TU-872 SLK PCB Laminate – High-Speed Low Loss Material | Highleap
Highleap Electronics supplies TU-872 SLK laminates for low-loss, high-speed PCB applications in telecom, server, microwave, and RF systems. IPC-4101/126 certified.
TU-872 SLK Laminate – Low Loss Material for High-Speed and High-Frequency PCBs
TU-872 SLK is a high-performance modified epoxy FR-4 laminate, specially engineered for low loss and high reliability in multilayer high-speed circuit board applications. Reinforced with E-glass and compatible with standard FR-4 processing, it enables stable electrical performance across GHz-level frequencies.
With a dielectric constant below 4.0 and dissipation factor under 0.009 at 10GHz, TU-872 SLK is ideal for:
-
High-speed backplanes
-
RF and microwave transceivers
-
Base stations and telecom routers
-
Storage, server and HPC applications
Thanks to its enhanced thermal stability (Tg > 200°C, Td > 340°C), CAF resistance, and flat Z-axis expansion, TU-872 SLK meets the needs of today’s advanced HDI and lead-free reflow designs.
Technical Specifications of TU-872 SLK Laminate
| Property | Typical Value | Test Condition | IPC-4101 /126 Requirement |
|---|---|---|---|
| Thermal Properties | |||
| Tg (DMA) | 220 °C | E-2/105 | > 170 °C |
| Tg (DSC) | 200 °C | E-2/105 | – |
| Tg (TMA) | 190 °C | E-2/105 | – |
| Td (TGA) | 340 °C | E-2/105 | > 340 °C |
| CTE x-axis | 12–15 ppm/°C | E-2/105 | – |
| CTE y-axis | 12–15 ppm/°C | E-2/105 | – |
| CTE z-axis | 2.3 % | E-2/105 | < 3.0% |
| Thermal Stress – 288°C Solder Float | > 60 sec | A | > 10 sec |
| T260 | 60 min | E-2/105 | > 30 min |
| T288 | 20 min | E-2/105 | > 15 min |
| T300 | 5 min | E-2/105 | > 2 min |
| Flammability | 94V-0 | E-24/125 | 94V-0 |
| Electrical Properties | |||
| Permittivity @ 1GHz | 4.0 / 3.8 | SPC / 4291B | < 5.2 |
| Permittivity @ 5GHz | 3.9 | SPC | – |
| Permittivity @ 10GHz | 3.8 | SPC | – |
| Dissipation Factor @ 1GHz | 0.008 / 0.006 | SPC / 4291B | < 0.035 |
| Dissipation Factor @ 5GHz | 0.008 | SPC | – |
| Dissipation Factor @ 10GHz | 0.009 | SPC | – |
| Volume Resistivity | > 1010 MΩ·cm | C-96/35/90 | > 106 MΩ·cm |
| Surface Resistivity | > 108 MΩ | C-96/35/90 | > 104 MΩ |
| Electric Strength | > 40 kV/mm | A | > 30 kV/mm |
| Dielectric Breakdown | > 50 kV | A | – |
| Mechanical Properties | |||
| Young’s Modulus – Warp | 26 GPa | A | – |
| Young’s Modulus – Fill | 24 GPa | A | – |
| Flexural Strength – Lengthwise | > 60,000 psi | A | > 60,000 psi |
| Flexural Strength – Crosswise | > 50,000 psi | A | > 50,000 psi |
| Peel Strength – 1 oz RTF Cu | 4–7 lb/in | A | > 4 lb/in |
| Water Absorption | 0.13% | E-1/105 + D-24/23 | < 0.5% |
NOTE
- All technical data presented above are based on publicly available documents from Taiwan Union Technology Corporation (TUC). These values are intended for reference only and may vary depending on specific applications or processing conditions. They are not guaranteed specifications.
- TU-872 SLK is developed by TUC using patent-pending technology to meet the high reliability demands of advanced RF and high-speed circuit designs. For detailed material performance, processing guidelines, or conformance questions, please contact Taiwan Union Technology Corporation directly.
- At Highleap Electronics, we are a professional PCB manufacturing and assembly factory experienced in working with TU-872 SLK and other high-frequency laminates. If you need material selection guidance, PCB stack-up consultation, or turnkey fabrication and assembly services, our engineering team is here to assist you.
Please feel free to contact us for technical consultation, full datasheets, or a custom quote tailored to your specific design needs.
Material Benefits & Processing Compatibility
TU-872 SLK offers a balance of performance and manufacturability. It is fully compatible with standard FR-4 lamination and etching processes, while delivering superior performance for higher-frequency and thermally demanding designs.
Key features include:
-
Certified to IPC-4101E /29, /99, /101, and /126 standards
-
UL recognized (File: E189572) with 94V-0 flammability rating
-
Improved CTE, CAF resistance, and moisture stability
-
Excellent peel strength and through-hole reliability
-
Available in a range of copper cladding (1/3 oz – 5 oz) and prepreg styles
Use TU-872 SLK when you need:
-
A drop-in FR-4 alternative with higher electrical performance
-
IPC-validated reliability for backdrill or HDI stackups
-
Consistent dielectric performance up to 10GHz
TU-872 SLK PCB Manufacturing and Assembly – Work with Highleap Electronics
As a professional PCB manufacturer and assembly factory, Highleap Electronics supports full production and integration of TU-872 SLK-based PCBs. Whether you’re prototyping a high-speed board or scaling up for volume production, we offer:
-
Precision multilayer fabrication with impedance control
-
Customized TU-872 stack-up consulting
-
Turnkey SMT assembly for RF, networking and computing systems
-
AOI, X-ray and electrical testing for full QA compliance
Need help choosing the right materials or building a performance-optimized PCB?
Contact us today for a fast quote or technical consultation.
Related Post
Explore more related materials information.
Get a Quick Quote
Partner with Highleap Electronic for your project!
Get Detailed Files
Leave your email address and get a datasheet.