High-Temperature Arlon 85N PCB Assembly & Fabrication Services
Highleap Electronics provides Arlon 85N PCB assembly and manufacturing using Arlon Electronic Materials, engineered for extreme high-temperature applications and aerospace-grade reliability.
Arlon 85N Materials PCB
Expert PCB Manufacturing for High-Temperature Applications — Including Arlon 85N Materials
At Highleap Electronics, we are a full-service PCB manufacturer and assembly house, capable of handling all mainstream and advanced laminate materials—from standard FR4 to Arlon 85N, Rogers materials, MEGTRON series, and beyond.
Our factory is equipped for rigid, HDI, RF, and multilayer PCB production, and we work with designers across industries to bring their high-temperature, thermally stable PCB designs to life with unmatched precision.
Arlon 85N, developed by Arlon Electronic Materials Division, is one of the premium materials we support. This revolutionary pure polyimide represents the ultimate laminate and prepreg system for PWBs requiring resistance to extreme high temperatures, both in process and end-use applications. Arlon 85N features bromine-free chemistry providing best-in-class thermal stability for applications with sustained high in-use temperatures as well as for lead-free soldering applications.
Technical Specifications of Arlon 85N Laminate
The following tables present the comprehensive technical specifications for Arlon 85N high-performance polyimide laminate and prepreg materials. All values are typical properties and are provided for engineering reference purposes.
Thermal Properties
| Property | Typical Value | Units | Test Method |
|---|---|---|---|
| Glass Transition Temperature (Tg) by TMA | ≥250 | °C | IPC-TM-650 2.4.24 |
| Glass Transition Temperature (Tg) by DSC | – | °C | IPC-TM-650 2.4.25 |
| Decomposition Temperature – Initial | 387 | °C | IPC-TM-650 2.4.24.6 |
| Decomposition Temperature – 5% weight loss | 407 | °C | IPC-TM-650 2.4.24.6 |
| Time to Delaminate – T260 | >60 | min | IPC-TM-650 2.4.24.1 |
| Time to Delaminate – T288 | >60 | min | IPC-TM-650 2.4.24.1 |
| Time to Delaminate – T300 | >60 | min | IPC-TM-650 2.4.24.1 |
| CTE (X,Y) | 16 | ppm/°C | IPC-TM-650 2.4.41 |
| CTE (Z) – Pre-Tg | 55 | ppm/°C | IPC-TM-650 2.4.24 |
| CTE (Z) – Post-Tg | 149 | ppm/°C | IPC-TM-650 2.4.24 |
| Z-axis Expansion (50-260°C) | 1.2 | % | IPC-TM-650 2.4.24 |
Electrical Properties
| Property | Typical Value | Units | Test Method |
|---|---|---|---|
| Dielectric Constant @ 1 MHz | 4.2 | — | IPC-TM-650 2.5.5.3 |
| Dielectric Constant @ 1 GHz | 4.0 | — | — |
| Dissipation Factor @ 1 MHz | 0.01 | — | IPC-TM-650 2.5.5.3 |
| Dissipation Factor @ 1 GHz | N/A | — | — |
| Volume Resistivity – C96/35/90 | 1.5 × 10⁸ | MΩ-cm | IPC-TM-650 2.5.17.1 |
| Volume Resistivity – E24/125 | 3.0 × 10¹⁰ | MΩ-cm | IPC-TM-650 2.5.17.1 |
| Surface Resistivity – C96/35/90 | 1.6 × 10⁸ | MΩ | IPC-TM-650 2.5.17.1 |
| Surface Resistivity – E24/125 | 1.6 × 10⁸ | MΩ | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 1450 (57.1) | Volts/mil (kV/mm) | IPC-TM-650 2.5.6.2 |
| Dielectric Breakdown | >40 | kV | IPC-TM-650 2.5.6 |
| Arc Resistance | 143 | sec | IPC-TM-650 2.5.1 |
Mechanical Properties
| Property | Typical Value | Units | Test Method |
|---|---|---|---|
| Peel Strength to Copper (1 oz/35 micron) – After Thermal Stress | 6.4 (1.1) | lb/in (N/mm) | IPC-TM-650 2.4.8 |
| Peel Strength to Copper (1 oz/35 micron) – At Elevated Temperatures | 6.4 (1.1) | lb/in (N/mm) | IPC-TM-650 2.4.8.2 |
| Peel Strength to Copper (1 oz/35 micron) – After Process Solutions | 6.4 (1.1) | lb/in (N/mm) | IPC-TM-650 2.4.8 |
| Young’s Modulus – CD/MD | 3.6/4.1 (24.8/28.2) | Mpsi (GPa) | ASTM E111 |
| Tensile Strength – CD/MD | 48/64 (330/440) | kpsi (MPa) | ASTM D3039 |
| Poisson’s Ratio | 0.18 | — | ASTM E13204 |
Physical Properties
| Property | Typical Value | Units | Test Method |
|---|---|---|---|
| Water Absorption (0.062″) | 0.27 | % | IPC-TM-650 2.6.2.1 |
| Density | 1.6 | g/cm³ | ASTM D792 Method A |
| Thermal Conductivity | 0.2 | W/mK | ASTM E1461 |
| Flammability | HB | class | UL 94 |
Additional Properties & Compliance
| Property | Specification | Details | Notes |
|---|---|---|---|
