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HS PCB Materials and Manufacturing Solutions

Circuit Boards Manufactured by HS PCB Materials

In today’s high-frequency electronics landscape, material selection determines the success or failure of cutting-edge designs. From 5G base stations operating at millimeter wave frequencies to automotive radar systems requiring ultra-low loss characteristics, the choice of PCB substrate material directly impacts signal integrity, thermal management, and overall system performance.

At Highleap Electronics, we specialize in PCB manufacturing and assembly using the most advanced high-speed materials available. While we do not manufacture these materials ourselves, our extensive processing capabilities and deep technical expertise enable us to deliver exceptional results with any high-performance substrate you specify.

Why High-Speed PCB Materials Matter

Modern electronics demand substrates that deliver consistent electrical performance across wide frequency ranges while maintaining mechanical reliability under challenging environmental conditions. Critical requirements include ultra-low dielectric loss for minimal signal attenuation, stable dielectric constants across temperature variations, superior thermal management capabilities, and dimensional stability during manufacturing processes.

The materials listed below represent the industry’s most advanced solutions, each engineered for specific applications ranging from microwave communications to high-speed digital processing.

Rogers High Speed PCB Materials – RO4000, RO3000, RT/duroid Series

Rogers high speed PCB materials remain the industry benchmark for RF and microwave applications, delivering proven performance across frequencies from DC to beyond 100 GHz.

RO4000 Series – Hydrocarbon Ceramic Laminates

The industry standard for cost-effective high-frequency performance, combining the electrical benefits of PTFE with the processing ease of FR-4.

  • RO4003C: Dk=3.38, Df=0.0027 at 10GHz – Most widely used for balanced cost and performance
  • RO4350B: Dk=3.48, Df=0.0037 at 10GHz – Enhanced thermal conductivity for power applications
  • RO4450F: Dk=3.52, Df=0.0040 at 10GHz – Optimized for high layer count designs
  • RO4360G2: Dk=6.15, Df=0.0038 at 10GHz – Higher dielectric constant option
  • RO4830: Dk=3.24, Df=0.0025 at 10GHz – Lower loss alternative
  • RO4835: Dk=3.48, Df=0.0035 at 10GHz – Excellent for automotive radar up to 77GHz

RO3000 Series – High-Performance Ceramics

Engineered for demanding microwave applications requiring exceptional electrical stability.

  • RO3003: Dk=3.00, Df=0.0013 at 10GHz – Ultra-low loss for critical applications
  • RO3006: Dk=6.15, Df=0.0020 at 10GHz – Higher dielectric constant with low loss
  • RO3010: Dk=10.2, Df=0.0035 at 10GHz – High Dk for size-constrained designs
  • RO3035: Dk=3.5, Df=0.0015 at 10GHz – Excellent for broadband applications

RT/duroid Series – PTFE Composites

Premium PTFE-based materials for the most demanding aerospace and defense applications.

  • RT/duroid 5870: Dk=2.33, Df=0.0012 at 10GHz – Glass microfiber reinforced
  • RT/duroid 5880: Dk=2.20, Df=0.0009 at 10GHz – Industry lowest loss standard
  • RT/duroid 6002: Dk=2.94, Df=0.0012 at 10GHz – Ceramic filled for stability
  • RT/duroid 6010LM: Dk=10.2, Df=0.0023 at 10GHz – High dielectric constant option

TMM Thermoset Microwave Materials

Ceramic-filled thermoset composites offering dimensional stability with excellent electrical properties.

  • TMM3: Dk=3.27, Df=0.0020 at 10GHz – Ideal for patch antennas
  • TMM4: Dk=4.5, Df=0.0020 at 10GHz – Balanced performance
  • TMM10: Dk=9.20, Df=0.0020 at 10GHz – High dielectric constant
  • TMM10i: Dk=9.80, Df=0.0020 at 10GHz – Enhanced version of TMM10
  • TMM13i: Dk=12.85, Df=0.0019 at 10GHz – Highest dielectric constant option

Isola Ultra Low Loss PCB Materials – I-Tera, ASTRA, I-Speed Series

Isola ultra low loss PCB materials provide advanced solutions for high-speed digital and RF applications, with exceptional electrical performance optimized for next-generation communication systems.

I-Tera Series – Ultra-Low Loss Performance

Designed for high-speed digital and RF/microwave applications with exceptional electrical stability across wide temperature ranges.

