PCB Reverse Engineering Advanced Technology

Introduction

PCB reverse engineering, also known as reverse technology, is a process of reproducing, analyzing, and researching the design of a target PCB board. This process involves deducing and obtaining the product’s design, processing flow, structure, functional characteristics, and technical specification elements to produce products with similar functions. Reverse engineering originated from hardware analysis in commercial and military fields, where the primary purpose is to analyze finished products and extract their design principles when necessary production information is not easily obtainable.

Highleap offers comprehensive PCB reverse engineering services, specializing in the meticulous reproduction of PCB boards, including all components. Our expert team is adept at reverse engineering boards with programmed ICs, custom parts, and obsolete components, creating all the necessary data for accurate duplication.

Our process begins with the meticulous identification of every electronic component on the board, followed by the creation of a detailed bill of materials. We then photograph every part of the board and carefully remove and glue each component to its location on a photocopy for reference.

As we progress, we refine the bill of materials by measuring values for resistors and capacitors. Finally, we create new bare boards based on our findings. An assembled sample is sent to the customer for thorough testing, ensuring the highest quality and accuracy in our replication process

What is PCB Reverse Engineering?

PCB reverse engineering is a meticulous process that involves the disassembly and detailed analysis of a physical product’s printed circuit board (PCB) to generate comprehensive documentation, facilitate remanufacturing, and gain insights into its original design and functionality. This process is instrumental in enabling customers to enhance their own products, surpassing competitors by understanding and replicating key design principles.

The process typically begins with the careful deconstruction of the PCB, where each component is identified, and its placement and connectivity are documented. Advanced imaging techniques, such as X-ray imaging and high-resolution photography, are often employed to capture intricate details of the PCB layout.

Following the initial documentation phase, engineers meticulously analyze the captured data to reconstruct the schematic diagram and bill of materials (BOM). This reconstruction process involves identifying the types and values of passive components like resistors and capacitors, as well as the functionality of integrated circuits (ICs) and other active components.

One of the key challenges in PCB reverse engineering is dealing with custom or obsolete components. In such cases, engineers may need to employ specialized techniques, such as IC decapsulation or reverse engineering of custom ASICs, to fully understand their functionality and replicate them accurately.

Moreover, reverse engineering also involves understanding the PCB’s manufacturing processes, including the materials used, layer stackup, and fabrication techniques. This knowledge is crucial for remanufacturing the PCB to the same quality standards as the original.

Overall, PCB reverse engineering is a complex yet essential process that empowers companies to enhance their products’ competitiveness by gaining a deep understanding of their competitors’ designs and technologies. It serves as a valuable tool for innovation, enabling companies to stay ahead in the fast-paced world of electronics manufacturing.

PCB Reverse Engineering Services by Highleap electronic

Highleap electronic is a leading provider of electronic reverse engineering services based in Guangzhou, China, with over ten years of engineering experience. Our dedicated team specializes in reverse engineering electronic hardware, offering a wide range of services to meet your needs.

Our PCB reverse engineering services include:

1. Reverse Engineering and Remanufacturing:
   • We excel in reverse engineering obsolete and unsupported electronic circuit boards and card assemblies.
   • Our team can determine how an item was designed and operates, reproducing it from the printed circuit board to the schematic.
2. Repair, Copy, or Clone:
   • Highleap electronic offers repair, copying, or cloning services for printed circuit boards that are no longer supported by the original equipment manufacturer (OEM).
   • We ensure that the replacement unit is a precise replica in form, fit, and function, meeting or exceeding the original specifications.
3. Intellectual Property Rights Compliance:
   • Before starting work, we conduct a thorough investigation and evaluation of the product to ensure that no intellectual property rights are breached.
   • Our processes adhere strictly to ethical standards and legal requirements to protect our clients’ intellectual property.

At Highleap electronic, we are committed to providing the best customer support in the PCB clone and PCB copy industry. We invite you to choose Highleap electronic for all your PCB reverse engineering needs.

Additionally, our PCB reverse engineering process can utilize 3D scanning technologies, such as laser scanners, structured light source converters, or X-ray tomography, to measure dimensions based on existing physical components. These technologies allow us to construct 3D virtual models through CAD, CAM, CAE, or other software.

For PCB copy board and chip decryption, we analyze physical electronic products and circuit boards to reverse engineer the original product’s PCB files, bill of materials (BOM) files, schematic and technical files, and PCB silkscreen production files. These files are then used for PCB board manufacturing, component soldering, flying probe test, circuit board debugging, and completing the full copy of the original circuit board template. Chip decryption involves directly obtaining the encrypted programming file in the MCU through specific equipment and methods, allowing for copying, programming, or disassembly for further reference and research.

With the help of special equipment or self-made equipment, our skilled engineers can use vulnerabilities or software defects in single-chip chip design to extract critical information and obtain the program in the single-chip microcomputer through various technical methods, ensuring comprehensive and accurate reverse engineering results.

