Highleap Electronic PCB Reinforcement Plate Manufacturing Guidelines
At Highleap Electronic, the production of PCB reinforcement plates follows a comprehensive and detailed process, ensuring the highest standards of quality, functionality, and precision in all our circuit board designs. This process is tailored to meet the specific requirements of CAM engineers and aims to create durable, reliable PCBs capable of withstanding mechanical and electrical stresses in a variety of applications. The following document outlines the detailed and comprehensive set of guidelines for the design and manufacturing of PCB reinforcement plates.
1. Definition of PCB Reinforcement Plates
a. General Definition
A reinforcement plate is a layer added to the PCB (Printed Circuit Board) to enhance its rigidity and strength. Typically made of FR4 laminate, it is bonded onto the PCB substrate to increase the thickness, provide mechanical support, and facilitate the insertion of components. The reinforcement plate serves multiple purposes:
- Increased Rigidity and Strength: It provides additional strength to areas of the PCB where heavy components or connectors are installed, preventing bending or warping.
- Enhanced Component Insertion: Reinforcement plates ensure secure component placement and prevent movement or damage during PCB assembly.
- Mechanical Stability: The added reinforcement prevents PCB deformation during handling, soldering, and testing processes.
b. Bonding Materials
The reinforcement plate is typically bonded to the PCB using either PP sheets (polypropylene) or pure adhesive. The bonding material ensures the plate stays firmly attached to the PCB during the manufacturing and assembly processes. The adhesive material often includes windows or slots that expose key component positions on the PCB, as indicated in the diagram and specifications.
c. Special Reinforcement Plates
There are cases where only PP sheets or pure adhesive (without FR4 laminate) are used. In these instances, the processing steps for PP and pure adhesive reinforcement plates remain similar to the standard reinforcement process, excluding any steps related to the FR4 laminate.
2. Production Process Flow for Reinforcement Plate Integration
The production of reinforcement plates involves a series of well-defined processes that ensure the accurate integration of the reinforcement into the PCB. The following steps outline the manufacturing process:
a. General Production Workflow
The production workflow is as follows:
- Pre-production Setup
- Electrical Testing: Ensure the PCB functions correctly before applying the reinforcement plate.
- Milling Process 2: Includes two separate milling programs—one for FR4 laminate (rough milling) and another for pre-preg material or cutting pure adhesive.
- Layering Process 1 (Lamination): The reinforcement plate is bonded to the PCB substrate.
- Final Milling: Additional milling is done to trim excess material and fine-tune the final shape of the reinforcement.
- Post-production Process: Any finishing steps, including cleaning and final inspection.
b. Key Features for Alignment
The reinforcement plate and PP sheet must have corresponding 3.175mm rivet alignment holes on the PCB. These holes are crucial for aligning the reinforcement during the lamination process, ensuring accurate placement.
c. FR4 Laminate Process Flow
The FR4 laminate follows a specific set of steps for processing:
- Material Cutting → Outer Layer Etching (FR4 laminate is etched) → Drilling → Milling Process 2 → Layering Process 1 (Lamination)
d. Special Reinforcement Process for Strip Shapes
In cases where reinforcement is applied in narrow strip shapes, the cutting process must account for the additional pressure plates. Milling Process 2 will consist of two operations: one for milling the reinforcement and another for milling the pressure plates.
3. FR4 Laminate Reinforcement Window Opening Rules
The window opening in the reinforcement plate is an essential feature to allow for proper component placement and avoid interference during assembly. The window opening must follow strict dimensional guidelines to ensure a perfect fit.
a. Window Opening Specifications
To accommodate the adhesive flow and ensure a good bond, the window dimensions are adjusted as follows:
- The window in the PP sheet or resin must be 26 mil larger than the corresponding hole or slot on the PCB.
- The window in the FR4 laminate reinforcement plate must be 16 mil larger than the corresponding hole or slot on the PCB.
