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S1000-2M

What is S1000-2M?

S1000-2M is Shengyi Technology’s high-Tg FR-4 PCB material, featuring a glass transition temperature typically above 170°C.

shenyi

Characteristics

  • Anti-CAF Capability
  • Lead-free Compatible
  • Excellent Thermal Reliability
  • Excellent Through-Hole Reliability
  • Excellent Mechanical Process Ability

Applications

  • Computer
  • Communication
  • Automotive Electronics
  • Suitable for High Multilayer PCB

S1000-2M General Properties

Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 180
IPC-TM-650 2.4.24.4
DMA

185
Td IPC-TM-650 2.4.24.6 5% wt. loss 355
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 41
After Tg ppm/℃ 208
50-260℃ % 2.4
T260 IPC-TM-650 2.4.24.1 TMA min >60
T288 IPC-TM-650 2.4.24.1 TMA min 30
T300 IPC-TM-650 2.4.24.1
TMA min 15
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip s >100
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 8.66 E+08
E-24/125 MΩ.cm 7.18 E+06
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance 2.17 E+07
E-24/125 8.64 E+06
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 133
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV >45
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1GHz -- 4.6
IPC-TM-650 2.5.5.9
1MHz -- 4.9
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1GHz -- 0.018
IPC-TM-650 2.5.5.9
1MHz -- 0.015
Peel Strength (1oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.3 [7.43]
125℃ N/mm
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 567
CW IPC-TM-650 2.4.4 A MPa 442
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.08
CTI IEC60112 A Rating PLC 3
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

Remarks

    1. Specification sheet: lPC-4101/126, is for your reference only.
    2. All typical values are based on 1.6mm specimens, while Tg is for specimens ≥ 0.50mm.
    3. All typical values listed above are for your reference only. For detailed information, please contact Shengyi Technology Co., Ltd. All rights to this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanations: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning.
The figures following the letter symbols indicate the duration of preconditioning in hours (first digit), the preconditioning temperature in °C (second digit), and the relative humidity (third digit).

S1000-2MB Prepreg Parameters

Glass Fabric Type Resin Content (%) Cured Thickness (mm) Standard Size (Roll Type)
106/1037 72 0.050 1.260m×150m
77
0.060
1080/1078 64 0.072 1.260m×300m
69 0.086
2313 56 0.096
2116 51 0.108 1.260m×250m
55 0.120
57 0.127
1506 45 0.150 1.260m×150m
7628 44 0.187
46 0.196
50 0.216
52 0.227
*Other type, resin content and size could be available upon request.

Hot Pressing Cycle

  • The heat-up rate depends on the inner copper or the structure of multilayer PCB.
  • Curing time: >60min (185~195℃).

Storage Conditions

  • 3 months when stored at < 23℃ and < 50% RH.
  • 6 months when stored at < 5℃. Normalize in room temperature for at least 4h before using.
  • Beware of moisture, always keep wrapped in damp-proof material. Keeping in normal condition, prepreg might absorb moisture and its bonding strength would be weakened.
  • Avoid UV-rays and strong light.
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