Shengyi S1170 PCB Material for High-Tg Lead-Free Multilayer PCB Manufacturing

Shengyi S1170 PCB material is a lead-free compatible, high-Tg FR-4 laminate used for multilayer PCB projects that need better thermal resistance, lower Z-axis expansion, anti-CAF performance, and low water absorption compared with ordinary FR-4. It is commonly considered for high-count layer PCBs, communication equipment, industrial control boards, routers, instruments, and other electronics where reliability and production consistency matter.

Highleap Electronics manufactures and assembles PCBs using customer-approved Shengyi materials such as S1170. Highleap does not manufacture laminate, prepreg, resin, glass cloth, copper foil, or copper-clad laminate. When S1170 is specified by the drawing, AVL, or customer engineering release, the manufacturing task is to control stackup, material sourcing, DFM, fabrication, assembly, inspection, and traceability around the approved material requirement.

Shengyi S1170 material overview

Material family
Shengyi lead-free compatible high-Tg FR-4 laminate.

Key material value
Excellent thermal stability, anti-CAF performance, low Z-axis CTE, and low water absorption.

Typical public data
S1170 public data lists Tg 170°C minimum by DSC, typical Tg around 175°C, Td typical 335°C, Df 0.012 at 1 MHz, and water absorption 0.10%.

Important distinction
S1170 should not be confused with S1170G; halogen-free status depends on the exact Shengyi grade and data sheet.

Related material and manufacturing topics: S1170 projects often connect with S1000-2M PCB material, NPG-180BH PCB material, KB-6168LE PCB laminate, Low CTE FR-4, 10-layer PCB materials, PCB impedance control, and PCB assembly services.

Shengyi S1170 Material Overview for PCB Manufacturing

S1170 is positioned as an excellent thermal resistance / high-Tg FR-4 material. Public Shengyi data describes it as a lead-free compatible FR-4 laminate with high Tg, excellent thermal stability, excellent anti-CAF performance, low Z-axis CTE, and low water absorption. That combination makes it useful for multilayer boards that need a stronger reliability margin than standard FR-4 without moving into specialized high-speed or RF laminates.

For PCB buyers and engineers, the material overview matters because S1170 is usually specified to control reliability rather than to create a marketing label. The fabrication drawing and stackup need to define the approved grade clearly, especially when similar Shengyi names such as S1170G, S1000-2M, or other high-Tg FR-4 grades are also used in the same organization.

Material item	S1170 positioning	Manufacturing meaning
Supplier	Shengyi Technology	Material approval and traceability follow the specified Shengyi grade.
Material family	Lead-free compatible high-Tg FR-4 laminate	Suitable for lead-free multilayer PCB projects requiring better thermal stability.
Tg class	Specification minimum 170°C by DSC; typical value around 175°C in public data	Supports lead-free assembly margin and thermal resistance review.
Thermal performance	Public data lists thermal stress resistance and T260 / T288 values	Useful for soldering exposure, rework, and reliability planning.
Z-axis expansion	Low Z-axis CTE compared with standard FR-4; public data lists 3.3% from 50°C to 260°C	Important for plated-through-hole reliability and multilayer durability.
Moisture absorption	Public data lists typical water absorption around 0.10%	Relevant to moisture sensitivity, storage, soldering, and long-term stability.
Halogen-free status	Do not assume for S1170; verify exact grade and data sheet	S1170 and S1170G are not the same material callout.

Engineering note: S1170 is a material-specific callout. A drawing that specifies S1170 does not automatically approve S1170G, S1000-2M, another Shengyi grade, or a different supplier equivalent.

Engineering Data, Test Methods, and Release Documents

S1170 data should be reviewed with its test condition. Tg, Dk, Df, water absorption, CTE, peel strength, and thermal stress values are tied to specimen thickness, frequency, conditioning, and test method. The engineering release needs to identify the material grade and stackup construction clearly so the PCB manufacturer does not rely on generic FR-4 assumptions.

Property / document	Typical S1170 public reference	Common standard or test context	PCB manufacturing use
Tg	Spec ≥170°C by DSC; typical 175°C in public data	DSC; IPC-TM-650 context where applicable	Lead-free assembly margin and thermal reliability
Td	Spec ≥325°C; typical 335°C in public data	TGA, 5% weight loss in public data	Thermal decomposition resistance screening
Dk	Typical 4.6 at 1 MHz in public data	Frequency-specific dielectric testing	Impedance calculation for standard digital and mixed-signal boards
Df	Typical 0.012 at 1 MHz in public data	Frequency-specific dielectric testing	Not positioned as ultra-low-loss material; verify if high-speed loss budget matters
Z-axis CTE	Public data lists before Tg 55 ppm/°C, after Tg 280 ppm/°C, and 3.3% from 50–260°C	TMA	PTH reliability and high-layer-count board planning
Water absorption	Typical 0.10% in public data	D-24/23 type conditioning in public data	Moisture control, soldering exposure, and long-term stability
CAF	Excellent anti-CAF performance in public data	Supplier test condition; public data shows 85°C / 85% RH / DC 50 V example	Dense via designs, humidity exposure, and reliability review
Material specification	IPC-4101/124 reference for S1170 public data	IPC-4101 and customer AVL	Material categorization and customer approval

Release documents that support S1170 production

The engineering release normally includes material callout, stackup documentation, Shengyi S1170 data sheet reference, IPC-4101 slash sheet or customer specification, UL 94 V-0 documentation, RoHS / REACH statements if required, controlled impedance table, inspection report requirements, and approved alternate-material rules.