Simple PCB Reverse Engineering Process

PCB reverse engineering, often referred to as copying, cloning, or imitation, is a meticulous process that involves extracting and restoring PCB files of electronic product circuit boards. This process allows for the replication of electronic products, ensuring that the copied board matches the original in form, fit, and function. At Highleap electronic, our expert engineers follow a detailed flow process to ensure the accuracy and quality of the reverse engineering process.

1. Initial Assessment:
   • Gather all relevant information about the PCB, including model, parameters, and component positions.
   • Use a digital camera to capture images of the PCB and component positions, paying close attention to diode, transistor, and IC orientations.
2. Component Removal and Cleaning:
   • Remove all components from the PCB and clean it thoroughly with alcohol.
   • Remove the tin in the PAD hole to prepare the PCB for scanning.
3. Scanning and Image Processing:
   • Place the cleaned PCB in a scanner and adjust the scanning settings to capture clear images.
   • Scan the top and bottom layers separately in color and save the images as black and white BMP format files (TOP.BMP and BOT.BMP).
   • Use image editing software like Photoshop to adjust the contrast and brightness of the images to ensure clear lines.
4. Conversion to PROTEL Format:
   • Convert the BMP format files into PROTEL format files and transfer the two layers in PROTEL.
   • Align the positions of PAD and VIA to ensure that the two layers coincide.
5. Tracing and Placement:
   • Convert the TOP layer BMP to TOP.PCB and trace the lines on the TOP layer according to the drawing from the initial assessment.
   • Place the components on the TOP layer as per the original PCB layout and delete the SILK layer after drawing.
6. Combining Layers:
   • Import the TOP.PCB and BOT.PCB into PROTEL and combine them into one picture.
7. Printing and Verification:
   • Print the TOP LAYER and BOTTOM LAYER on transparent film using a laser printer at a 1:1 ratio.
   • Place the film on the PCB and compare it with the original to check for errors.
8. Testing and Validation:
   • Test the copied PCB to ensure that its electronic performance matches that of the original board.
   • Make any necessary adjustments to ensure that the copied board functions identically to the original.
9. Finalization:
   • Once the copied board passes all tests and validations, the reverse engineering process is complete.
   • The copied board is now ready for use in replacement or replication applications.

For multi-layer boards, additional steps are required, including careful polishing of inner layers and repeated copying steps. Highleap electronic’s skilled engineers handle each step with precision and care to ensure the highest quality results in PCB reverse engineering.

Multilayer PCB Reverse Engineering Process

Step 1: Preparation

• Examine the circuit board for high-position components and record their details such as location number, package, and temperature value.
• Scan the PCB before component removal as a backup.
• Remove higher components first and then scan again to record images, ensuring a resolution of 600dpi.
• Clean the PCB surface thoroughly before scanning to ensure clear visibility of IC models and PCB characters.

Step 2: Component Disassembly and BOM Creation

• Use a small air gun to heat and remove components, starting with resistors, then capacitors, and finally ICs.
• Prepare a table with component details and record items like number, package, model, and value.
• Measure the value of components with a bridge, ensuring accuracy by measuring after the device temperature decreases.
• Input the component data into a computer for archiving.

Step 3: Tin Removal on Surface

• Use flux to remove remaining tin dross from the PCB surface where components were removed.
• Adjust the soldering iron temperature appropriately for multi-layer PCBs and remove the tin carefully to avoid burning the ink.
• Wash the PCB with board washing water or thinner water and dry it thoroughly.

Step 4: Real-time Operation in PCB Copy Software

• Set the scanned surface images as top and bottom layers and convert them into recognizable images for copying software.
• Package the components, including small silkscreen, pad aperture, and positioning holes, according to the bottom images.
• Adjust the characters to match the original board and sand off the silkscreen, ink, and characters on the PCB surface to expose bright copper.

Step 5: Checking and Precision Adjustment

• Use image processing software and PCB drawing software to make a 100% accurate judgment of the copied PCB.
• Check impedance and PCB indicators to ensure they are consistent with the original board.
• Adjust and correct the copy board for precision, focusing on software accuracy and original image quality.
• Set the DPI (dots per inch) based on the required accuracy of the board, with higher DPI for higher precision requirements.

Highleap electronic follows a meticulous process for multilayer PCB reverse engineering, ensuring accurate replication of electronic products. The detailed steps, from preparation to precision adjustment, guarantee the quality and functionality of the copied PCB, meeting the high standards of our clients.

PCB Reverse Engineering Techniques

PCB reverse engineering involves the process of uncovering the internal structure and connections of a printed circuit board (PCB) through either non-destructive or destructive methods. These methods are crucial for understanding the design and functionality of existing PCBs for various purposes like repair, replication, or analysis. Here, we’ll explore both non-destructive and destructive techniques.

Non-destructive PCB Reverse Engineering Technique

Non-destructive techniques are gaining popularity due to their lower costs, shorter duration, and the ability to detect faults. One of the most common non-destructive methods is X-ray tomography, which allows imaging of the entire PCB without delayering.

X-ray tomography is a non-invasive imaging method that provides detailed information about the PCB’s internal structure, including connections, via holes, and traces, without damaging the PCB. This technique captures all PCB layers (front, interior, and back) in a single imaging session.

