TU-862 HF Halogen-Free Laminate for Reliable PCB Builds
Highleap Electronics supplies TU-862 HF halogen-free laminates with PCB fabrication and SMT assembly support. RoHS-compliant, thermally stable, and AOI-friendly.
TU-862 HF Halogen-Free Laminate for High-Tg Multilayer PCB Applications
TU-862 HF, developed by Taiwan Union Technology Corporation (TUC), is a halogen-free laminate and prepreg system optimized for high-reliability multilayer PCBs, HDI builds, and demanding lead-free processes.
It combines a high glass transition temperature (Tg 170–200 °C) with a low Z-axis CTE and excellent thermal stability, making it a practical choice for applications requiring long-term performance across multiple reflow cycles.
Unlike traditional FR-4 materials that use brominated resins, TU-862 HF achieves UL 94V-0 flammability rating with phosphorus-nitrogen flame retardants. It is fully compliant with RoHS 2.0, REACH SVHC, and IEC 61249-2-21 halogen-free standards.
Recommended applications:
- Data center backplanes, server motherboards, AI accelerator boards
- High-performance telecom modules, routers, and base stations
- HDI and sequential lamination PCB structures
TU-862 HF Technical Properties
| Property | Typical Value | Conditioning | IPC-4101 /130 Spec |
|---|---|---|---|
| Thermal | |||
| Tg (DMA) | 200 °C | E-2/105 | > 170 °C |
| Tg (TMA) | 170 °C | E-2/105 | > 170 °C |
| Td (TGA) | 390 °C | E-2/105 | > 340 °C |
| CTE x-axis | 11–15 ppm/°C | E-2/105 | N/A |
| CTE y-axis | 11–15 ppm/°C | E-2/105 | N/A |
| CTE z-axis | 2.1 % | 50–260 °C | < 3.0% |
| Thermal Stress (288°C, Solder Float) | > 60 sec | A | > 10 sec |
| T260 | > 60 min | E-2/105 | > 30 min |
| T288 | > 60 min | E-2/105 | > 15 min |
| T300 | > 30 min | E-2/105 | > 2 min |
| Flammability | 94V-0 | E-24/125 | 94V-0 |
| Electrical | |||
| Permittivity (1GHz) | 4.5 / 4.4 | RC50%, HP4291B | N/A |
| Permittivity (5GHz) | 4.5 | RC50% | N/A |
| Permittivity (10GHz) | 4.4 | RC50% | N/A |
| Loss Tangent (1GHz) | 0.013 / 0.010 | RC50%, HP4291B | N/A |
| Loss Tangent (5GHz) | 0.014 | RC50% | N/A |
| Loss Tangent (10GHz) | 0.015 | RC50% | N/A |
| Volume Resistivity | > 1010 MΩ·cm | C-96/35/90 | > 106 MΩ·cm |
| Surface Resistivity | > 108 MΩ | C-96/35/90 | > 104 MΩ |
| Electric Strength | > 40 KV/mm | A | > 30 KV/mm |
| Dielectric Breakdown | > 50 KV | A | > 40 KV |
| Mechanical | |||
| Young’s Modulus (Warp) | 26 GPa | A | N/A |
| Young’s Modulus (Fill) | 24 GPa | A | N/A |
| Flexural Strength (Lengthwise) | > 60,000 psi | A | > 60,000 psi |
| Flexural Strength (Crosswise) | > 50,000 psi | A | > 50,000 psi |
| Peel Strength (1.0 oz. RTF Cu) | 7–10 lb/in | A | > 4 lb/in |
| Water Absorption | 0.15 % | E-1/105 + D-24/23 | < 0.8% |
NOTE
- The property values listed are for reference only and not intended to serve as guaranteed specifications. Actual performance may vary depending on board design, stackup structure, and processing conditions.
- For official specifications and material datasheets, please feel free to contact us or consult the original manufacturer.
- Highleap Electronics offers engineering support upon request, including stackup optimization, material selection guidance, and manufacturability evaluation to help ensure the best performance in your application.
Difference Between TU-862 HF and TU-862T
While TU-862 HF and TU-862T share a halogen-free base and are designed for high Tg PCB applications, their intended use cases and property profiles differ. Here is a clear comparison:
| Feature | TU-862 HF | TU-862T |
|---|---|---|
| Primary Focus | Balanced performance for multilayer and lead-free builds | Enhanced thermal and mechanical stability |
| Use Case | Mass production, general HDI/server applications | Harsh thermal cycles, automotive, aerospace, EV |
| Availability | Standard glass styles, roll/panel (0.05–1.58 mm) | Often paired with higher-end copper foil or hybrid builds |
| Tuning Focus | Anti-CAF, moderate loss tangent | Higher Td, tighter Z-axis control, improved reliability |
| TUC Notes | RoHS/REACH compliant, UV-block, AOI friendly | Tighter specs, endurance optimized under thermal stress |
If you’re unsure which version fits your design better, Highleap Electronics offers material consultation, stackup simulation, and TU-862 HF/T side-by-side evaluations.
Environmental Compliance and Fabrication Compatibility
TU-862 HF is fully certified for global environmental regulations, including RoHS 2.0, REACH SVHC, and UL 94V-0 (UL file: E189572). It meets IEC 61249-2-21 standards for halogen-free materials and is listed under IPC-4101 types /127, /128, and /130. This makes it suitable for export-oriented electronics and OEMs that require documented compliance without exceptions.
From a production perspective, TU-862 HF is drop-in compatible with standard FR-4 workflows. It requires no changes to lamination profiles, drill settings, or surface treatments. The laminate supports UV-blocking for better AOI contrast and is proven to work with ENIG, OSP, and lead-free soldering. Its high-Tg and thermal endurance allow it to perform reliably across multiple reflow cycles.
Material availability includes common glass fabrics like 106, 1080, 2113, 2116, 1506, and 7628, with thickness options from 0.05 mm to 1.58 mm. Copper foil is available from 1/3 oz to 5 oz in both HTE and RTF styles, giving designers flexibility for impedance control, current handling, and signal integrity across multilayer builds.
Why Choose Highleap Electronics for TU-862 HF PCB Manufacturing
As a dedicated PCB fabrication and assembly factory based in China, Highleap Electronics offers more than material supply—we provide full technical and manufacturing support for customers adopting halogen-free laminates like TU-862 HF.
We understand how critical it is to maintain stackup integrity, thermal reliability, and compliance documentation when moving to new base materials. Our team assists with Gerber review, impedance calculation, foil and prepreg selection, and DFM guidance to ensure every board meets both electrical and environmental expectations.
Whether you’re prototyping a new HDI design, transitioning legacy boards to RoHS-compliant materials, or scaling up to volume production, we deliver end-to-end support. This includes material traceability (COC), engineering consultation, SMT assembly, functional testing, and global logistics coordination.
Looking for a halogen-free PCB supplier with real engineering insight—not just a catalog? Contact Highleap Electronics to discuss your TU-862 HF stackup or request a quote with technical review included.
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