Material Selection Guide: S1170, S1000-2M, NPG-180BH, and KB-6168LE

S1170 often appears in the same engineering conversation as S1000-2M, NPG-180BH, KB-6168LE, and other high-reliability FR-4 materials. The right material depends on the approved supplier list, Tg target, CTE target, CAF risk, halogen-free requirement, cost target, and production history.

Material	Typical Tg class	Thermal / CTE direction	CAF / compliance direction	Typical application fit	Selection note
Shengyi S1170 PCB material	170°C class; typical 175°C in public data	Low Z-axis CTE; 3.3% 50–260°C expansion in public data	Excellent anti-CAF; lead-free compatible	High-count layer PCBs, communication equipment, industrial control, instruments	Choose when the drawing specifies S1170 and high-Tg lead-free FR-4 reliability is required.
Shengyi S1000-2M	180°C class in Shengyi public product listing	Low CTE and high thermal resistance positioning	CAF-resistant high-reliability Shengyi material direction	High-layer-count, server, telecom, industrial, lead-free multilayer boards	Choose when higher Tg class and S1000-2M approval are required.
NPG-180BH PCB material	High-Tg around 180°C class	Ultra-low CTE positioning	Halogen-free and anti-CAF material direction	Automotive-related, power, thick copper, high-reliability industrial boards	Choose when Nan Ya halogen-free / low-CTE requirements are specified.
KB-6168LE PCB laminate	190°C in Kingboard listing	Low Z-CTE, 2.1% in Kingboard listing	Anti-CAF; CTI 300 V in Kingboard listing	Automotive-related, high-layer-count, telecom, industrial, server PCBs	Choose when Kingboard low Z-CTE material approval is the main requirement.

The comparison supports material screening but does not replace AVL control. Any proposed substitution needs engineering approval before procurement or production release.

Stackup, Fabrication, and PCBA Controls

S1170 improves the material foundation, but board reliability still depends on how the construction is manufactured and assembled. The production documentation needs to define layer count, copper balance, prepreg use, dielectric thickness, controlled impedance, hole structure, plating, solder mask, surface finish, and assembly exposure.

Stackup control
Define S1170 core / prepreg use, dielectric thickness, resin demand, copper weight, finished thickness, and impedance targets.

Thermal reliability
Review soldering exposure, rework limit, T260 / T288 requirements, PTH reliability, and microsection inspection where required.

CAF and moisture risk
Combine S1170 anti-CAF behavior with spacing rules, cleanliness, humidity exposure, voltage stress, and coating decisions.

PCBA execution
Plan SMT assembly, through-hole soldering, selective soldering, AOI, X-ray, functional test, programming, and packaging.

Typical applications of Shengyi S1170 PCB material

High-count layer PCBs

Communication equipment

Routers and networking hardware

Industrial controllers

Precise apparatus and instruments

Power supplies

Automotive electronics

Medical electronics

Test and measurement equipment

Server control boards

Lead-free multilayer products

Long-life embedded electronics

Request a Shengyi S1170 PCB Quote

Quotation, FAQ, and Reliability Review

A Shengyi S1170 quote is most accurate when the material requirement, stackup, inspection scope, assembly process, and documentation are included together. The production file needs to show whether the order is a prototype, qualification build, or repeat-production run.

RFQ data for S1170 PCB manufacturing

Gerber, ODB++, or IPC-2581 production files.
Fabrication drawing with Shengyi S1170 material callout and approved alternate-material rules.
Stackup documentation with core, prepreg, dielectric thickness, copper weight, and finished thickness.
Controlled impedance table, coupon requirement, and testing requirement where applicable.
Hole structure, aspect ratio, via plugging / filling notes, microsection needs, and reliability requirements.
Surface finish, solder mask, silkscreen, marking, panelization, and packaging requirements.
BOM, pick-and-place file, assembly drawing, test procedure, programming data, and inspection requirements for PCBA orders.

Is Shengyi S1170 a high-Tg FR-4 material?

Yes. Public S1170 data describes it as a high-Tg FR-4 material with a 170°C minimum Tg by DSC and a typical value around 175°C.

Is Shengyi S1170 halogen-free?

Do not assume S1170 is halogen-free. S1170 and S1170G are different material callouts, and halogen-free status needs verification against the exact Shengyi data sheet and customer specification.

Can S1170 replace S1000-2M?

Not automatically. S1170 and S1000-2M belong to different Shengyi material positions. Replacement depends on customer approval, Tg / Td / CTE / CAF targets, stackup, qualification record, and material availability.

Is S1170 suitable for HDI PCB?

S1170 can be reviewed for HDI designs when the stackup, dielectric thickness, prepreg construction, laser via structure, copper distribution, sequential lamination, and reliability targets are defined.

Does S1170 support sequential lamination?

Sequential lamination depends on the approved construction, resin flow, thermal history, copper distribution, and via structure. The material name alone does not define the allowed lamination cycles.

How should S1170 be specified on a fabrication drawing?

Specify “Shengyi S1170” clearly, with the stackup, laminate / prepreg requirements, copper weight, finished thickness, controlled impedance, applicable IPC or customer specification, compliance documents, and approved alternate rules.

What files are required for an S1170 PCBA quote?

For turnkey PCBA, include Gerber or ODB++ data, fabrication drawing, stackup, BOM, pick-and-place file, assembly drawing, test requirements, programming instructions, and shipment packaging notes.

Request a Shengyi S1170 PCB Reliability Review

Highleap Electronics supports Shengyi S1170 PCB material projects from prototype fabrication to repeat PCBA production. Submit your Gerber or ODB++ files, stackup, material callout, fabrication drawing, expected quantity, and assembly files through the Highleap quick quote form.

Engineering feedback before production helps confirm S1170 material availability, stackup feasibility, impedance targets, lead-free assembly margin, reliability documentation, and long-term production consistency.