Select Page

Your PCB Manufacturing Expert – Highleap Electronic

10 Layer PCB Impedance Control and TDR Verification

10 Layer PCB Impedance Control and TDR Verification

Figure 1. 10 layer PCB impedance control coupon and TDR verification. Table of Contents Controlled Impedance Is a Stackup and Process Definition Inputs Required Before Trace Geometry Can Be Released Single-Ended, Odd-Mode and Differential Impedance Microstrip,...

10 Layer PCB Stackup Design for Impedance and Planes

10 Layer PCB Stackup Design for Impedance and Planes

Figure 1. 10 layer PCB stackup for impedance and plane planning. Table of Contents Choose a Layer Architecture Before Choosing Dielectric Thickness Three Useful 10 Layer Stackup Archetypes A Reference-Plane-Rich 10 Layer Example Press-Out, Copper and Impedance Closure...

10 Layer PCB Routing Rules for DDR5, PCIe and Crosstalk

10 Layer PCB Routing Rules for DDR5, PCIe and Crosstalk

Figure 1. 10 layer PCB routing rules for DDR5 PCIe and crosstalk. Table of Contents Freeze the Electrical Rules Before Routing Begins Layer Assignment and Return-Path Continuity Differential Pairs: Geometry, Skew and Transitions DDR5 and Other Parallel Memory...

10 Layer PCB Manufacturer for Rigid, Flex and Rigid-Flex

10 Layer PCB Manufacturer for Rigid, Flex and Rigid-Flex

Figure 1. 10 layer PCB manufacturer production capability. Table of Contents 10 Layer PCB Manufacturer for Rigid, Flex and Rigid-Flex Boards How to Choose a 10 Layer PCB Manufacturer 10 Layer PCB DFM, Material Selection and Design Support Before Production 10 Layer...

10 Layer AI Server PCB Engineering for Accelerator Hardware

10 Layer AI Server PCB Engineering for Accelerator Hardware

Figure 1. 10 layer AI server PCB for accelerator hardware. Table of Contents Where a 10 Layer PCB Fits in AI Infrastructure Classify the Board Before Selecting the Stackup Accelerator Packaging, HBM and the PCB Boundary PCIe, CXL and Ethernet Channel Engineering...

10 Layer PCB Cost Drivers for Materials, HDI and Testing

10 Layer PCB Cost Drivers for Materials, HDI and Testing

Figure 1. 10 layer PCB cost drivers for materials HDI and testing. Table of Contents Why a Universal Per-Board Price Is Misleading A Practical Cost Model for Ten-Layer Boards Rigid, Rigid-Flex and Flex Cost Structures Material, Copper and Surface-Finish Cost Drivers...

DSP Chip PCB Design and Assembly Guide

DSP Chip PCB Design and Assembly Guide

High-performance DSP chip boards need design, fabrication, assembly, and test decisions to be reviewed as one production workflow. Manufacturing answer: A DSP chip PCB should be reviewed in the correct production order: design and DFM first, bare PCB fabrication next,...

PCB EMI, EMS, and EMC: Definitions and Design Tips

PCB EMI, EMS, and EMC: Definitions and Design Tips

Figure 1. EMI, EMS, and EMC PCB design example for noise-control review. In PCB design, EMC (electromagnetic compatibility) is the goal of a board that neither emits excessive interference nor is unduly disturbed by its environment; EMI is the unwanted interference...

Panasonic Megtron 6 PCB Manufacturing

Panasonic Megtron 6 PCB Manufacturing

Figure 1.  Panasonic Megtron 6 PCBHighleap Electronics provides Panasonic Megtron 6 PCB manufacturing and PCB assembly services for high-speed digital PCB projects that require low-loss laminate processing, multilayer stackup control, tight impedance tolerance and...

Isola Agilex7 PCB Manufacturing for High-Speed FPGA and AI Hardware

Isola Agilex7 PCB Manufacturing for High-Speed FPGA and AI Hardware

Figure 1.  Isola Agilex7 PCBAHighleap Electronics provides PCB fabrication and PCB assembly for high-speed boards that specify Isola Agilex7, Isola low-loss laminates, or Agilex 7 FPGA-related stackups. Send your Gerber, ODB++, stackup, material callout and impedance...