Isola 370HR PCB Material: Specs, Stackup & Fabrication
Explore Isola 370HR PCB material specifications, stackup tips, copper foil options, and fabrication services. Get expert support from Highleap Electronics.
Isola 370HR-Based PCBs: Fabrication, Assembly & Performance Advantages
Isola 370HR is a high-performance FR-4 based PCB laminate engineered for multilayer PCB manufacturing and lead-free assembly. With a glass transition temperature (Tg) of 180°C and excellent CAF resistance, it ensures dimensional stability even under extreme thermal and mechanical stress.
Thanks to its low Z-axis CTE (45 ppm/°C) and stable dielectric constant, Isola 370HR is highly compatible with HDI stackups, sequential lamination, and automated optical inspection (AOI) requirements.
Whether you’re developing high-speed communication boards, automotive control PCBs, or 5G RF systems, this material delivers reliable thermal, electrical, and mechanical performance.
At Highleap Electronics, we manufacture and assemble PCBs using Isola 370HR with precision stackup planning and DFM guidance, ensuring your boards meet the most demanding production standards — from prototype to full-scale deployment.
Isola 370HR PCB Material Properties & Technical Specifications
| Property | Typical Value | Units | Test Method |
|---|---|---|---|
| Glass Transition Temperature (Tg) | 180 | °C | IPC-TM-650 2.4.25C |
| Decomposition Temperature (Td) | 340 | °C | IPC-TM-650 2.4.24.6 |
| Time to Delaminate – T260 | 60 | Minutes | IPC-TM-650 2.4.24.1 |
| Time to Delaminate – T288 | 30 | Minutes | IPC-TM-650 2.4.24.1 |
| Z-Axis CTE (Pre-Tg / Post-Tg / Total 50–260°C) | 45 / 230 / 2.8 | ppm/°C / % | IPC-TM-650 2.4.24C |
| X/Y-Axis CTE (Pre-Tg) | 13 / 14 | ppm/°C | IPC-TM-650 2.4.24C |
| Thermal Conductivity | 0.4 | W/m·K | ASTM E1952 |
| Thermal Stress @ 288ºC (Unetched / Etched) | Pass / Pass | — | IPC-TM-650 2.4.13.1 |
| Dk (100 MHz / 1 GHz / 2 GHz / 5 GHz / 10 GHz) | 4.24 / 4.17 / 4.04 / 3.92 / 3.92 | — | Various (Stripline, IPC-TM-650) |
| Df (100 MHz / 1 GHz / 2 GHz / 5 GHz / 10 GHz) | 0.0150 / 0.0161 / 0.0210 / 0.0250 / 0.0250 | — | Various (Stripline, IPC-TM-650) |
| Volume Resistivity (moisture / high temp) | 3.0×10⁸ / 7.0×10⁸ | MΩ·cm | IPC-TM-650 2.5.17.1 |
| Surface Resistivity (moisture / high temp) | 3.0×10⁶ / 2.0×10⁸ | MΩ | IPC-TM-650 2.5.17.1 |
| Dielectric Breakdown | >50 | kV | IPC-TM-650 2.5.6B |
| Arc Resistance | 115 | Seconds | IPC-TM-650 2.5.1B |
| Electric Strength | 54 (1350) | kV/mm (V/mil) | IPC-TM-650 2.5.6.2A |
| Comparative Tracking Index (CTI) | 3 (175–249 V) | Class | UL 746A / ASTM D3638 |
| Peel Strength (after thermal / 125°C / chemical) | 1.25 / 1.25 / 1.14 | N/mm (lb/in) | IPC-TM-650 2.4.8.x |
| Flexural Strength (Length / Cross) | 90 / 77 | ksi | IPC-TM-650 2.4.4B |
| Tensile Strength (Length / Cross) | 55.9 / 35.6 | ksi | ASTM D3039 |
| Young’s Modulus (Length / Cross) | 3744 / 3178 | ksi | ASTM D790-15e2 |
| Poisson’s Ratio (Length / Cross) | 0.177 / 0.171 | — | ASTM D3039 |
| Moisture Absorption | 0.15 | % | IPC-TM-650 2.6.2.1A |
| Flammability (Laminate & Prepreg) | V-0 | Rating | UL 94 |
| Relative Thermal Index (RTI) | 130 | °C | UL 796 |
Note:
All technical data provided above are based on typical values from the official Isola 370HR datasheet and internal test methods (e.g. IPC-TM-650, ASTM). Actual performance may vary depending on processing conditions, copper foil type, layer count, and final stackup configuration. For design-critical projects, contact Highleap Electronics for engineering consultation and stackup validation.
How Copper Foil Selection Affects PCB Reliability and Signal Performance with Isola 370HR
Copper foil plays a critical role in the performance and durability of PCBs, especially when using advanced laminates like Isola 370HR. While many engineers focus on resin systems or dielectric properties, the type of copper foil used can directly impact signal integrity, thermal reliability, and layer bonding strength.
Two common copper types used with Isola 370HR are Reverse Treat Foil (RTF) and HTE Grade 3 copper:
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RTF enhances adhesion by roughening the foil surface, making it suitable for general-purpose applications. However, in high-density or high-temperature environments, it may show reduced peel strength and higher risk of delamination.
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HTE Grade 3 copper, with its semi-matte Zn/Cr-treated finish, offers better thermal cycling performance, corrosion resistance, and bonding strength, making it ideal for HDI, blind-via, and high-frequency PCBs where long-term reliability is critical.
At Highleap Electronics, we don’t just manufacture — we consult. Our engineers help you choose the most suitable copper foil for your design goals, balancing cost, electrical performance, and mechanical durability. Whether you’re working on a 5G RF module, an automotive controller, or a multilayer backplane, we ensure that the Isola 370HR stackup — from copper to core — delivers exactly what your application needs.
Expert Stackup & Design Support for Isola 370HR PCB Projects
Choosing a high-performance material like Isola 370HR is only the first step. To achieve full functionality, engineers must carefully consider stackup configuration, copper balance, and resin flow — especially in multilayer, HDI, and RF applications.
At Highleap Electronics, we offer more than just PCB fabrication — we provide engineering-driven design support tailored for materials like Isola 370HR. Our team assists with:
- Custom stackup planning for optimal impedance control and thermal balance
- Material matching based on Tg, Td, CTE, and loss factor requirements
- Pre-layout guidance to reduce warpage, improve via reliability, and streamline lamination cycles
- Selecting between HTE vs RTF copper foils for different signal layer demands
- Navigating CAF mitigation and AOI-compatible builds
By involving Highleap early in your PCB development process, you reduce design risks, improve manufacturability, and ensure that Isola 370HR performs exactly as intended — from prototype to volume production.
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