The tomography process involves obtaining a series of 2D X-ray images from different angles and using mathematical algorithms to reconstruct a 3D image of the PCB. Parameters such as source power, detector objective, filtering, and exposure time are crucial for optimizing the image quality.

After reconstructing the 3D image, analysis of the interior and exterior structure is possible, allowing for detailed examination of the PCB’s components and connections.

Destructive PCB Reverse Engineering Techniques

Destructive techniques involve physically delayering the PCB to expose its internal layers. This process is typically used for multilayer PCBs and involves three main steps: solder mask removal, delayering, and imaging.

1. Solder Mask Removal: The solder mask is removed to expose the copper traces on the PCB’s top and bottom layers. This step is essential for obtaining a clear view of the copper traces.
2. Delayering: Delayering is the process of accessing the internal copper layers of a multilayer PCB. This is done through physical, destructive methods after removing all components from the PCB.
3. Imaging: Once the internal layers are exposed, individual images of each layer are obtained using non-destructive imaging methods such as X-ray or Computerized Tomography (CT) scanning.

These techniques provide valuable insights into the PCB’s design and functionality, allowing for replication or analysis. However, it’s important to note that destructive techniques can damage the PCB, making it unsuitable for reuse. Therefore, the choice between destructive and non-destructive techniques depends on the specific requirements of the project.

Conclusion

PCB reverse engineering is a valuable process that allows you to reconstruct a printed circuit board from its original design. Despite the increasing complexities of modern PCBs, reverse engineering can be successfully conducted with a clear set of plans and the right expertise.

Professional reverse engineers can help optimize your electronic production services by handling the most complex aspects of the process. Their expertise and experience ensure that the reverse engineering process is conducted efficiently and accurately, leading to high-quality results.

Frequently Asked Questions on PCB Reverse Engineering

1.What is the main purpose of PCB vias?

PCB vias provide a conductive path for electrical signals to pass through different layers of a PCB. They are essential for routing signals and power between layers in a multilayer PCB.

2.What is Reverse Engineering?

Reverse engineering is a process used to reproduce, duplicate, or improve chips and systems by analyzing an original device or system. In electronic systems, reverse engineering can be done at chip, board, and system levels, involving the analysis of multiple layers to understand the interior structure and connections.

3.What is the difference between PCB and PCBA?

A PCB (Printed Circuit Board) is a board used to electrically connect and mechanically support components, while a PCBA (Printed Circuit Board Assembly) is a PCB with components soldered onto it.

4.What is the difference between a schematic diagram and a PCB layout?

A schematic diagram is a wiring diagram that shows the components and how they are interconnected, while a PCB layout is the physical representation of the schematic, detailing the placement of components and routing of traces on the actual board.

5.Why is it important to generate the Gerber files?

Gerber files are necessary for PCB fabrication, as they contain the geometric information needed to create the circuit on the board. They are generated from 3D X-ray images obtained during the reverse engineering process.

6.What is the procedure of merging layers during PCB reverse engineering?

To merge layers in a double-layer PCB, you locate corresponding nets on each layer and connect them using vias. This process ensures that all connections between layers are accounted for in the final netlist.

7.How do I generate a netlist when reverse engineering PCB?

To generate a netlist, you locate the components and pads on each layer, and then create connections between them based on their electrical connectivity. This information is used to create a list of connections for each net.

8.What is the importance of BOM during reverse engineering PCB?

The Bill of Materials (BOM) is essential for identifying all the components needed to manufacture a PCB. It ensures that the correct components are used and provides documentation for the PCB assembly process.

9.Can I reverse engineer any PCB?

The feasibility of reverse engineering a PCB depends on factors such as technical complexity, economics, and availability of data. PCBs with wide usage and high per-unit cost are better candidates for reverse engineering.

10.Who has the intellectual property rights for a PCB reverse engineered schematic?

The developer of the reverse engineered schematic holds the intellectual property rights for that specific schematic. However, patent rights for the final product or system may be held by someone else.

11.What is the difference between double layer PCB and Multilayer PCB?

A double layer PCB has two conductive layers, allowing for routing of traces between the layers. A multilayer PCB has more than two conductive layers, enabling higher circuit density and complexity.

12.What is the difference between PCB and PCBA?

A PCB (Printed Circuit Board) is a board used to electrically connect and mechanically support components, while a PCBA (Printed Circuit Board Assembly) is a PCB with components soldered onto it.

13.What is the difference between a schematic diagram and a PCB layout?

A schematic diagram is a wiring diagram that shows the components and how they are interconnected, while a PCB layout is the physical representation of the schematic, detailing the placement of components and routing of traces on the actual board.

14.What is Reverse Engineering?

Reverse engineering is a process used to reproduce, duplicate, or improve chips and systems by analyzing an original device or system. In electronic systems, reverse engineering can be done at chip, board, and system levels, involving the analysis of multiple layers to understand the interior structure and connections.

15.Does Computerized Tomography have limitations?

Computerized Tomography (CT) has limitations in terms of field of view size, which can affect the quality and resolution of the obtained images. Multiple segments may need to be created and stitched together to process the entire PCB.