These adjustments ensure that the adhesive can flow freely without obstructing important components or pathways.
b. Handling Special Customer Drill Size Requirements
If the customer’s required drill size (B) is smaller than the PCB’s hole size (A), the following procedure is followed:
B – A < 0 mil: The difference should be adjusted by increasing B by 16 mil on each side. If the customer insists on the original design, the PP hole size (C) will be increased by 26 mil to prevent any adhesive overflow into the hole.
c. FR4 Reinforcement Hole Size Regulations
If the customer’s FR4 reinforcement drill hole size (B) is greater than or equal to the hole size (A) on the PCB, but less than 16 mil (i.e., 0 mil ≤ B – A < 16 mil), the difference should be standardized to 16 mil.
d. Minimum Opening Size Requirements
If the customer’s hole design satisfies the minimum opening size requirement (B – A ≥ 16 mil), the window dimensions in the FR4 reinforcement plate can follow the customer’s original design specifications.
e. Handling Design Omissions or Irregularities
In cases where the customer specifies only reinforcement without providing a window design (or provides an incomplete design), the following rules apply:
- NPTH or Component Holes: If these holes are covered by the FR4 reinforcement, they must have corresponding windows.
- Vias: Vias typically do not require windows unless specified by the customer. If vias are included in the design, it must be confirmed with the customer whether they should be filled or left open.
4. Graphic Design and Slot Considerations
To ensure optimal manufacturing efficiency and precision in the production of reinforcement plates, it is critical to simplify the graphic and slot design. Complex patterns, intricate geometries, or interconnected holes can introduce significant challenges during the milling and drilling processes, potentially leading to production errors, delays, or complications that affect the overall quality of the final product.
a. Simplification of Graphic and Hole Designs
It is strongly advised to avoid intricate and irregular designs, such as figure-eight interconnected holes or non-standard geometric patterns, as these can significantly complicate the milling and drilling processes. Complex shapes not only increase the likelihood of errors but can also extend production timelines, resulting in higher costs and potential defects. By opting for simpler, more straightforward designs, manufacturers can streamline the production process, improve operational efficiency, and ensure consistency in quality.
b. Slot Placement and Clearance Requirements
Proper slot placement is essential to prevent interference with adjacent components, vias, and pads. Slots must be strategically designed with sufficient clearance from these areas to avoid mechanical and electrical conflicts. The slot design should facilitate smooth milling operations, ensuring that the reinforcement plate does not obstruct crucial components or areas of the PCB, such as signal tracks, vias, or component pads. Adequate clearance is essential to maintain both the structural integrity of the PCB and the electrical performance, preventing any disruptions in signal transmission or component placement.
5. FR4 Laminate Slot Design Guidelines
When designing reinforcement slots for PCBs, it is crucial to ensure that the slots do not interfere with the functionality of the circuit board, particularly around component pads and solder rings. The minimum distance between the edge of the slot and any component pad or solder ring should be at least 0.5mm to maintain proper clearance for component placement and soldering. Additionally, the PP window in areas where the slot intersects with pads should be 10 mil larger than the slot edge to allow for adequate adhesive flow and ensure that the reinforcement plate bonds securely without obstructing the pads or solder rings.
The placement of slots near vias and high-density areas of the PCB must be carefully considered. Slots should avoid overlapping critical signal traces or power planes, as this could affect the PCB’s electrical performance. When slots are placed near vias, extra care should be taken to ensure they do not interfere with the via integrity or soldering. Slots should also be strategically positioned to avoid obstructing critical tracks or high-speed signals. In high-density areas, smaller, compact slots may be preferable to maintain sufficient space for components and ensure that the PCB remains functional and mechanically stable.
Finally, the design of slots must prioritize ease of milling and manufacturing. Slots with sharp angles or irregular shapes can complicate the milling process, leading to production delays or defects. To avoid such issues, slots should have smooth transitions and consistent widths to facilitate efficient milling. After milling, post-processing checks should be conducted to ensure that the slot edges are smooth and free from burrs or defects, which could affect the adhesive bond or component placement. By following these detailed slot design guidelines, the reinforcement plate can be integrated seamlessly into the PCB without compromising performance or manufacturability.
6. Adhesive Selection for Reinforcement Plate Bonding
The adhesive used to bond the reinforcement plate to the PCB is a critical component in ensuring a secure and durable connection. The following guidelines for adhesive selection are based on the copper thickness and the type of reinforcement material used:
Adhesive Selection Rules
- For Pure Adhesive (Cu ≤ 70um): Use 40um pure adhesive for bonding the reinforcement plate.