  • I-Tera MT40: Dk=3.45, Df=0.0031 at 10GHz – Stable from -55°C to +125°C, cost-effective PTFE alternative

ASTRA Series – Automotive and Communications

Advanced materials optimized for automotive radar and high-frequency communications with excellent temperature stability.

  • ASTRA MT77: Dk≈3.0, Df=0.0017 at 10GHz – Consistent performance from -40°C to +140°C

I-Speed and Advanced Digital Materials

Engineered for high-speed digital applications requiring controlled impedance and low skew.

  • I-Speed: Dk=3.2, Df=0.009 at 1GHz – High-speed digital applications
  • Tachyon 100G: Ultra-low loss for 100G+ data transmission systems
  • TerraGreen 400G: Dk=3.45, Df=0.0037 – Environmentally conscious high-performance option

Panasonic Megtron High Speed PCB Materials – Megtron 6, 7, 8 Series

Panasonic Megtron high speed PCB materials represent cutting-edge multilayer PCB technology engineered for ultra-low loss performance in 5G infrastructure, high-speed computing, and advanced communication systems.

Megtron 8 Series – Next Generation Ultra-Low Loss

  • Megtron 8: Dk=3.1, Df=0.0012 at 1GHz, Tg=220°C – Industry’s lowest transmission loss

Megtron 7 Series – 5G Infrastructure Ready

Ultra-low dielectric constant and dissipation factor make Megtron 7 ideal for high-speed and large data volumes associated with 5G servers and routers.

  • Megtron 7: Dk=3.6, Df=0.0015 at 1GHz, Tg=200°C
  • Megtron 7(N): Low Dk glass cloth variant for enhanced electrical performance
  • Megtron 7(GE): Environmentally optimized formulation
  • Megtron 7(GN): Combined benefits of low Dk glass and environmental compliance

Megtron 6 Series – Proven High-Performance Standard

The original PCB industry standard for ultra-low loss, highly heat resistant circuit board materials ideal for mobile, networking, and wireless applications.

  • Megtron 6: Dk=3.7, Df=0.002 at 1GHz, Td=410°C – Excellent thermal and electrical performance
  • Megtron 6(G): Enhanced glass fabric version
  • Megtron 6(K): Specialized variant for specific applications
  • Megtron 6(N): Low dielectric constant glass cloth option

Specialty High Frequency PCB Materials – Taconic, Arlon, ITEQ

Specialty high frequency PCB materials from leading manufacturers provide targeted solutions for demanding microwave, millimeter wave, and high-temperature applications.

Taconic – PTFE and Ceramic Solutions

Specialized materials for demanding microwave and millimeter wave applications.

  • TLY-5A: Dk=2.17, Df=0.0009 – PTFE/glass for lowest loss
  • TLX-0: Dk=2.45, Df=0.0019 – Ceramic filled PTFE
  • TLX-6: Dk=2.65, Df=0.0025 – Higher dielectric constant option
  • CER-10: Dk=10.0, Df=0.0035 – High dielectric constant ceramic

Arlon Materials – High-Temperature Solutions

  • AD1000: Dk=10.2, Df=0.0023 – Ceramic filled for high power
  • 25N: Dk=3.38, Df=0.0025 – Woven glass reinforced
  • 25FR: Dk=3.43, Df=0.0035 – Flame retardant version

ITEQ Corporation – Cost-Effective Performance

Taiwan-based manufacturer offering competitive high-frequency solutions.

  • IT-8350G: Dk=3.48, Df=0.0037 – Rogers 4350B alternative
  • IT-933G: Dk=3.0, Df=0.0017 – Ultra-low loss option
  • IT-180A: Dk=3.0, Df=0.0035 – High-speed digital applications

Ventec International – Specialized Applications

  • VT-47: Dk=3.7, Df=0.009 – High-speed digital
  • VT-901: Dk=3.0, Df=0.0035 – Low loss RF applications
HS Materials PCB

High Performance FR-4 PCB Materials – Shengyi Advanced Series

High performance FR-4 PCB materials offer enhanced thermal and electrical properties for demanding applications requiring improved performance over standard FR-4 while maintaining cost-effectiveness.

Shengyi Technology – Advanced FR-4 Solutions

While primarily FR-4 based, Shengyi’s advanced materials offer improved performance for high-layer count and thermally demanding applications.

