density, g/cc or g/mL | 1.42 | — | ASTM D-1505 |
| Coefficient of Friction—Kinetic | 0.48 | — | ASTM D-1894 |
| Coefficient of Friction—Static | 0.63 | — | ASTM D-1894 |
| Refractive Index (Na D Line) | 1.70 | — | ASTM D-542 |
| Poisson’s Ratio | 0.34 | — | Avg. Three Samples Elongated |
| Low Temperature Flex Life | Pass | — | IPC TM 650, Method 2.6.18 |
Table 2. Thermal Properties of Kapton® Type 100 HN Film, 25 µm (1 mil)
| Thermal Property | Typical Value | Test Condition | Test Method |
|---|---|---|---|
| Melting Point | None | None | ASTM E-794 (1989) |
| Thermal Coefficient of Linear Expansion | 20 ppm/°C (11 ppm/°F) | -14 to 38°C (7 to 100°F) | ASTM D-696 |
| Coefficient of Thermal Conductivity, W/m•K (cal/sec-cm-°C) | 0.20 (4.8 × 10⁻⁴) | 296 K (23°C) | ASTM D5470 |
| Specific Heat, J/g•K (cal/g•°C) | 1.09 (0.261) | — | Differential Calorimetry |
| Flammability | 94V-0 | — | UL-94 (2-8-85) |
| Shrinkage, % | 0.17 1.25 |
30 min at 150°C 120 min at 400°C |
IPC TM 650, Method 2.2.4A ASTM D-5214 |
| Heat Sealability | Not Heat Sealable | — | — |
| Limiting Oxygen Index, % | 37 | — | ASTM D-2863 |
| Solder Float | Pass | — | IPC TM 650, Method 2.4.13A |
| Smoke Generation | DM = <1 | — | NBS Smoke Chamber NFPA-258 |
| Glass Transition Temperature (Tg) | A second order transition occurs in Kapton® between 360°C (680°F) and 410°C (770°F) and is assumed to be the glass transition temperature. Different measurement techniques produce different results within the above temperature range. |
||
Table 3. Physical and Thermal Properties of Kapton® Type HPP-ST Film
| Property | Typical Value for Film Thickness | Test Method | |||
|---|---|---|---|---|---|
| 25 µm | 50 µm | 75 µm | 125 µm | ||
| Ultimate Tensile Strength, MPa (psi) | 231 (33,500) | 234 (34,000) | 231 (33,500) | 231 (33,500) | ASTM D-882 |
| Ultimate Elongation, % | 72 | 82 | 82 | 82 | ASTM D-882 |
| Tear Strength (Elmendorf), N | 0.07 | 0.21 | 0.38 | 0.58 | ASTM D-1922 |
| Tear Strength (Graves), N | 7.2 | 16.3 | 26.3 | 46.9 | ASTM D-1004 |
| Folding Endurance (MIT), ×10³ | 285 | 55 | 6 | 5 | ASTM D-2176 |
| Density, g/cc | 1.42 | 1.42 | 1.42 | 1.42 | ASTM D-1505 |
| Flammability | 94V-0 | 94V-0 | 94V-0 | 94V-0 | UL-94 |
| Shrinkage (150°C, 30 min), % | 0.03 | 0.03 | 0.03 | 0.03 | IPC TM 650 |
| Limiting Oxygen Index, % | 37 | 43 | 46 | 45 | ASTM D-2863 |
Table 4. Physical Properties of Kapton® Type FN Film
| Property | Typical Value for Film Type | ||
|---|---|---|---|
| 120FN616 | 150FN019 | 250FN029 | |
| Ultimate Tensile Strength, MPa (psi) 23°C / 200°C |
207 (30,000) / 121 (17,500) | 162 (23,500) / 89 (13,000) | 200 (29,000) / 115 (17,000) |
| Yield Point at 3%, MPa (psi) 23°C / 200°C |
61 (9000) / 42 (6000) | 49 (7000) / 43 (6000) | 58 (8500) / 36 (5000) |
| Stress at 5% Elongation, MPa (psi) 23°C / 200°C |
79 (11,500) / 53 (8000) | 65 (9,500) / 41 (6000) | 76 (11,000) / 48 (7000) |
| Ultimate Elongation, % 23°C / 200°C |
75 / 80 | 70 / 75 | 85 / 110 |
| Tensile Modulus, GPa (psi) 23°C / 200°C |
2.48 (360,000) / 1.62 (235,000) | 2.28 (330,000) / 1.14 (165,000) | 2.62 (380,000) / 1.38 (200,000) |
| Impact Strength at 23°C, N•cm (ft•lb) | 78 (0.58) | 68.6 (0.51) | 156.8 (1.16) |
| Tear Strength—Propagating (Elmendorf), N (lbf) | 0.08 (0.02) | 0.47 (0.11) | 0.57 (0.13) |
| Tear Strength—Initial (Graves), N (lbf) | 11.8 (2.6) | 11.5 (2.6) | 17.8 (4.0) |
| Polyimide, wt% | 80 | 57 | 73 |
| FEP, wt% | 20 | 43 | 27 |
| Density, g/cc or g/mL | 1.53 | 1.67 | 1.57 |
Note: The technical specifications above are based on data published in the DuPont™ Kapton® datasheet (EI-10142) and are intended for engineering reference only. Final material performance may vary depending on copper thickness, layer structure, and processing conditions.
Highleap Electronics offers flexible PCB fabrication and assembly services compatible with Kapton® polyimide films and similar high-performance materials. We can assist with material selection, prototyping, and functional alternatives upon request.
Kapton®-Based PCB Manufacturing Capabilities
At Highleap Electronics, we provide complete fabrication and assembly services tailored to Kapton®-based flexible PCBs. Our engineering team understands the processing requirements of polyimide materials and supports both low- and high-volume projects.
- Material support: Kapton® HN, HPP-ST, and FN films from 25µm to 125µm
- Compatible processes: laser drilling, coverlay lamination, dynamic bending zones
- Precision fabrication: Cleanroom etching, fine-line imaging, and SMT-ready finishing
- Application-specific stack-ups: Rigid-flex combinations, multilayer PI lamination
- Certifications: IPC Class 2/3 compliant production environment
Whether for aerospace-grade insulation or compact FPC designs, our facility ensures dimensional accuracy, low outgassing, and stable electrical performance.
Get a Quote for Kapton®-Based Flexible PCB Projects
Ready to build high-performance flexible circuits with Kapton® polyimide film? Highleap Electronics offers end-to-end FPC fabrication and turnkey PCBA assembly tailored to your requirements.
- Quick-turn prototyping (3–5 days turnaround)
- No MOQ – ideal for custom or low-volume jobs
- Design optimization for high-temperature or high-flex environments
- Free DFM/stack-up consultation
- Global delivery with export-ready compliance
📩 Contact us now to get started with a quote, request material samples, or ask for technical advice on Kapton® film integration.
Whether you’re designing aerospace-grade insulation, next-gen wearable electronics, or EV battery modules, the Kapton® Series delivers the performance and reliability demanded by today’s most advanced applications. Partner with Highleap to unlock the full potential of Kapton®-based solutions in your next project.
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