TU-747T Halogen-Free Laminate for HDI and Multilayer PCBs
Highleap Electronics offers TU-747T halogen-free laminate for HDI and multilayer PCBs. RoHS certified, CAF-resistant, and compatible with FR-4 processes.
TU-747T Halogen-Free Laminate for Multilayer and HDI PCB Applications
TU-747T is a halogen-free laminate and prepreg system designed for multilayer PCBs, HDI stack-ups, and sequential lamination builds. Manufactured with phosphorus-based flame retardants, it achieves UL 94V-0 flammability rating without the use of brominated resins, antimony, or red phosphorus.
This makes TU-747T ideal for electronics manufacturers who need a RoHS- and REACH-compliant solution that integrates easily into standard FR-4 processing lines.
Key Features
- Halogen, antimony, and red phosphorus free — ensures non-toxic combustion byproducts
- Excellent CAF resistance — reliable under high humidity and voltage bias
- Low Z-axis expansion (2.9%) — reduces the risk of via cracking in lead-free soldering
- Supports multiple lamination cycles — suitable for HDI and blind/buried via designs
- Compatible with black oxide, brown oxide, and UV/AOI processes
Recommended Applications
- Consumer electronics (notebooks, tablets, smart appliances)
- Communication modules (4G/5G RF boards, baseband PCBs)
- Motherboards and controller boards requiring mid-range thermal performance
- Multilayer HDI PCB stackups with tight dimensional tolerance
TU-747T Technical Properties Overview
| Property | Typical Value | Test Condition | SPEC |
|---|---|---|---|
| Tg (TMA) | 150 °C | E-2/105+des | N/A |
| Td (TGA) | 380 °C | E-2/105+des | > 325 °C |
| CTE x-axis | 11–15 ppm/°C | Ambient to Tg | N/A |
| CTE y-axis | 11–15 ppm/°C | Ambient to Tg | N/A |
| CTE z-axis | 2.9% | 50 to 260°C | < 3.5% |
| Thermal Stress, Solder Float, 288 °C | > 60 sec | A | > 10 sec |
| T-260 | > 60 min | E-2/105+des | > 30 min |
| T-288 | > 60 min | E-2/105+des | > 5 min |
| Flammability | 94V-0 | E-24/125+des | 94V-0 |
| Permittivity (1GHz) | 3.8 / 3.6 | C-24/23/50 | < 5.4 |
| Loss Tangent (1GHz) | 0.014 / 0.012 | C-24/23/50 | < 0.035 |
| Volume Resistivity | > 10¹⁰ MΩ·cm | C-96/35/90 | > 10⁶ MΩ·cm |
| Surface Resistivity | > 10⁸ MΩ | C-96/35/90 | > 10⁴ MΩ |
| Flexural Strength (Lengthwise) | > 60,000 psi | A | > 60,000 psi |
| Flexural Strength (Crosswise) | > 50,000 psi | A | > 50,000 psi |
| Peel Strength (1.0 oz. Cu) | 8–11 lb/in | A | > 4 lb/in |
| Bow and Twist (0.020–0.031 in) | < 0.8% | A | Max 1.5 |
| Bow and Twist (0.032–0.065 in) | < 0.8% | A | Max 1.0 |
| Bow and Twist (> 0.066 in) | < 0.8% | A | Max 1.0 |
| Water Absorption | 0.12% | E-1/105+des+D-24/23 | < 0.8% |
NOTE
- The property values listed are for reference only and not intended to serve as guaranteed specifications. Actual performance may vary depending on board design, stackup structure, and processing conditions.
- For official specifications and material datasheets, please feel free to contact us or consult the original manufacturer.
- Highleap Electronics offers engineering support upon request, including stackup optimization, material selection guidance, and manufacturability evaluation to help ensure the best performance in your application.
Regulatory Compliance and Process Compatibility
Developed by Taiwan Union Technology Corporation (TUC), TU-747T is engineered to meet modern environmental standards without requiring changes to standard FR-4 fabrication processes. As a certified distributor and engineering partner, Highleap Electronics helps customers integrate TU-747T into mass production with minimal risk and maximum compatibility.
Meets Global Environmental Standards
- Free of halogen elements (Br, Cl), antimony, and red phosphorus
- Passes IEC 61249-2-21, RoHS 2.0, and REACH SVHC requirements
- Certified to UL 94V-0, with a UL file number E189572
- Safe for global exports and compliant with EU and Japan green product directives
Drop-in Compatible with FR-4 Fabrication Lines
- No need to adjust lamination, drilling, or surface treatment processes
- Works with standard UV/AOI, OSP, ENIG, and lead-free soldering
- Available in multiple glass styles (e.g., 106, 1080, 2116, 7628) and thicknesses (0.05 mm–1.58 mm)
- Supports both roll and panel formats for flexible fabrication setups
How to Specify and Use TU-747T in Your PCB Projects
Designed for real-world production environments, TU-747T is an ideal halogen-free laminate for engineers and buyers working on multilayer PCBs, HDI stackups, or RoHS-compliant designs. It fits seamlessly into standard FR-4 workflows, making it a low-risk choice for new product development or material upgrades.
Typical use cases include consumer electronics, telecom modules, and general-purpose controllers that require stable z-axis performance, CAF reliability, and lead-free process compatibility — all without triggering requalification of standard production lines.
At Highleap Electronics, we help customers integrate TU-747T efficiently. We offer stackup matching, prepreg configuration advice, and copper foil selection (HTE or RTF), as well as material availability in common glass styles and thicknesses. Need help with documentation or layout adaptation? Our team is ready to assist.
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