| IPC Compliance Standards | IPC-4101/40, IPC-4101/41 | Qualified Product Listing | Arlon EMD is first U.S. laminator recognized under IPC QPL |
| Environmental Compliance | RoHS/WEEE Compliant | Halogen-free chemistry | Bromine-free formulation |
| Resin System | Pure Polyimide | No secondary resin | No epoxy added, blended or reacted |
| Glass Transition Temperature | ≥250°C | Best-in-class thermal properties | Superior to typical high-performance epoxies |
| Processing Compatibility | Lead-free soldering | Compatible with HASL, IR Reflow | Toughened chemistry resists resin fracturing |
Important Technical Notes:
All technical values shown above are typical properties sourced directly from the official Arlon Electronic Materials 85N datasheet (Ver 1.6 © 2020). Results listed are typical properties, provided without warranty, expressed or implied, and without liability. Properties may vary, depending on design and application. Arlon reserves the right to change or update these values.
At Highleap Electronics, we use only authentic Arlon 85N laminates sourced directly from Arlon Electronic Materials and authorized distributors, ensuring quality and traceability in every production run.
Why Engineers Choose Arlon 85N for Extreme High-Temperature PCB Projects
At Highleap Electronics, we recommend Arlon 85N laminates for applications requiring the ultimate in thermal performance and long-term reliability. This pure polyimide material stands out for its exceptional thermal stability, mechanical strength, and processing reliability in the most demanding environments. Arlon 85N ensures exceptional signal integrity and thermal endurance, making it the ideal choice for applications requiring extreme high-temperature resistance and long service life.
Key Benefits of Arlon 85N
Ultimate Thermal Performance: Arlon 85N offers unmatched thermal stability with a glass transition temperature ≥250°C and decomposition temperature of 407°C, ensuring excellent performance even in demanding thermal environments, making it well-suited for extreme high-temperature electronics and aerospace applications.
Pure Polyimide Chemistry: As a pure polyimide with no secondary resin, epoxy blends, or reactions, Arlon 85N delivers consistent performance and superior chemical resistance. It features bromine-free chemistry for environmental compliance and maintains stable properties across wide temperature ranges.
Excellent PTH Reliability: Low Z-axis expansion of only 1.2% (50-260°C) minimizes the risk of plated through-hole failures during thermal cycling and high-temperature processing. This exceptional dimensional stability ensures reliable interconnect performance throughout the service life.
Industry Recognition and Compliance: Arlon 85N meets IPC-4101/40 and IPC-4101/41 specifications, is RoHS compliant, and features bromine-free chemistry for environmental safety and regulatory compliance. Available in both laminate and prepreg forms, Arlon 85N offers flexibility for complex multilayer designs.
Turnkey PCB Assembly with Arlon 85N
At Highleap Electronics, we specialize in providing complete Arlon 85N PCB fabrication and assembly solutions. Whether you’re working on 2-layer prototypes or advanced 60-layer HDI PCBs, we are your trusted partner for high-temperature PCBs. Our end-to-end services include design, material selection, fabrication, and assembly, tailored to meet your specific project needs.
Key Features of Our Arlon 85N PCB Services
- High-Temperature Processing: Optimized cure cycles for maximum Arlon 85N performance and reliability.
- Precision Impedance Control: Ensuring signal integrity with ±5% accuracy for RF and high-speed digital designs.
- Advanced HDI & Multilayer Processing: Expertise in microvias and complex stackups for high-density designs.
- Premium Surface Finishes: Options like ENIG and ENEPIG optimized for high-temperature applications.
- Complete Turnkey Assembly: SMT assembly for BGA, QFN, and 01005 components with rigorous QA testing.
At Highleap Electronics, we ensure that your Arlon 85N PCB projects meet the highest standards for reliability, performance, and cost-effectiveness, backed by our IPC Class 2/3 certification.
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