- For Finished Copper Thickness ≤ 70um: When the reinforcement is applied to the solder mask side or when the remaining copper is ≥ 80%, use 1 sheet of VT-47 106NF adhesive.
- For Finished Copper Thickness ≤ 70um (excluding the above case): Use 2 sheets of VT-47 106NF adhesive.
- For Finished Copper Thickness > 70um: Adhesive selection must be reviewed and assessed based on specific requirements.
Why Choose FR4 PCB Reinforcement for Your Designs?
Increased Mechanical Strength
FR4 PCB reinforcement enhances the rigidity of your circuit boards, making them more durable and resistant to mechanical stress. This added strength is essential for applications requiring robust performance in challenging environments, ensuring your products withstand physical handling, vibration, and thermal expansion.
Enhanced Component Stability
With FR4 reinforcement, your components stay securely in place during assembly and operation. This stability reduces the risk of component shifting or damage, offering peace of mind for long-term reliability and performance, even in demanding conditions.
Improved Durability for High-Stress Areas
Reinforced FR4 PCBs are designed to support heavy components and connectors, preventing warping and bending. This makes them the perfect choice for industries that demand high-reliability and consistent performance, such as automotive, telecommunications, and industrial applications.
Prevents PCB Deformation During Handling
FR4 reinforcement ensures that your PCBs maintain their shape during production, soldering, and testing. This minimizes the risk of deformation, delivering higher-quality boards that perform reliably throughout their lifecycle.
At Highleap Electronic, we take pride in offering custom FR4 PCB reinforcement solutions tailored to meet the specific needs of your project. Whether you’re working on high-density designs or complex applications, our high-quality reinforcement plates ensure your PCBs stand the test of time—delivering both performance and reliability. Choose Highleap Electronic for superior PCBs that meet the highest industry standards.
Conclusion
At Highleap Electronic, we specialize in producing high-quality, durable, and reliable PCBs through a meticulous and well-defined manufacturing process. Our expertise in creating reinforcement plates for PCBs ensures that we can deliver products with enhanced strength, mechanical stability, and precise component placement. By adhering to comprehensive guidelines—ranging from reinforcement plate definitions, production processes, and window opening specifications to adhesive selection—our CAM engineers are equipped to create engineering files that meet all required quality, functionality, and design standards.
We pride ourselves on our ability to handle even the most complex PCB designs, from basic to high-density circuit boards, ensuring that our solutions meet the demanding requirements of industries such as automotive, telecommunications, consumer electronics, and medical devices. Whether it’s advanced multi-layer boards or specialized reinforcement configurations, Highleap Electronic is committed to delivering cutting-edge PCB solutions that meet the evolving needs of our customers. By leveraging our advanced manufacturing processes and industry expertise, we ensure that your PCBs perform reliably in even the most challenging applications.
FAQs
What is the purpose of a PCB reinforcement plate?
A PCB reinforcement plate increases the rigidity and strength of the circuit board, helping it withstand mechanical stress, improve component placement, and maintain stability during assembly and operation.
How does Highleap Electronic ensure the quality of its PCB reinforcement plates?
We follow a comprehensive production process that includes strict guidelines for bonding materials, milling techniques, and adhesive selection, ensuring that every PCB reinforcement plate meets high-quality standards for durability and performance.
Can I customize the design of the PCB reinforcement plate?
Yes, Highleap Electronic offers tailored solutions. We work closely with clients to customize the reinforcement plate design, whether you require specific dimensions, material types, or unique configurations for high-density PCBs.
What types of materials are used for bonding the reinforcement plate to the PCB?
We use PP sheets (polypropylene) or pure adhesive for bonding the reinforcement plate to the PCB. These materials ensure a strong, reliable attachment and allow for the inclusion of windows or slots to expose key component positions.
How do you handle complex PCB designs with multiple reinforcement plates?
Highleap Electronic has the expertise to manage complex PCB designs, including multi-layer boards and specialized reinforcement configurations. Our advanced manufacturing processes ensure precision, even in the most challenging designs, maintaining the integrity and functionality of the final product.
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