RO4350B PCB Manufacturing and Assembly Services – High-Frequency, High-Reliability Boards
Discover expert RO4350B PCB manufacturing and assembly services from Highleap Electronics. From RF prototyping to full production, we deliver high-frequency PCB solutions with precision, speed, and reliability.
Rogers RO4350B and FR4 Mixed Delectrics PCB
Expert RO4350B PCB Manufacturing & Assembly
RO4350B is a high-performance laminate from Rogers, engineered for RF, microwave, and high-speed digital applications requiring low loss, stable dielectric properties, and flame-retardant reliability.
At Highleap Electronics, we leverage over 15 years of PCB manufacturing experience to turn your RO4350B-based designs into fully assembled boards — with tight impedance control, hybrid stackup support, and lead-free process compatibility.
Whether you’re developing 5G modules, radar systems, or satellite components, we deliver precise, scalable RO4350B PCB solutions — from prototyping to full turnkey production.
Technical Specifications of Rogers RO4350B
| Item | RO4350B | Method | Condition | Unit |
|---|---|---|---|---|
| Dielectric Constant (Process) | 3.48 ± 0.05 | IPC-TM-650 2.5.5.5 | 10 GHz / 23°C | – |
| Dielectric Constant (Design) | 3.66 | Differential Phase Length Method | 8–40 GHz | – |
| Dissipation Factor (10GHz) | 0.0037 | IPC-TM-650 2.5.5.5 | 10 GHz / 23°C | – |
| Dissipation Factor (2.5GHz) | 0.0031 | IPC-TM-650 2.5.5.5 | 2.5 GHz / 23°C | – |
| Thermal Coefficient of Er | +50 | IPC-TM-650 2.5.5.5 | –50°C to +150°C | ppm/°C |
| Volume Resistivity | 1.2 × 10¹⁰ | IPC-TM-650 2.5.17.1 | COND A | MΩ·cm |
| Surface Resistivity | 5.7 × 10⁹ | IPC-TM-650 2.5.17.1 | COND A | MΩ |
| Electrical Strength | 31.2 (780 V/mil) | IPC-TM-650 2.5.6.2 | 0.51mm (0.020″) | kV/mm |
| Tensile Modulus (X) | 16,767 (2,432) | ASTM D638 | RT | MPa (ksi) |
| Tensile Modulus (Y) | 14,153 (2,053) | ASTM D638 | RT | MPa (ksi) |
| Tensile Strength (X) | 203 (29.5) | ASTM D638 | RT | MPa (ksi) |
| Tensile Strength (Y) | 130 (18.9) | ASTM D638 | RT | MPa (ksi) |
| Flexural Strength | 255 (37) | IPC-TM-650 2.4.4 | – | MPa (kpsi) |
| Dimensional Stability | <0.5 | IPC-TM-650 2.4.39A | After Etch +E2/150°C | mm/m |
| CTE (X/Y/Z) | 10 / 12 / 32 | IPC-TM-650 2.4.41 | –55 to +288°C | ppm/°C |
| Tg (Glass Transition Temp) | >280 | IPC-TM-650 2.4.24.3 | TMA | °C |
| Td (Decomposition Temp) | 390 | ASTM D3850 | TGA | °C |
| Thermal Conductivity | 0.69 | ASTM C518 | 80°C | W/m·K |
| Moisture Absorption | 0.06 | ASTM D570 | 48hr immersion at 50°C | % |
| Density | 1.86 | ASTM D792 | 23°C | g/cm³ |
| Peel Strength | 0.88 (5.0) | IPC-TM-650 2.4.8 | After solder float, 1oz EDC | N/mm (pli) |
| Flammability | V-0 | UL 94 | – | – |
| Lead-Free Process Compatible | Yes | – | – | – |
Notes and Further Information
(1) RO4350B 4 mil laminates have a process dielectric constant (Dk) of 3.33 ± 0.05 and comply with IPC-4103A/240. All other RO4350B thicknesses meet IPC-4103 /11 and /240 specifications.
(2) Design Dk values are averaged from multiple test batches based on the most common laminate thicknesses.
(3) RO4350B LoPro® laminates may not share the same UL rating as standard RO4350B materials and may require a separate UL qualification.
All technical data on this page is sourced from Rogers Corporation.
For the official PDF datasheet, or if you plan to use RO4350B materials for PCB manufacturing and assembly, please feel free to contact Highleap Electronics. Our engineering team will be glad to assist you with material selection, stackup guidance, and production support.
Why Choose Highleap for RO4350B PCB Manufacturing
Choosing the right material is only the first step. At Highleap Electronics, we bring your RO4350B designs to life with precision manufacturing, fast turnaround, and expert engineering support that ensures performance and reliability.
✔ Our Advantages:
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15+ Years in RF and High-Frequency PCB Manufacturing
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Tight Impedance Control for RF/microwave and differential pair circuits
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Multilayer PCB capability including hybrid stackups with RO4350B + FR4
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0.075mm laser drilling, high aspect-ratio plating, and fine trace/space
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In-house SMT assembly, BGA placement, and reflow for high-frequency boards
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Engineering support on stackup design, impedance simulation, and material selection
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Fast lead times with one-on-one technical support from prototype to volume production
Whether you’re building 5G base stations, radar modules, aerospace systems, or advanced IoT devices, our team ensures your RO4350B-based PCBs meet both electrical performance and manufacturing quality standards.
Reliable RO4350B PCB Solutions—From Prototype to Production
With a strong track record in manufacturing RO4350B-based PCBs, Highleap Electronics helps you move from concept to production with confidence. Whether you’re building RF front ends, radar modules, or aerospace systems, we ensure your boards are fabricated and assembled with precision, consistency, and full process control.
From quick-turn prototypes to turnkey assembly with functional testing, our team is ready to support your next high-frequency project.
Factory & Quality Highlights
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ISO 9001 & IPC-A-610 Certified production lines
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Over 5 SMT lines with 0201 component support
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Inline AOI & X-ray inspection for every RO4350B board
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±5% impedance control in high-frequency laminates
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UL 94V-0 flame-retardant material processing
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24 hr prototype turnaround & scalable volume runs
Ready to get started?
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