High-Frequency PCB Laminates – RO4730G3 and RO4725JXR

Rogers RO4730G3 and RO4725JXR PCB laminates for 5G and RF boards. Highleap offers full PCB fabrication and assembly services with tight impedance control.

Low-Loss Laminates for 5G Antennas & High-Frequency RF Designs

Looking for high-frequency PCB materials with exceptional electrical stability, low insertion loss, and minimal PIM? Rogers RO4725JXR and RO4730G3 are purpose-built for next-generation antenna designs in 5G infrastructure, radar systems, satellite communications, and other high-performance RF applications.

Unlike PTFE-based laminates that often require special handling, these non-PTFE materials offer:

• Low dielectric loss and stable Dk

• Outstanding passive intermodulation (PIM) performance

• Lightweight, mechanically robust substrates

• Compatibility with standard FR4 processing techniques

At Highleap Electronics, we work closely with RF engineers to bring their antenna and RF front-end designs to life—faster, leaner, and more reliably.

RO4730G3 & RO4725JXR Material Properties

Notes

1. The typical values listed above are average measurements based on commonly produced batches and standard test conditions.
2. Certain parameters, such as PIM and Dk, are obtained using Rogers-recommended internal test methods and may vary slightly depending on laminate thickness and copper configuration.
3. Design Dk values reflect typical engineering estimates across multiple lots and are provided for reference during RF simulation and stackup planning.
4. LoPro® reverse-treated EDC foil was used for dissipation factor measurements.

All material property data in this table is sourced from publicly available Rogers Corporation datasheets. Highleap Electronics provides this information to support engineers in material selection and PCB design.

Need help with RO4725JXR or RO4730G3 PCB fabrication and assembly?
Contact our engineering team at Highleap Electronics — we offer full turnkey solutions including stackup design, impedance control, and high-frequency PCBA services.

Design & Manufacturing Tips for RO4725JXR and RO4730G3 Laminates

Successfully leveraging RO4725JXR or RO4730G3 in your PCB design requires careful stackup planning and manufacturing awareness. Here are key tips from our production experts:

• Use simulation Dk for impedance matching: Don’t rely on the process Dk—use the published design Dk (2.64 for RO4725JXR, 2.98 for RO4730G3) for accurate RF trace modeling.

• Balance hybrid stackups carefully: When mixing with FR4 or other substrates, ensure CTE compatibility and avoid Z-axis stress on via structures.

• Standard FR4 fabrication is possible: These materials can be processed using conventional FR4 lamination lines, avoiding the complexity of PTFE-based boards.

• Use LoPro copper for lowest PIM: For applications where passive intermodulation is critical, specify LoPro reverse-treated copper foil.

Our engineers at Highleap Electronics provide stackup review and manufacturability assessment for every RF PCB project—free of charge.

Turnkey PCB Fabrication & Assembly for Rogers RO4700 Series

At Highleap Electronics, we’re more than just a Rogers-capable PCB shop—we’re your full-service partner for high-frequency RF board production and assembly.

For RO4725JXR and RO4730G3-based designs, we offer:

• Multilayer hybrid lamination (RO4700 + FR4)

• ±5% impedance control for RF and differential pair signals

• Micro-via drilling (0.075mm), via filling, and HDI support

• In-house SMT assembly including BGA, QFN, and 0201 components

• Full QA coverage: AOI, X-ray, and functional testing

• Scalable production: from small-batch prototyping to 10,000+ units

Case in point: We recently delivered over 10,000 RO4730G3 PCBs for a 5G antenna module—on time, on target, and with consistent PIM performance across the batch.

Let’s Build RF Boards That Perform

Whether you’re prototyping or scaling to production, our team is here to help you design, manufacture, and assemble RO4700 series PCBs with confidence.

Get in touch today for expert support and a fast, competitive quote.