Complete PCB DFM Checklist for Manufacturing Success

Table of Contents

1. Copper Features Checklist
2. Holes and Vias Checklist
3. Solder Mask Checklist
4. Silkscreen Checklist
5. Panelization Checklist
6. Assembly-Ready Checklist

At Highleap Electronics, we use this checklist internally during our free DFM review process. We’re sharing it to help designers catch issues early and submit production-ready designs.

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1. Copper Features Checklist

Copper features must meet minimum manufacturing capabilities while maintaining electrical performance.

1.1 Trace Width and Spacing

Check Item	Standard Capability	Advanced
Minimum trace width	4 mil (0.1mm)	3 mil (0.075mm)
Minimum spacing	4 mil (0.1mm)	3 mil (0.075mm)
Trace-to-edge clearance	0.25mm minimum	0.2mm with care
Trace-to-hole clearance	0.2mm minimum	0.15mm

☐ Verify minimum trace width meets capability
☐ Verify minimum spacing between traces
☐ Check trace-to-board-edge clearance
☐ Confirm no acid traps (acute angles below 45 degrees)
☐ Verify copper balance between layers

1.2 Copper Weight Considerations

☐ Copper weight specified for each layer
☐ Trace width adjusted for copper weight:

• 1oz copper: standard minimums apply
• 2oz copper: increase minimums by 50%
• 3oz+ copper: contact manufacturer for guidance

☐ Current capacity verified for trace widths
☐ Thermal relief specified for plane connections

1.3 Plane Layers

☐ Plane clearances adequate around holes
☐ Plane-to-edge clearance specified
☐ Thermal relief spoke width appropriate (minimum 8 mil)
☐ Split planes have adequate separation (10 mil minimum)
☐ Isolated copper regions connected or removed

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2. Holes and Vias Checklist

Holes and vias require careful specification for reliable manufacturing.

2.1 Through-Hole Specifications

Check Item	Standard	Advanced
Minimum drill size	0.25mm (10 mil)	0.15mm (6 mil)
Maximum aspect ratio	10:1	12:1 to 15:1
Minimum annular ring	0.15mm (6 mil)	0.1mm (4 mil)
Hole-to-hole spacing	0.25mm minimum	0.2mm

☐ Minimum drill size meets capability
☐ Aspect ratio within limits for board thickness
☐ Annular ring adequate on all layers
☐ Hole-to-hole spacing verified
☐ Hole-to-trace spacing verified

2.2 Via Types and Requirements

☐ Via type specified (through, blind, buried, microvia)
☐ Blind/buried via span clearly indicated
☐ Microvia requirements defined:

• Laser drill diameter (typically 0.1mm)
• Target pad size (typically 0.25mm)
• Capture pad size (typically 0.35mm)

☐ Via fill requirements specified (if needed)
☐ Via-in-pad requirements defined

2.3 PTH Component Holes

☐ Hole size appropriate for component leads
☐ Hole tolerance specified
☐ NPTH (non-plated) holes clearly marked
☐ Slot dimensions and tolerance specified
☐ Press-fit holes identified with requirements

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3. Solder Mask Checklist

Solder mask protects copper and defines solderable areas. Proper mask design prevents solder bridging, ensures reliable joints, and protects traces from environmental damage.

Get Free DFM Check

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4. Silkscreen Checklist

Silkscreen (legend) provides assembly guidance and product identification.

4.1 Text and Graphics

☐ Minimum line width: 5 mil (0.125mm)
☐ Minimum text height: 32 mil (0.8mm) for readability
☐ Text not placed on pads or solderable areas
☐ Text clearance from pads: 6 mil (0.15mm) minimum
☐ Reference designators present and readable

4.2 Polarity and Orientation Markings

☐ Pin 1 indicators present for ICs
☐ Polarity marks for diodes and capacitors
☐ Connector orientation indicated
☐ Component outlines accurate

4.3 Production Information

☐ Board name/part number included
☐ Revision marking present
☐ Date code location defined (if required)
☐ Logo and branding placed correctly
☐ Compliance marks positioned (CE, UL, etc.)

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5. Panelization Checklist

Panel design affects manufacturing efficiency and assembly handling. See detailed panelization requirements for SMT.

5.1 Panel Configuration

☐ Panel size within manufacturing limits (typically 460×610mm max)
☐ Board spacing adequate for routing (2-3mm typical)
☐ Rail width sufficient for handling (5mm minimum)
☐ Panel orientation optimizes material usage

5.2 Depaneling Method

☐ Tab routing or V-score specified
☐ Tab locations do not interfere with components
☐ V-score depth specified (typically 1/3 board thickness per side)
☐ Breakout tabs sized appropriately:

• Standard: 3-5mm wide, 0.3mm thick web
• Mouse bites: 0.5mm holes, 5-8 per tab

5.3 Panel Features

☐ Global fiducials present (minimum 3 per panel)
☐ Tooling holes in rails
☐ Bad board marking location defined
☐ Panel identification included

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6. Assembly-Ready Checklist

For complete PCBA orders, verify assembly-specific requirements. See our complete PCB assembly design rules.

6.1 Component Placement

☐ Component-to-component spacing adequate (0.5mm minimum)
☐ Component-to-board-edge clearance (2mm for rails)
☐ No components under other components
☐ Tall components do not shadow small ones
☐ Through-hole and SMT on opposite sides reviewed

6.2 Pad Design

☐ Pad sizes match component specifications
☐ Thermal pads designed per manufacturer guidelines
☐ QFN/BGA thermal vias adequate
☐ Stencil aperture ratio appropriate (see stencil aperture design guideline)

6.3 Fiducials

☐ Global fiducials: minimum 3 per board/panel
☐ Local fiducials for fine-pitch components (0.5mm pitch and below)
☐ Fiducial size: 1mm diameter typical
☐ Fiducial clearance: 2mm solder mask opening

6.4 Test Points

☐ Test points accessible for ICT/flying probe
☐ Test point size: 1mm minimum diameter
☐ Test point pitch: 2.54mm for standard fixtures
☐ Critical nets have test access

See DFT for PCB for complete testability guidelines.

6.5 Data Files

☐ Pick and place file generated and verified
☐ Centroid file coordinates accurate
☐ BOM complete with manufacturer part numbers
☐ Assembly drawing clear and complete
☐ All files at same revision level

See PCB assembly file requirements for complete data specifications.

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Download and Customize

This checklist provides a comprehensive starting point. Customize it based on your specific requirements, design complexity, and manufacturing partner capabilities.

For free DFM review using this checklist, submit your design files to Highleap Electronics. Our engineering team will provide a detailed DFM report identifying any issues against these requirements.