Taconic RF-30 for High-Frequency RF & Microwave PCBs

Looking for a low-loss PTFE laminate for high-frequency RF PCBs? Taconic RF-30 offers stable Dk, ultra-low Df, and superior thermal reliability. Ideal for radar, 5G, and aerospace boards.

Why RF Engineers Choose RF-30 for High-Frequency PCB Designs

When it comes to high-frequency RF PCB design, material choice directly impacts signal integrity, power handling, and long-term reliability. Taconic RF-30 laminate stands out with its dielectric constant of 3.00, dissipation factor as low as 0.0014, and excellent mechanical stability under thermal cycling.

RF-30 is a PTFE-glass laminate engineered for high-frequency PCBs, offering optimal performance for:

• Phased array radar systems (24–40 GHz)

• 5G mmWave modules

• Low-loss satellite communication circuits

• High-power microwave filters and amplifiers

Compared to conventional FR4 or ceramic-filled laminates, RF-30 provides superior impedance control, lower insertion loss, and better thermal performance—all essential for multi-GHz RF systems.

Whether you’re building a high-density microwave board or a rugged aerospace module, Taconic RF-30 PCB material delivers signal consistency, reliability, and manufacturability.

RF-30 PCB Standard Material Specifications

Notes:
• All values above are typical reference data for Taconic RF-30, based on Taconic’s published technical documentation.
• Provided by Highleap Electronics to support engineers during PCB material selection and design planning.
• Actual performance may vary with laminate thickness, copper weight, and processing parameters. For critical specs, prototyping or full validation is recommended.
• RF-30 is available in various thicknesses and copper cladding options. Contact us to check stock or request a custom stack-up.
• We manufacture using 100% genuine Taconic materials sourced from certified supply partners for guaranteed quality.

Applications & Industries Where Taconic RF-30 Excels

Taconic RF-30 is trusted across industries that demand low-loss, high-stability PCB materials, including:

• Aerospace & Avionics – RF front-ends, radar receivers, microwave sensors
• Defense Systems – high-power phased-array radar, electronic warfare modules
• Telecommunications – 5G antennas, RF power amplifiers, beamforming networks
• Medical Electronics – MRI coils, RF imaging, wireless telemetry systems

RF-30 offers consistent performance across temperature extremes, making it ideal for both prototyping and mass production. Many engineers consider it a cost-effective alternative to Rogers RO3003 and RO4350B, without sacrificing RF quality.

We offer full-service RF-30 PCB manufacturing—from stackup and impedance control to drilling, plating, and assembly.

Design Guidelines for RF-30 PCB Stackups

• Use a dielectric constant (Dk) of 3.00 for simulations and impedance calculations.
• Choose LoPro® or reverse-treated copper to minimize conductor loss at high frequencies.
• Maintain tight control of trace widths and apply smooth etching to reduce impedance drift.
• In multilayer designs, balance PTFE with FR4 to limit Z-axis stress in hybrid stackups.
• For high-speed transitions (e.g., BGA or via structures), use backdrilling or via-in-pad with RF-safe fill.

Need help optimizing your RF-30 stackup, impedance model, or prototype?
Our team supports complete design-for-manufacturability (DFM) services—from simulation to sourcing to final assembly.

Why Choose Us for Your RF-30 PCB Production

We provide full fabrication and assembly solutions tailored for RF and microwave engineers. Our team specializes in processing original Taconic RF-30 laminates and supports your development process with:

✅ Stackup design assistance with simulation-verified Dk/Df modeling

✅ Controlled impedance fabrication with ±5% tolerance

✅ Hybrid PCB builds with RF-30, FR4, RO4000, or polyimide combinations

✅ Support for micro-vias, cavities, and backdrills in mmWave applications

✅ Turnkey PCB assembly with BGA/QFN, low-PIM layout optimization, and full testing (X-ray, RF validation)

We ship globally with fast turnaround and engineering support at every stage. Whether you’re prototyping or scaling to mass production, we are your trusted partner for high-frequency PCB manufacturing.