  • S1000-2: Tg=170°C (DSC), enhanced thermal performance for high layer count PCBs
  • S1000H: Tg=155°C, low Z-axis CTE, exceptional anti-CAF performance
  • S1170: Enhanced thermal and electrical properties for demanding applications

Highleap Electronics: Your Trusted Manufacturing Partner

As a premier PCB manufacturing and assembly facility in China, Highleap Electronics possesses the advanced capabilities, technical expertise, and quality systems necessary to process every material listed above with precision and reliability.

Advanced Manufacturing Capabilities

Precision Processing Systems: Our state-of-the-art facility features laser drilling systems capable of handling PTFE materials, controlled impedance manufacturing with ±5% tolerance, and fine line/space capabilities down to 75μm/75μm for high-density designs.

Material Expertise: Our engineering team understands the unique processing requirements for each material family. PTFE-based materials like Rogers RT/duroid series require specialized drilling parameters and routing techniques to prevent delamination. Hydrocarbon ceramics such as the Rogers RO4000 series benefit from our optimized lamination cycles and controlled moisture management. Low-loss thermosets including Panasonic Megtron series utilize our precision temperature profiling and advanced pressing techniques.

Quality Assurance Excellence: We maintain comprehensive quality control throughout the manufacturing process, including incoming material inspection and verification, real-time process monitoring and control, electrical testing including TDR and network analysis, and detailed dimensional verification and documentation.

Complete Assembly Services

Beyond PCB manufacturing, we provide full electronics assembly capabilities including surface mount technology assembly with fine pitch capability down to 0201 components, through-hole assembly with selective soldering, mixed technology assembly combining SMT and PTH, and complete system integration with functional testing.

Application Expertise

Our manufacturing capabilities support diverse industries and applications including 5G telecommunications infrastructure using Rogers RO3003 and Panasonic Megtron 7, automotive radar modules employing RO4350B and I-Tera MT40, aerospace and defense systems utilizing RT/duroid and TMM materials, and high-speed computing platforms incorporating Megtron 8 and advanced digital materials.

Getting Started with Your High-Speed PCB Project

Highleap Electronics streamlines the process from design review to production delivery with our comprehensive approach to high-speed PCB manufacturing.

Design File Submission

Submit your complete design package including Gerber files in RS-274X format, drill files in Excellon format, assembly drawings with component placement details, bill of materials with manufacturer part numbers, and any special processing requirements or specifications.

Expert Engineering Review

Our experienced engineering team provides material selection guidance based on your electrical requirements, stackup optimization for controlled impedance and signal integrity, design for manufacturability recommendations to improve yield and reduce cost, and comprehensive technical feedback within 24 hours.

Manufacturing Excellence

We deliver rapid prototyping with 5–7 day quick turn capability, scalable production from single prototypes to medium volume runs, flexible delivery options including express worldwide shipping, and complete traceability documentation for critical applications.

Partner with Highleap Electronics Today

Transform your high-speed designs into reality with China’s most capable PCB manufacturing and assembly partner. Our combination of advanced equipment, material expertise, and quality focus ensures your projects meet the most demanding electrical and mechanical requirements.

Ready to begin your next high-speed PCB project? Contact Highleap Electronics today with your design files and specifications. Our engineering team stands ready to help you navigate material selection, optimize your design for manufacturing, and deliver exceptional results on schedule.

Whether your application demands the ultra-low loss characteristics of Rogers RT/duroid 5880, the thermal performance of Panasonic Megtron 8, or the cost-effective reliability of Isola I-Tera MT40, Highleap Electronics has the capabilities and experience to bring your most challenging designs to life.

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How to get a quote for PCBs

Let‘s run DFM/DFA analysis for you and get back to you with a report. You can upload your files securely through our website. We require the following information in order to give you a quote:

    • Gerber, ODB++, or .pcb, spec.
    • BOM list if you require assembly
    • Quantity
    • Turn time

In addition to PCB manufacturing, we offer a comprehensive range of electronic services, including PCB design, PCBA, and turnkey solutions. Whether you need help with prototyping, design verification, component sourcing, or mass production, we provide end-to-end support to ensure your project’s success.

For PCBA services, please provide your BOM (Bill of Materials) and any specific assembly instructions. We also offer DFM/DFA analysis to optimize your designs for manufacturability and assembly, ensuring a smooth production process.